Data Sheet

TFA9887
Audio system with adaptive sound maximizer and speaker
protection
Rev. 1 — 11 July 2012
Product short data sheet
1. General description
The TFA9887 is an audio system consisting of a high efficiency class-D audio amplifier,
and embedded DSP with a sophisticated speaker-boost and protection algorithm and an
intelligent DC-to-DC converter. It can safely deliver 2.65 W (RMS; THD = 1 %) output
power into a 4  speaker that is nominally only rated for 0.5 W. The integrated intelligent
DC-to-DC converter allows the system to deliver this power from a battery voltage of
3.6 V. The audio input interface is I2S and the control settings are communicated via an
I2C-bus interface.
The TFA9887 guarantees safe speaker operation under all operating conditions. It
maximizes acoustic output while ensuring diaphragm displacement and voice coil
temperature do not exceed rated limits. The processing is capable of providing a
significant improvement in sound volume and quality, while also ensuring reliable
operation. This function is based on and adaptive model that operates in all loudspeaker
environments (e.g. free air, closed box or vented box). Furthermore, advanced signal
processing ensures the quality of the audio signal is always optimized.
Adaptive DC-to-DC conversion boosts the supply voltage only when necessary (when the
output signal level is high). This maximizes the output power of the class-D audio amplifier
while limiting quiescent power consumption. The TFA9887 also adapts the amplifier gain
to limit battery current when the battery voltage is low.
The device features low RF susceptibility because it has a digital input interface that is
insensitive to clock jitter. The second order closed loop architecture used in a class-D
audio amplifier provides excellent audio performance and high supply voltage ripple
rejection.
The TFA9887 is available in a 29-bump WLCSP (Wafer Level Chip-Size Package) with a
400 m pitch.
2. Features and benefits
 Sophisticated speaker-boost and protection algorithm that maximizes speaker
performance while protecting the speaker:
 Fully embedded software, no additional license fee or porting required.
 Total integrated solution that includes DSP, amplifier, DC-to-DC, sensing and more.
 Adaptive excursion control - guarantees that the speaker membrane excursion never
exceeds its rated limit
 Real-time temperature protection - direct measurement ensures that voice coil
temperature never exceeds its rated limit
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
 Environmentally aware - automatically adapts speaker parameters to acoustic and
thermal changes including compensation for speaker-box leakage
 Output power: 2.65 W (RMS) into 4  at 3.6 V supply voltage (THD = 1 %)
 Clip avoidance - DSP algorithm prevents clipping even with sagging supply voltage
 Bandwidth extension option to increase low frequency response
 Intelligent DC-to-DC converter maximizes audio headroom from any supply level and
limits current consumption at low battery voltages
 Compatible with standard Acoustic Echo Cancellers (AECs)
 High efficiency and low-power dissipation
 High efficiency and low-power dissipation
 Wide supply voltage range (fully operational from 2.5 V to 5.5 V)
 Two I2S inputs to support two audio sources
 I2C-bus control interface (400 kHz)
 Dedicated speech mode with speech activity detector
 Speaker current and voltage monitoring (via the I2S-bus) for Acoustic Echo
Cancellation (AEC) at the host
 Fully short-circuit proof across the load and to the supply lines
 Sample frequencies from 8 kHz to 48 kHz supported
 3 bit clock/word select ratios supported (32x, 48x, 64x)
 Option to route I2S input direct to I2S output to allow a second I2S output slave device
to be used in combination with the TFA9887
 TDM interface supported
 Volume control
 Low RF susceptibility
 Input clock jitter insensitive interface
 Thermally protected
 ‘Pop noise' free at all mode transitions
3. Applications






TFA9887_SDS
Product short data sheet
Mobile phones
Tablets
Ultrabooks and Notebooks
Portable gaming devices
Portable Navigation Devices (PND)
MP3 players and portable media players
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
2 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
4. Quick reference data
Table 1.
