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APT2X31DC60J
APT2X30DC60J
ISOTOP® SiC Diode
Power Module
2
2
3
1
4
VRRM = 600V
IF = 30A @ TC = 100°C
Application
3




Uninterruptible Power Supply (UPS)
Induction heating
Welding equipment
High speed rectifiers
Features
Anti-Parallel
Anti-Parallel
1
APT2X60DC120J
APT2X30DC60J

4
Parallel
Parallel
APT2X31DC60J
APT2X61DC120J
3
2



SiC Schottky Diode
- Zero reverse recovery
- Zero forward recovery
- Temperature Independent switching behavior
- Positive temperature coefficient on VF
ISOTOP® Package (SOT-227)
Very low stray inductance
High level of integration
Benefits
4
1
ISOTOP






Outstanding performance at high frequency operation
Low losses
Low noise switching
Direct mounting to heatsink (isolated package)
Low junction to case thermal resistance
RoHS Compliant
Symbol
VR
VRRM
IF(AV)
IFSM
Parameter
Maximum DC reverse Voltage
Maximum Peak Repetitive Reverse Voltage
Maximum Average Forward Current Duty cycle = 50%
Non-Repetitive Forward Surge Current
10 µs
TC = 100°C
TC = 25°C
Max ratings
Unit
600
V
30
370
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note
APT0502 on www.microsemi.com
www.microsemi.com
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APT2X31_30DC60J – Rev 1 October , 2012
Absolute maximum ratings (per leg)
APT2X31DC60J
APT2X30DC60J
All ratings @ Tj = 25°C unless otherwise specified
Electrical Characteristics (per leg)
Symbol Characteristic
Test Conditions
VF
Diode Forward Voltage
IRM
Maximum Reverse Leakage Current
QC
Total Capacitive Charge
C
Total Capacitance
Min
Tj = 25°C
IF = 30A
Tj = 175°C
Tj = 25°C
VR = 600V
Tj = 175°C
IF = 30A, VR = 300V
di/dt =1000A/µs
f = 1MHz, VR = 200V
f = 1MHz, VR = 400V
Typ
1.6
2
150
300
Max
1.8
2.4
600
3000
Unit
V
µA
42
nC
195
150
pF
Thermal and package characteristics (per leg)
Symbol
RthJC
RthJA
VISOL
TJ,TSTG
TL
Torque
Wt
Characteristic
Junction to Case Thermal resistance
Junction to Ambient (Diode)
Min
RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz
2500
-55
Storage Temperature Range
Max Lead Temp for Soldering:0.063” from case for 10 sec
Mounting torque (Mounting = 8-32 or 4mm Machine and terminals = 4mm Machine)
Package Weight
Typ
Max
0.9
20
Unit
°C/W
V
175
300
1.5
29.2
°C
N.m
g
SOT-227 (ISOTOP®) Package Outline
11.8 (.463)
12.2 (.480)
31.5 (1.240)
31.7 (1.248)
r = 4.0 (.157)
(2 places)
8.9 (.350)
9.6 (.378)
Hex Nut M4
(4 places)
W=4.1 (.161)
W=4.3 (.169)
H=4.8 (.187)
H=4.9 (.193)
(4 places)
25.2 (0.992)
0.75 (.030) 12.6 (.496) 25.4 (1.000)
0.85 (.033) 12.8 (.504)
4.0 (.157)
4.2 (.165)
(2 places)
3.3 (.129)
3.6 (.143)
14.9 (.587)
15.1 (.594)
1.95 (.077)
2.14 (.084)
3
30.1 (1.185)
30.3 (1.193)
4
* Emitter terminals are shorted
internally. Current handling
capability is equal for either
Emitter terminal.
38.0 (1.496)
38.2 (1.504)
2
1
Dimensions in Millimeters and (Inches)
www.microsemi.com
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APT2X31_30DC60J – Rev 1 October , 2012
7.8 (.307)
8.2 (.322)
APT2X31DC60J
APT2X30DC60J
Typical Diode Performance Curve
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration
Thermal Impedance (°C/W)
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
Single Pulse
0.05
0
0.00001
0.0001
0.001
0.01
0.1
1
10
Rectangular Pulse Duration (Seconds)
Reverse Characteristics
Forward Characteristics
60
600
TJ=75°C
40
IR Reverse Current (µA)
IF Forward Current (A)
TJ=25°C
50
TJ=175°C
30
TJ=125°C
20
10
400
0.5
1
1.5
2
2.5
3
TJ=125°C
300
TJ=75°C
200
TJ=25°C
100
0
0
TJ=175°C
500
3.5
VF Forward Voltage (V)
0
200
300
400 500 600 700
VR Reverse Voltage (V)
800
Capacitance vs.Reverse Voltage
C, Capacitance (pF)
1200
1000
800
600
400
200
1
10
100
VR Reverse Voltage
1000
ISOTOP® is a registered trademark of ST Microelectronics NV
www.microsemi.com
3–4
APT2X31_30DC60J – Rev 1 October , 2012
0
APT2X31DC60J
APT2X30DC60J
DISCLAIMER
The information contained in the document (unless it is publicly available on the Web without access restrictions) is
PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted,
transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the
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Microsemi in writing signed by an officer of Microsemi.
Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime
without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi
disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or
warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other
intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or
user must conduct and complete all performance and other testing of this product as well as any user or customers final
application. User or customer shall not rely on any data and performance specifications or parameters provided by
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is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp
Life Support Application
Seller's Products are not designed, intended, or authorized for use as components in systems intended for space,
aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other
application in which the failure of the Seller's Product could create a situation where personal injury, death or property
damage or loss may occur (collectively "Life Support Applications").
Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive
testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees,
subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and
expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage
or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations
that Seller was negligent regarding the design or manufacture of the goods.
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APT2X31_30DC60J – Rev 1 October , 2012
Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with
Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.