751AG

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOIC 16 LEAD WIDE BODY, EXPOSED PAD
CASE 751AG
ISSUE B
DATE 31 MAY 2016
SCALE 1:1
−U−
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL
BE 0.13 (0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
A
M
16
9
P
0.25 (0.010)
M
W
B
1
M
R x 45_
8
−W−
G 14
TOP VIEW
PIN 1 I.D.
PL
DETAIL E
C
F
−T−
0.10 (0.004) T
K
D 16 PL
0.25 (0.010)
T U
M
SEATING
PLANE
W
S
S
J
SIDE VIEW
DETAIL E
H
EXPOSED PAD
1
DIM
A
B
C
D
F
G
H
J
K
L
M
P
R
MILLIMETERS
MIN
MAX
10.15
10.45
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
3.45
3.66
0.25
0.32
0.00
0.10
4.72
4.93
0_
7_
10.05
10.55
0.25
0.75
INCHES
MIN
MAX
0.400
0.411
0.292
0.299
0.093
0.104
0.014
0.019
0.020
0.035
0.050 BSC
0.136
0.144
0.010
0.012
0.000
0.004
0.186
0.194
0_
7_
0.395
0.415
0.010
0.029
GENERIC
MARKING DIAGRAM*
8
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
AWLYYWWG
L
16
9
BOTTOM VIEW
SOLDERING FOOTPRINT*
0.350
Exposed
Pad
0.175
0.050
CL
0.200
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.188
CL
XXXXX
A
WL
YY
WW
G
0.376
0.074
0.024
0.150
DIMENSIONS: INCHES
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON21237D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
SOIC−16, WB EXPOSED PAD 1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21237D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY P. CELAYA.
26 JUL 2005
A
CHANGED VALUES OF EXPOSED PAD; DIMS H & L. CHANGED EXPOSED PAD
VALUE IN SOLDER FOOTPRINT FROM 0.145 TO 0.150. REQ. BY B. FONTES.
11 MAR 2008
B
CORRECTED DIMENSION D LABELS IN SIDE VIEW. REQ. BY J. LETTERMAN.
31 MAY 2016
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. B
Case Outline Number:
751AG
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