PHILIPS TDA4860

INTEGRATED CIRCUITS
DATA SHEET
TDA4860
Vertical deflection power amplifier
for monitors
Product specification
Supersedes data of 1996 Nov 26
File under Integrated Circuits, IC02
1997 Oct 27
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
FEATURES
GENERAL DESCRIPTION
• Vertical pre-amplifier with differential inputs
The TDA4860 is a vertical power amplifier for differential
input signals suitable for colour monitor/TV systems with
deflection frequencies up to 160 Hz.
• Powerless vertical shift
• Flyback voltage generation suitable for two operating
modes (doubling the supply voltage or external supply
for the short flyback time, this achieves a minimum of
power dissipation)
• Vertical output stage with thermal and SOAR protection
• High deflection frequency up to 160 Hz
• High linear sawtooth signal amplification
• Possibility of guarding the deflection
• Voltage stabilizer.
QUICK REFERENCE DATA
Measurements referenced to substrate (pin 6).
SYMBOL
PARAMETER
MIN.
TYP.
MAX.
UNIT
VP1
supply voltage (pin 1)
9
−
30
V
VP2
supply voltage (pin 4)
9
−
60
V
VP3
flyback supply voltage (pin 8)
9
−
60
V
IP1
supply current (pin 1)
−
−
10
mA
IP2
supply quiescent current (pin 4)
−
9
−
mA
VI
input voltage (pins 2 and 3)
1.6
−
VP1 − 0.5 V
I5 M
deflection output current (maximum value; pin 5)
−
−
±1
A
Tamb
operating ambient temperature
−20
−
+75
°C
ORDERING INFORMATION
TYPE
NUMBER
TDA4860
1997 Oct 27
PACKAGE
NAME
SIL9MPF
DESCRIPTION
plastic single in-line medium power package with fin; 9 leads
2
VERSION
SOT110-1
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
BLOCK DIAGRAM
handbook, full pagewidth
TDA4860
VERTICAL
DRIVER
THERMAL AND
SOAR
PROTECTION
FLYBACK
DRIVER
DIFFERENTIAL
INPUT
AMPLIFIER
VERTICAL
OUTPUT
FLYBACK
GENERATOR
VOLTAGE
STABILIZER
1
2
VP1
3
BAX13
+8.8 V
4
5
6
7
8
VP2
V-OUT
SUB
FLB
VP3
9
PCO
5.6 Ω
470
µF
150 kΩ
270 Ω
1.8 kΩ
1 MΩ
470 µF
0.1 µF
1.8 kΩ
from TDA4850
PULSE
CIRCUIT
yoke
R1
1Ω
470 µF
VN
−8.1 V
4.3 Ω
10 kΩ
RPCO
+52 V
V-shift
Assumed values:
Iyoke = 1.42 A.
Ryoke = 4.17 Ω + 7% + ∆R(T) = 6.12 Ω.
Lyoke = 5.25 mH.
R1 = 1.0 Ω ±1%.
Tamb = 65 °C.
Tj(max) = 105 °C.
Tyoke = 75 °C.
Pyoke = 1.2 W.
PIC = 1.8 W.
Ptot = 3.0 W.
tp FLB = typically 250 µs.
Attention: the heatsink of the IC must be isolated against ground; the cooling fin is connected to pin 6.
Fig.1
Block diagram and application circuit with flyback supply voltage VP3 from an external source.
Deflection frequency range from 50 Hz to 100 Hz.
1997 Oct 27
3
MHA591
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
PINNING
SYMBOL
PIN
DESCRIPTION
handbook, halfpage
VP1
1
supply voltage 1
INP1
2
input 1 of differential input amplifier
INP2
3
input 2 of differential input amplifier
VP2
4
supply voltage 2 for vertical output
stage
V-OUT
5
vertical output
SUB
6
substrate
SUB 6
FLB
7
flyback generator output
FLB 7
VP3
8
flyback supply voltage 3
PCO
9
pulse circuit output
VP1 1
INP1 2
INP2 3
VP2 4
V-OUT 5
TDA4860
VP3 8
PCO 9
MHA593
Fig.2 Pin configuration.
FUNCTIONAL DESCRIPTION
Vertical output
Differential input amplifier
The vertical output stage is a quasi-complementary
class-B amplifier with a high linearity. The output contains
SOAR (short-circuit protection) and thermal protection.