Quick reference data
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in DC-to-DC converter coil;
operating modes with load; DC-to-DC
converter in Adaptive boost mode
-
1.55
-
mA
on pin VBAT and in DC-to-DC converter coil;
Power-down mode
-
-
1
A
on pin VDDD; operating modes;
speaker-boost and protection activated
-
20
-
mA
on pin VDDD; operating modes; CoolFlux
DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 = WS2 =
DATAI2 = DATAI3 = 0 V
-
10
-
A
RL = 4 ; fs = 48 kHz
-
2.55
-
W
RL = 4 ; fs = 32 kHz
-
2.65
-
W
RL = 8 ; fs = 48 kHz
-
1.5
-
W
RL = 8 ; fs = 32 kHz
-
1.65
-
W
digital supply current
IDDD
RMS output power
Po(RMS)
CLIP = 00
5. Ordering information
Table 2.
Ordering information
Type number
TFA9887UK
Package
Name
Description
Version
WLCSP29
wafer level chip-size package; 29 bumps; 3.19  2.07  mm
TFA9887
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
3 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
6. Block diagram
VDDD
ADS1
ADS2
VBAT
INB
E3
A5
A6
E5
E7
TFA9887
SCL D2
RAM/ROM
MEMORY
I2C
INTERFACE
SDA E2
ADAPTIVE
DC-to-DC
CONVERTER
E6
BST
D7
GNDB
B6
VDDP
C7
OUTA
A7
OUTB
B7
GNDP
DATAI3 A4
REGISTERS
DATAI1 A3
R 1/2
WS1 B2
I2S
DATAI2 A1
L 1/2
INPUT
INTERFACE
(x2)
BCK1 C2
M
U
X
SPEAKER
PROTECTION
ALGORITHM
AND VOLUME
CONTOL
(CoolFlux DSP)
R3
M
U
X
L3
gain
CHS3
WS2 B1
CLIPPER
DSP
out
PWM
CLASS-D
AUDIO
AMPLIFIER
HPF
Isense
gain
without pilot tone
BCK2 C1
DATAO A2
I2S
OUTPUT
INTERFACE
M
U
X
current sensing
CURRENTSENSING
PROCESSOR
ADC
I2SDOC
TEMP SENSE
M
U
X
PLL
VBAT SENSE
PROTECTION:
OTP
OVP
UVP
OCP
IDP
IPLL
Fig 1.
E4
C6
D6
B4
C4
D4
D1, E1
GNDD
TEST1
TEST2
TEST3
TEST4
TEST5
n.c.
010aaa719
Block diagram
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
4 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
7. Pinning information
7.1 Pinning
1
2
3
4
5
6
bump A1
index area
7
E
2
3
4
5
6
7
A
D
B
C
C
B
D
A
E
bump A1
index area
010aaa734
010aaa735
a. Bottom view
Fig 2.
1
b. Transparent top view
Bump configuration
1
2
A
DATAI2
DATAO
B
WS2
WS1
C
BCK2
D
E
3
4
5
6
7
ADS1
ADS2
OUTB
TEST3
VDDP
GNDP
BCK1
TEST4
TEST1
OUTA
n.c.
SCL
TEST5
TEST2
GNDB
n.c.
SDA
DATAI1 DATAI3
VDDD
GNDD
VBAT
BST
INB
010aaa736
Transparent top view
Fig 3.
TFA9887_SDS
Product short data sheet
Bump mapping
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
5 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
Table 3.
