940AB

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SSOP36 EP
CASE 940AB
ISSUE A
DATE 19 JAN 2016
SCALE 1:1
0.20 C A-B
D
DETAIL B
A
36
X
19
X = A or B
E1
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN 1
REFERENCE
1
e/2
E
DETAIL B
36X
0.25 C
18
e
36X
B
b
0.25
M
T A
S
B
S
NOTE 6
TOP VIEW
A
H
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.13 TOTAL IN
EXCESS OF THE b DIMENSION AT MMC.
4. DIMENSION b SHALL BE MEASURED BETWEEN 0.10 AND 0.25 FROM THE TIP.
5. DIMENSIONS D AND E1 DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS OR GATE
BURRS. DIMENSIONS D AND E1 SHALL BE
DETERMINED AT DATUM H.
6. THIS CHAMFER FEATURE IS OPTIONAL. IF
IT IS NOT PRESENT, A PIN ONE IDENTIFIER
MUST BE LOACATED WITHIN THE INDICATED AREA.
D
4X
h
A2
DETAIL A
c
h
0.10 C
36X
A1
SIDE VIEW
SEATING
PLANE
C
END VIEW
D2
M1
DIM
A
A1
A2
b
c
D
D2
E
E1
E2
e
h
L
L2
M
M1
MILLIMETERS
MIN
MAX
--2.65
--0.10
2.15
2.60
0.18
0.30
0.23
0.32
10.30 BSC
5.70
5.90
10.30 BSC
7.50 BSC
3.90
4.10
0.50 BSC
0.25
0.75
0.50
0.90
0.25 BSC
0_
8_
5_
15 _
GENERIC
MARKING DIAGRAM*
M
GAUGE
PLANE
E2
L2
C
SEATING
PLANE
36X
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
L
DETAIL A
BOTTOM VIEW
SOLDERING FOOTPRINT
5.90
36X
1.06
4.10
10.76
XXXX
A
WL
YY
WW
G
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
1
0.50
PITCH
36X
0.36
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
STATUS:
98AON46215E
ON SEMICONDUCTOR STANDARD
1
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
http://onsemi.com
SSOP36 EXPOSED PAD
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON46215E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY J. LETTERMAN.
05 NOV 2009
A
MODIFIED DIMENSION A2 MIN VALUE AND DIMENSION B MAX VALUE. REQ.
BY B. MARQUIS.
19 JAN 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2016
January, 2016 − Rev. A
Case Outline Number:
940AB
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