The output current on pin 5 is reduced for a short time
(to let the temperature decrease to Tj < 150 °C), when the
junction temperature (Tj) exceeds 160 °C.
The differential sawtooth input signal (coming from a ramp
output of the TDA4850 for example) is fed to the input
pins 2 and 3. The non-inverted signal is attached to pin 3.
The vertical feedback signal is superimposed on the
inverted input signal on pin 2.
Vertical shift is applied at the inputs in a power-less way
(see Fig.1).
Deflection GUARD
Pin 9 will go HIGH if the junction temperature goes to high
(see Fig.3). A pulse signal with 50% duty cycle is output on
pin 9, if the deflection coil is open-circuit. A flyback pulse
signal is output at normal conditions.
Flyback generator
Signals for the flyback generator and the pulse circuit are
generated in the flyback driver stage. The flyback output
consists of a Darlington transistor and a flyback diode.
The flyback generator can operate in two modes:
Further watching can be achieved by means of an external
GUARD circuit as shown in Fig.4. The 22 µF capacitor is
charged during flyback time (V5 > V8) at normal conditions.
In case of failures, the capacitor is discharged and the
GUARD output goes HIGH.
1. An external supply voltage is applied for the short
flyback time, thus the power dissipation is minimum
(see Fig.1).
GUARD output level (see Fig.4):
2. The flyback voltage is generated by doubling the
supply voltage (see Fig.5). The 100 µF capacitor C2
between pins 4 and 7 is charged up to VP1 during
scan, using the external diode and the resistor R2.
The cathode of the capacitor C2 is connected to the
positive rail during flyback. Thus, the flyback voltage is
twice the supply voltage.
1997 Oct 27
• LOW for normal conditions
• HIGH for deflection coil short-circuit respectively
open-circuit
• HIGH when there are neither input or output signals.
4
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134); voltages referenced to substrate (pin 6); unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VP1
supply voltage (pin 1)
−
40
V
VP2
supply voltage (pin 4)
−
60
V
VP3
supply voltage (pin 8)
−
60
V
V2,3,9
voltage on pins 2, 3 and 9
−
VP1
V
V5,7
voltage on pins 5 and 7
−
60
V
I4
current on pin 4
−
1
A
I5 (M)
output current on pin 5 (peak value)
−
±1.3
A
I7 (M)
flyback current on pin 7 (peak value)
−
±1.3
A
I9
current on pin 9
−
−8
mA
Tstg
storage temperature
−25
+150
°C
Tamb
operating ambient temperature
−20
+75
°C
Tj
junction temperature
note 1
−
168
°C
Ves
electrostatic handling for all pins
note 2
−
±300
V
note 1
Notes
1. Internally limited by thermal protection; switching temperature point at 160 ±8 °C.
2. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-c
PARAMETER
thermal resistance from junction to case
The heatsink can be estimated according to application circuit (see Fig.1):
T j(max) – T amb
105 °C – 65 °C
R th j-a = R th j-c + R th c-h + R th h-a = ---------------------------------- = ----------------------------------------- = 22.2 K/W .
P IC(max)
1.8 W
A heatsink is needed at Rth j-c < 10 K/W and Rth c-h = 0.5 K/W (using silicon grease) with
Rth h-a = 22.2 K/W − (10 + 0.5) K/W = 11.7 K/W.