Pinning
Symbol
Pin
Type
Description
DATAI2
A1
I
digital audio data input 2
DATAO
A2
O
digital audio data output
DATAI1
A3
I
digital audio data input 1
DATAI3
A4
I
digital audio data input 3
ADS1
A5
I
address select input 1
ADS2
A6
I
address select input 2
OUTB
A7
O
inverting output
WS2
B1
I
digital audio word select input 2
WS1
B2
I
digital audio word select input 1
I
test signal input 3; for test purposes only, connect to PCB ground
B6
P
power supply voltage
GNDP
B7
P
power ground
BCK2
C1
I
digital audio bit clock input 2
BCK1
C2
I
digital audio bit clock input 1
O
test signal input 4; for test purposes only, connect to PCB ground
B3
TEST3
B4
B5
VDDP
C3
TEST4
C4
C5
TEST1
C6
I
test signal input 1; for test purposes only, connect to BST
OUTA
C7
O
non-inverting output
n.c.
D1
-
not connected; connect to D2 or to PCB ground
SCL
D2
I
I2C-bus clock input
I
test signal input 5; for test purposes only, connect to PCB ground
D3
TEST5
D4
D5
TFA9887_SDS
Product short data sheet
TEST2
D6
I
test signal input 2; for test purposes only, connect to BST
GNDB
D7
P
boosted ground
n.c.
E1
-
not connected; connect to E2 or to PCB ground
SDA
E2
I/O
I2C-bus data input/output
VDDD
E3
P
digital supply voltage
GNDD
E4
P
digital ground
VBAT
E5
I
battery supply voltage sense input
VBST
E6
O
boosted supply voltage output
INB
E7
P
DC-to-DC boost converter input
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
6 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
8. Functional description
The TFA9887 is a highly efficient mono Bridge Tied Load (BTL) class-D audio amplifier
with a sophisticated speaker-boost protection algorithm. Figure 1 is a block diagram of the
TFA9887.
The device contains three I2S input interfaces and one I2S output interface. One of I2S
inputs DATAI1 and DATAI2 can be selected as the audio input stream. The third I2S input,
DATAI3, is provided to support stereo applications and the I2S pass-through option. The
pass-through option is provided to allow an I2S output slave device (for example, a
CODEC), connected in parallel with the TFA9887, to be routed directly to the audio host
via the I2S output.
The I2S output signal on DATAO can be configured to transmit the DSP output signal,
amplifier output current information, DATAI3 Left or Right signal information or amplifier
gain information. The gain information can be used to facilitate communication between
two devices in stereo applications.
The speaker-boost protection algorithm, running on a CoolFlux Digital Signal Processor
(DSP) core, maximizes the acoustical output of the speaker while limiting membrane
excursion and voice coil temperature to a safe level. The mechanical protection
implemented guarantees that speaker membrane excursion never exceeds its rated limit,
to an accuracy of 10 %. Thermal protection guarantees that the voice coil temperature
never exceeds its rated limit, to an accuracy of 10 C. Furthermore, advanced signal
processing ensures the audio quality remains acceptable at all times.
The speaker-boost protection algorithm boosts the output sound pressure level within
given mechanical, thermal and quality limits. An optional Bandwidth extension mode
extends the low frequency response up to a predefined limit before maximizing the output
level. This mode is suitable for listening to high-quality music in quiet environments.
The frequency response of the TFA9887 can be modified via ten fully programmable
cascaded second-order biquad filters. The first two biquads are processed with 48-bit
double precision; biquads 3 to 8 are processed with 24-bit single precision.
At low battery voltage levels, the gain is automatically reduced to limit battery current.
The output volume can be controlled by the speaker-boost protection algorithm or by the
host application (external). In the latter case, the boost features of the speaker-boost
protection algorithm must be disabled to avoid neutralizing external volume control.
The speaker-boost protection algorithm output is converted into two pulse width
modulated (PWM) signals which are then injected into the class-D audio amplifier. The
3-level PWM scheme supports filterless speaker drive.
The adaptive DC-to-DC converter boosts the battery supply voltage in line with the output
of the speaker-boost protection algorithm. It switches to Follower mode (VBST = VBAT; no
boost) when the audio output voltage is lower than the battery voltage.
