485L-01

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN24, 4x4, 0.5P
CASE 485L
ISSUE B
1 24
SCALE 2:1
D
PIN 1
REFEENCE
2X
0.15 C
2X
ÏÏÏ
ÏÏÏ
ÏÏÏ
0.15 C
L
A
B
ALTERNATE
CONSTRUCTIONS
ÏÏÏ
ÏÏ
ÎÎÎ ÏÏ
ÏÏÏ
ÎÎ
EXPOSED Cu
DETAIL B
MOLD CMPD
A1
DETAIL B
A
A3
ALTERNATE TERMINAL
CONSTRUCTIONS
C
A1
SIDE VIEW
SEATING
PLANE
L
24X
7
E2
1
24
19
24X
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT
4.30
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
24X
0.55
2.90
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
4.00 BSC
2.70
2.90
4.00 BSC
2.70
2.90
0.50 BSC
0.30
0.50
0.05
0.15
XXXXX = Specific Device Code
A
= Assembly Location
L
= Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
b
0.10 C A B
BOTTOM VIEW
DIM
A
A1
A3
b
D
D2
E
E2
e
L
L1
XXXXX
XXXXX
ALYWG
G
13
e
e/2
A3
GENERIC
MARKING DIAGRAM*
D2
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD
AS WELL AS THE TERMINALS.
DETAIL A
E
0.10 C
NOTE 4
L
L1
TOP VIEW
0.08 C
DATE 05 JUN 2012
1
4.30
2.90
0.50
PITCH
24X
0.32
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON11783D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN24, 4X4, 0.5P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
http://onsemi.com
1
DOCUMENT NUMBER:
98AON11783D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION.
24 JUL 2002
A
CHANGED DIMENSIONS B AND L. ADDED GENERIC MARKING INFORMATION.
REQ. BY J. LETTERMAN.
29 JUL 2008
B
ADDED DETAILS A & B AND MOUNTING FOOTPRINT. REQ. BY J. LIU.
05 JUN 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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© Semiconductor Components Industries, LLC, 2012
June, 2012 − Rev. B
Case Outline Number:
485L
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