1997 Oct 27
5
VALUE
UNIT
10
K/W
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
CHARACTERISTICS
VP1 = VP2 = 25 V; VN = V6 = 0 V; Tamb = 25 °C; voltages referenced to substrate (pin 6); unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VP1
supply voltage 1 (pin 1)
9
25
30
V
VP2
supply voltage 2 (pin 4)
9
25
60
V
VP3
supply voltage 3 (pin 8)
9
−
60
V
IP1
supply current (pin 1)
IP2
quiescent supply current (pin 4)
−
−
10
mA
without input signal
−
9
−
mA
1.6
−
VP1 − 0.5 V
without input signal
−
100
−
Pre-amplifier
V2,3
input voltage (pins 2 and 3)
I2,3
input quiescent current
nA
Flyback generator
V7
output voltage
I7(M)
flyback output current
(maximum value; pin 7)
V1-5
threshold voltage to switch flyback
tp FLB
flyback pulse time
upper value; I7 = −1 A −
VP3 − 2.2 −
V
−
−
±1
A
on/off threshold
−
1.4
−
V
see Figs 1 and 3
−
250
−
µs
−
V
Vertical output; see Fig.3
upper value; I5 = −1 A VP2 − 2.3 VP2 − 2
V5
output voltage
−
1.5
1.7
V
I5(M)
vertical output current
(maximum value; pin 5)
−
−
±1
A
LIN
non-linearity of output signal
−
−
1
%
0.4
−
VP1 − 0.4 V
lower value; I5 = 1 A
Pulse circuit output; see Fig.3
V9
output voltage
V9
output voltage for thermal protection
active
V1-5
voltage to insert flyback pulse on pin 9 normal condition
tp9
pulse width
1997 Oct 27
RPCO = 10 kΩ;
see Fig.1
VP1 − 0.4 −
−
−
V
−
1.4
V
deflection open-circuit −
50
−
%
normal condition
−
−
µs
6
tp FLB
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
handbook, full pagewidth
TDA4860
INP1
input signal
on pin 2
t
INP2
input signal
on pin 3
V-OUT
t
tpFLB = 250 µs
output signal
on pin 5
t
PCO
output signal
on pin 9 for
normal condition
tp9
t
PCO
50%
output signal
on pin 9 for deflection
unit open-circuit
t
PCO
output signal
on pin 9 for thermal
protection active
t
Fig.3 Vertical timing.
1997 Oct 27
7
MEH361
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
APPLICATION INFORMATION
VP3
k, full pagewidth
8
VP
BAX13
TDA4860
>1 kΩ
2.2 Ω
5
GUARD output
HIGH = error
3.3 kΩ
BC548
2N5819
22 µF
vertical
output
signal
220 kΩ
MEH262
Fig.4 GUARD circuit application on vertical output.
handbook, full pagewidth
TDA4860
VOLTAGE
STABILIZER
1
VERTICAL
DRIVER
THERMAL AND
SOAR
PROTECTION
FLYBACK
DRIVER
DIFFERENTIAL
INPUT
AMPLIFIER
VERTICAL
OUTPUT
FLYBACK
GENERATOR
2
3
VP1
4
5
6
7
8
VP2
V-OUT
SUB
FLB
VP3
470
µF
PCO
5.6 Ω
150 kΩ
270 Ω
0.1 µF
1.8 kΩ
1.8 kΩ
from TDA4850
9
C2 100 µF
BAX13
+9 V
PULSE
CIRCUIT
1 MΩ
5.25 mH
yoke
R1
1Ω
R2 240 Ω
10 kΩ
470 µF
VN
−7.8 V
V-shift
Fig.5 Application for flyback voltage generation by doubling the supply voltage.
1997 Oct 27
8
RPCO
MHA592
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
VP1
handbook, full pagewidth
INP1
INP2
1
2
3
TDA4860
VP2
V-OUT SUB
4
cooling fin
5
6
7
VP3
PCO
8
9
TDA4860
MEH266
Fig.6 Internal circuitry.
1997 Oct 27
9
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D1
q
P
A2
P1
A3
q1
q2
A
A4
seating plane
E
pin 1 index
c
L
1
9
b
e
Z
Q
b2
w M
b1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A2
max.
A3
A4
b
b1
b2
c
D (1)
D1
E (1)
e
L
P
P1
Q
q
q1
q2
w
Z (1)
max.
mm
18.5
17.8
3.7
8.7
8.0
15.8
15.4
1.40
1.14
0.67
0.50
1.40
1.14
0.48
0.38
21.8
21.4
21.4
20.7
6.48
6.20
2.54
3.9
3.4
2.75
2.50
3.4
3.2
1.75
1.55
15.1
14.9
4.4
4.2
5.9
5.7
0.25
1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
ISSUE DATE
92-11-17
95-02-25
SOT110-1
1997 Oct 27
EUROPEAN
PROJECTION
10
Philips Semiconductors
Product specification
Vertical deflection power amplifier for
monitors
TDA4860
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Oct 27
11
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© Philips Electronics N.V. 1996
SCA52
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Printed in The Netherlands
547047/1200/03/pp12
Date of release: 1997 Oct 27
Document order number:
9397 750 02782