8.1 Protection mechanisms
The following protection circuits are included in the TFA9887:
• OverTemperature Protection (OTP)
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
7 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
•
•
•
•
OverVoltage Protection (OVP)
UnderVoltage Protection (UVP)
OverCurrent Protection (OCP)
Invalid Data Protection (IDP)
The reaction of the device to fault conditions differs depending on the protection circuit
involved.
8.1.1 OverTemperature Protection (OTP)
OTP prevents heat damage to the TFA9887. It is triggered when the junction temperature
exceeds Tact(th_prot). When this happens, the output stages are set floating. OTP is cleared
automatically via an internal timer (approximately 200 ms), after which the output stages
will start to operate normally again.
8.1.2 Supply voltage protection (UVP and OVP)
UVP is activated, setting the outputs floating, if VBAT drops below the undervoltage
protection threshold, VP(uvp). When the supply voltage rises above VP(uvp) again, the
system will be restarted after approximately 200 ms.
OVP is activated, setting the power stages floating, if the power supply voltage (VDDP)
rises above the overvoltage protection threshold, VP(ovp). The power stages are
re-enabled as soon as the supply voltage drops below VP(ovp) again. The system will be
restarted after approximately 200 ms.
8.1.3 OverCurrent Protection (OCP)
OCP will detect a short circuit across the load or between one of the amplifier outputs and
one of the supply lines. If the output current exceeds the overcurrent protection threshold
(IO(ocp)), it will be limited to IO(ocp) while the amplifier outputs are switching (the amplifier is
not powered down completely). This is called current limiting. The amplifier can
distinguish between an impedance drop at the loudspeaker and a low-ohmic short circuit
across the load or to one of the supply lines. The impedance threshold depends on which
supply voltage is being used:
8.1.4 Invalid Data Protection (IDP)
IDP checks if the word select signal is correctly connected to the TFA9887. It the bit
clock/word select (BCK-to-WS) ratio is not stable, the IDP alarm is raised and the
TFA9887 powers down.The TFA9887 starts up again automatically when the BCK-to-WS
ratio stabilizes.
8.2 Battery supply voltage monitor
The voltage level at the battery connected to the TFA9887 can be monitored via the
I2C-bus. Status bits BATS in the Battery status register.
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
8 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
9. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VBAT
battery supply voltage
on pin VBAT
0.3
+5.5
V
VDDP
power supply voltage
on pin VDDP
0.3
+5.5
V
VDDD
digital supply voltage
on pin VDDD
0.3
+1.95
V
Tj
junction temperature
-
+150
C
Tstg
storage temperature
55
+150
C
Tamb
ambient temperature
VESD
electrostatic discharge voltage
40
+85
C
according to Human Body Model (HBM)
2
+2
kV
according to Charge Device Model (CDM)
500
+500
V
10. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
Rth(j-a)
thermal resistance from junction to ambient
in free air; natural convection
-
4-layer application board
60
Unit
K/W
11. Characteristics
11.1 DC Characteristics
Table 6.
DC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VBAT
battery supply voltage
on pin VBAT
2.5
-
5.5
V
VDDP
power supply voltage
on pin VDDP
2.5
-
5.5
V
VDDD
digital supply voltage
on pin VDDD
1.65
1.8
1.95
V
IBAT
battery supply current
on pin VBAT and in the DC-to-DC converter
coil; operating modes with load; DC-to-DC
converter in Adaptive boost mode
-
1.55 -
mA
on pin VBAT and in the DC-to-DC converter
coil; Power-down mode
-
-
1
A
on pin VDDD; operating modes;
speaker-boost protection activated
-
20
-
mA
on pin VDDD; operating modes; CoolFlux
DSP bypassed
-
4.8
-
mA
on pin VDDD; Power-down mode;
BCK1 = WS1 = DATAI1 = BCK2 = WS2 =
DATAI2 = DATAI3 = 0 V
-
10
-
A
3.6
V
IDDD
digital supply current
Pins BCK1, WS1, DATA1, BCK2, WS2, DATAI2, DATAI3, ADS1, ADS2, SCL, SDA
VIH
HIGH-level input voltage
TFA9887_SDS
Product short data sheet
0.7VDDD All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
9 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
Table 6.
