Document No.001-97306 Rev. *B ECN # 4399360 Cypress Semiconductor Package Qualification Report QTP# 150202 VERSION *B May 2016 44L TQFP (10x10x1.4mm/1.0mm) 52L TQFP (10x10x1.4mm/1.0mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow Amkor-Philippines (M) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-97306 Rev. *B ECN # 4399360 PACKAGE QUALIFICATION HISTORY QTP Number 150202 Description of Qualification Purpose Qualification of 44L TQFP (10x10x1.4mm) Package, using 0.8mil CuPd wire, G631 mold compound, AP4200 die attach material and Pure Sn leadfinish at MSL3, 260C Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Apr 2015 Document No.001-97306 Rev. *B ECN # 4399360 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AZ44 Package Outline, Type, or Name: 44L TQFP (10x10x1.4mm) Mold Compound Name/Manufacturer: G631HQ / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% >28% typical value Lead Frame Designation: Full Metal Pad Lead Frame Material: C194 Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Evertech Enterprise Die Attach Material: AP4200 Bond Diagram Designation 001-91463 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8 mil Thermal Resistance Theta JA C/W: 60°C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-97022 Name/Location of Assembly (prime) facility: Amkor-Philippines (M) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 9 Document No.001-97306 Rev. *B ECN # 4399360 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Latent Failure Rate (LFR) Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, 150°C, 2.3V, 500 Hours JESD22-A-108-B JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C , 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C , 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C , 60% RH, 260C Reflow) Result P/F P P P P Constructional Analysis Criteria: Meet external and internal characteristics of package P High Temp Storage JESD22-A103: 150 C, no bias P X-Ray MIL-STD-883 – 2012 P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101B P Bond Pull MIL-STD-883 – Method 2011 P Ball Shear JESD22-B116A P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110, 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) No Package Crack Dye Penetrant Test P P Electrostatic Discharge Charge Device Model (ESD-CDM) Physical Dimension 500V, JESD22-C101 MIL-STD-1835, JESD22-B100 P Solderability J-STD-002, JESD22-B102 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Pull MIL-STD-883 – Method 2011 P Die Shear MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf Company Confidential A printed copy of this document is considered uncontrolled. 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Page 4 of 9 P P Document No.001-97306 Rev. *B ECN # 4399360 Reliability Test Data QTP #: 150202 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 150 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 150 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 150 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 150 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 150 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 150 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 15 0 STRESS: DIE SHEAR STRESS: DYE PENETRANT STRESS: ESD-CHARGE DEVICE MODEL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 9 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 3 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 5 of 9 Document No.001-97306 Rev. *B ECN # 4399360 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1250 3 0 Reliability Test Data QTP #: 150202 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL INSPECTION CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 796 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 794 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 603 0 STRESS: HIGH ACCELERATED SATURATION TEST 130C, 5.5V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3) CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 96 30 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 96 30 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 96 30 0 CY7B995AXIKP (7CP87B995) AZ44 8430008 611522027 AMKOR-M 192 77 0 STRESS: HIGH TEMPERATURE STORAGE CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 1000 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max 7C08323CC AZ120 4430901 611438709 AMKOR-M 500 80 0 7C08323CC AZ120 4430901 611438708 AMKOR-M 500 80 0 7C08323CC AZ120 4430901 611438707 AMKOR-M 500 80 0 STRESS: PRESSURE COOKER TEST CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 168 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 288 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 168 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 288 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 6 of 9 Document No.001-97306 Rev. *B ECN # 4399360 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 288 80 0 Reliability Test Data QTP #: 150202 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 30 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 30 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 30 0 96 5 0 96 5 0 AMKOR-M 1000 5 0 AMKOR-M 1000 5 0 AMKOR-M 288 5 0 AMKOR-M 288 5 0 AMKOR-M 1000 5 0 STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST PRESSURE COOKER TEST BALL SHEAR CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST PRESSURE COOKER TEST BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST TEMPERATURE CYCLE BALL SHEAR CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST TEMPERATURE CYCLE CONSTRUCTIONAL ANALYSIS CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 STRESS: POST TEMPERATURE CYCLE BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 3 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 3 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 3 0 STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-97306 Rev. *B ECN # 4399360 Reliability Test Data QTP #: 150202 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TEMPERATURE CYCLE CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M COMP 15 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-97306 Rev. *B ECN # 4399360 Document History Page Document Title: QTP#150202: 44L/52L TQFP (10X10X1.4MM/1.0MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C REFLOW AMKOR-PHILIPPINES (M) Document Number: 001-97306 Rev. ECN No. ** 4733403 *A 4794191 *B 4399360 Orig. of Change HSTO HSTO HSTO Description of Change DCON -Removed Distribution and posting information from Document history page. -Updated Cypress logo with the new tagline. Initial spec release Update Electrical Test/Finish Description Table Update contact person for Reliability Director Added HAST extended readpoint result. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9