DC characteristics …continued
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
VIL
LOW-level input voltage
Cin
input capacitance
ILI
input leakage current
Conditions
Min
Typ
Max
Unit
-
-
0.3VDDD
V
-
-
3
pF
1.8 V on input pin
-
-
0.1
A
Pins DATAO, SDA
VOH
HIGH-level output voltage
IOH = 4 mA
-
-
VDDD 
0.4
V
VOL
LOW-level output voltage
IOL = 4 mA
-
-
400
mV
VDDP = 5.3 V
-
100
-
m
130
-
150
C
Pins OUTA, OUTB
RDSon
drain-source on-state
resistance
Protection
Tact(th_prot)
thermal protection activation
temperature
VP(ovp)
overvoltage protection supply
voltage
protection on VDDP
5.5
-
6.0
V
VP(uvp)
undervoltage protection supply protection on VBAT
voltage
2.3
-
2.5
V
IO(ocp)
overcurrent protection output
current
1.45
-
-
A
5.25
5.3
5.35
V
DC-to-DC converter
VBST
[1]
voltage on pin BST
DCVO = 111; Boost mode
LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker).
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
10 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
11.2 AC characteristics
Table 7.
AC characteristics
All parameters are guaranteed for VBAT = 3.6 V; VDDD = 1.8 V; VDDP = VBST = 5.3 V; LBST = 1 H[1]; RL = 4 [1]; LL = 20 H[1];
fi = 1 kHz; fs = 48 kHz; Tamb = 25 C; default settings, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
RL = 4 ; fs = 48 kHz
-
2.55
-
W
RL = 4 ; fs = 32 kHz
-
2.65
-
W
Amplifier output power
Po(RMS)
RMS output power
THD+N = 1 %; CLIP = 00
RL = 8 ; fs = 48 kHz
-
1.5
-
W
RL = 8 ; fs = 32 kHz
-
1.65
-
W
RL = 4 ; fs = 48 kHz
-
3.75
-
W
RL = 4 ; fs = 32 kHz
-
3.75
-
W
RL = 8 ; fs = 48 kHz
-
2
-
W
RL = 8 ; fs = 32 kHz
-
2
-
W
-
-
1
mV
-
0.03
0.1
%
CoolFlux DSP bypassed
-
31
-
V
CoolFlux DSP enabled
-
45
-
V
CoolFlux DSP bypassed
-
100
-
dB
CoolFlux DSP enabled
-
97
-
dB
-
90
-
dB
-
-
2
ms
-
-
6
ms
THD+N = 10 %; CLIP = 00
Amplifier output; pins OUTA and OUTB
VO(offset)
output offset voltage
absolute value
Amplifier performance
THD+N
total harmonic distortion-plus-noise Po(RMS) = 100 mW; RL = 8 ; LL = 44 H
Vn(o)
output noise voltage
S/N
signal-to-noise ratio
PSRR
power supply rejection ratio
A-weighted; DATAI1 = DATAI2 = 0 V
VO = 4.5 V (peak); A-weighted
Vripple = 200 mV (RMS); fripple = 217 Hz
Amplifier power-up, power-down and propagation delays
td(on)
turn-on delay time
PLL locked on BCK (IPLL = 0)
fs = 8 kHz to 48 kHz
PLL locked on WS (IPLL = 1)
fs = 48 kHz
td(off)
turn-off delay time
-
-
10
s
td(mute_off)
mute off delay time
-
1
-
ms
td(soft_mute)
soft mute delay time
-
1
-
ms
[1]
LBST = boot converter inductance; RL = load resistance; LL = load inductance (speaker).
TFA9887_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
11 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
12. Application information
12.1 Application diagram
1.8 V
battery
SDA
I2C
E3
E5
C6
VDDP
BASEBAND
PROCESSOR
TEST2
100 nF
VBAT
VDDD
CVDDD
TEST1
LBST
D6
SCL
22 μF
B6
E6
E1
E7
n.c.
CVBAT
10 μF
CVDDP
E2
1 μH
BST
INB
D2
n.c.
D1
BCK2
DATAI3
OUTB
speaker
4 Ω, 6 Ω or 8 Ω
A2
A1
B1
C1
A4
ADS2
ADS1
A5 A6
D7
B7
E4
B4
C4
D4
TEST5
WS2
A7
TEST4
DATAI2
TFA9887
C2
TEST3
DATAO
OUTA
B2
GNDD
BCK1
GNDP
WS1
I2S
C7
A3
GNDB
DATAI1
010aaa723
Fig 4.
TFA9887_SDS
Product short data sheet
Typical mono application (simplified)
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
12 of 20
TFA9887
NXP Semiconductors
Audio system with adaptive sound maximizer and speaker protection
13. Package outline
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Fig 5.
Package outline TFA9887 (WLCSP29)
TFA9887_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
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14. Soldering of WLCSP packages
14.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
14.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
14.3 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 6) than a PbSn process, thus
reducing the process window
• Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic) while being low enough that the packages and/or boards are not
damaged. The peak temperature of the package depends on package thickness and
volume and is classified in accordance with Table 8.
Table 8.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 6.
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
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maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 6.
Temperature profiles for large and small components
For further information on temperature profiles, refer to application note AN10365
“Surface mount reflow soldering description”.
14.3.1 Stand off
The stand off between the substrate and the chip is determined by:
• The amount of printed solder on the substrate
• The size of the solder land on the substrate
• The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
14.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
14.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
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Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed from the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the solder lands. Apply flux on the bumps at the chip side as
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
14.3.4 Cleaning
Cleaning can be done after reflow soldering.
TFA9887_SDS
Product short data sheet
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Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
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15. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TFA9887_SDS v.1
20120711
Product short data sheet
-
-
TFA9887_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
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© NXP B.V. 2012. All rights reserved.
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16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TFA9887_SDS
Product short data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
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Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I2C-bus — logo is a trademark of NXP B.V.
CoolFlux — is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TFA9887_SDS
Product short data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 11 July 2012
© NXP B.V. 2012. All rights reserved.
19 of 20
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18. Contents
1
2
3
4
5
6
7
7.1
8
8.1
8.1.1
8.1.2
8.1.3
8.1.4
8.2
9
10
11
11.1
11.2
12
12.1
13
14
14.1
14.2
14.3
14.3.1
14.3.2
14.3.3
14.3.4
15
16
16.1
16.2
16.3
16.4
17
18
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Quick reference data . . . . . . . . . . . . . . . . . . . . . 3
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Functional description . . . . . . . . . . . . . . . . . . . 7
Protection mechanisms . . . . . . . . . . . . . . . . . . 7
OverTemperature Protection (OTP) . . . . . . . . . 8
Supply voltage protection (UVP and OVP) . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 8
Invalid Data Protection (IDP) . . . . . . . . . . . . . . 8
Battery supply voltage monitor . . . . . . . . . . . . . 8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9
Thermal characteristics . . . . . . . . . . . . . . . . . . 9
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 9
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . 9
AC characteristics. . . . . . . . . . . . . . . . . . . . . . 11
Application information. . . . . . . . . . . . . . . . . . 12
Application diagram . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Soldering of WLCSP packages. . . . . . . . . . . . 14
Introduction to soldering WLCSP packages . . 14
Board mounting . . . . . . . . . . . . . . . . . . . . . . . 14
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 14
Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Quality of solder joint . . . . . . . . . . . . . . . . . . . 15
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 11 July 2012
Document identifier: TFA9887_SDS
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