Document No.002-04190 Rev. ** ECN # 4983511 Cypress Semiconductor Automotive Package Qualification Report QTP# 143606 VERSION ** October 2015 48L VFBGA (6x8x1.0mm) SAC-105 ballfinish, CuPd Wire MSL3, 260C Reflow CML-Philippines (RA) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 10 Document No.002-04190 Rev. ** ECN # 4983511 PACKAGE QUALIFICATION HISTORY QTP Number 143606 Description of Qualification Purpose Qualification of 48L VFBGA (6x8x1.0mm) in CML-Philippines (RA) using 0.8mil CuPd wire with GR9810 mold compound, QMI-506 die attach material and SAC-105 ball finish at MSL3, 260C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 10 Date July 2015 Document No.002-04190 Rev. ** ECN # 4983511 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: BZ48A Package Outline, Type, or Name: 48L VFBGA 6x8x1.0mm Mold Compound Name/Manufacturer: GR9810 / Henkel Mold Compound Flammability Rating: V0 UL94 Mold Compound Alpha Emission Rate: 0.002 CPH/cm2 Oxygen Rating Index: >28% 54 (Typical) / 28 (Min. value) Lead Frame Designation: N/A Lead Frame Material: N/A Substrate Material: BT / KIT Lead Finish, Composition / Thickness: SAC-105 Die Backside Preparation Method/Metallization: Backgrind to 7mils Die Separation Method: 100% Saw Die Attach Supplier: Henkel Die Attach Material: QMI-506 Bond Diagram Designation 001-91668 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 0.8mil Thermal Resistance Theta JA C/W: 32 degC /W Package Cross Section Yes/No: Y Assembly Process Flow: 002-03811 Name/Location of Assembly (prime) facility: CML-Philippines (RA) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: Chipmos-Taiwan (GO), CML-Philippines (RA) Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 10 Document No.002-04190 Rev. ** ECN # 4983511 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Temperature Cycle Test Condition (Temp/Bias) AEC-Q100-008 and JESD22-A108, 125°C Dynamic Operating Condition, Vcc Max = 1.44V JESD22-A108, 1250°C Dynamic Operating Condition, Vcc Max = 1.44V JESD22-A110, 130C, 3.65V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C JESD22-A104, -65C to 150C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Pressure Cooker Result P/F P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V/4000V/6000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/750V (corner pins) P Electrostatic Discharge 200V, JESD22-A115-A P Machine Model (ESD-MM) Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC-Q100-009 P Solder Ball Shear AEC Q100-010 P Final Visual JESD22-B101B P Physical Dimensions JESD22-B100/108 P Solderability JESD22-B102 P Post Temperature Cycle Wire Bond Pull Mil-Std 883, Method 2011 High Temperature Storage Life JESD22-A103, 150 C Test P P Dye Penetrant Test Static Latch-up Criteria: No Package Crack AEC-Q100-004, +/140mA, 125C P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Acoustic J-STD-020 Precondition: JESD22-A113 Moisture Sensitivity MSL 3 192 Hrs, 30C/60%RH+3IR-Reflow, 260C+0, -5C Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 10 P P Document No.002-04190 Rev. ** ECN # 4983511 Reliability Test Data QTP #: 143606 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 22 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 22 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 22 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA COMP 22 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA COMP 22 0 STRESS: BALL SHEAR CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 50 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 50 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 50 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 50 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 50 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 50 0 9313001 611404705 CML-RA COMP 5 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 15 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 15 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 15 0 STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY7C1069G30 (7AP171069AO) BZ48A STRESS: DYE PENETRANT TEST STRESS: ELECTRICAL DISTRIBUTION CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 30+2 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA COMP 30+2 0 CY7C1061G30 (7AP1710612AO) BZ48A 9438003 611506602 CML-RA COMP 30+2 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 125C, 1.44V, Vcc Max CY62167G30 (7CC1721673AO) BZ48A 9423005 611500929 CML-RA 96 927 0 CY62167G30 (7AP172167AO) BZ48A 9438003 611506601 CML-RA 96 927 0 CY62167G30 (7AP172167AO) BZ48A 9423006 611440524 CML-RA 96 927 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 10 Document No.002-04190 Rev. ** ECN # 4983511 Reliability Test Data QTP #: 143606 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 250 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 500 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114-B CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 500 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 1000 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 1500 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 2000 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 4000 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 6000 3 0 9313001 611404705 CML-RA 200 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 901 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 864 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 913 0 STRESS: ESD-MACHINE MODEL CY7C1069G30 (7AP171069AO) BZ48A STRESS: FINAL VISUAL INSPECTION CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA COMP 534 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA COMP 596 0 STRESS: HI-ACCEL SATURATION TEST, 130C, 3.65V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 96 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 192 76 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 96 76 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 192 75 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 96 80 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 192 80 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA 96 81 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA 192 80 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA 96 83 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA 192 82 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 10 Document No.002-04190 Rev. ** ECN # 4983511 Reliability Test Data QTP #: 143606 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 1000 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 2000 75 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 1.44V, Vcc Max CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 1000 80 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 1000 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 1000 80 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 96 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 96 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 96 80 0 STRESS: PRESSURE COOKER TEST CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA 96 83 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA 96 83 0 STRESS: PHYSICALDIMENSION CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 30 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 30 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 30 0 STRESS: POST HI-ACCEL SATURATION TEST BALL SHEAR CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 192 2 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 192 2 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 192 2 0 STRESS: POST HI-ACCEL SATURATION TEST IMC CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 192 1 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 192 1 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 192 1 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 10 Document No.002-04190 Rev. ** ECN # 4983511 Reliability Test Data QTP #: 143606 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST HI-ACCEL SATURATION TEST BOND PULL CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 192 2 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 192 2 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 192 2 0 CML-RA COMP 1 0 611404705 CML-RA 500 5 0 STRESS: POST HIGH TEMPERATURE STORAGE IMC CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL CY7C1069G30 (7AP171069AO) BZ48A 9313001 STRESS: POST TEMPERATURE CYCLE WIRE IMC CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 500 1 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 500 1 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 500 1 0 611404705 CML-RA COMP 30+2 0 611404705 CML-RA COMP 6 0 611404705 CML-RA COMP 3 0 9313001 611404705 CML-RA COMP 3 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 30 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 30 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 30 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA COMP 15 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA COMP 15 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA COMP 15 0 STRESS: PRE/POST LFR CRITICAL PARAMETER CY7C1069G30 (7AP171069AO) BZ48A 9313001 STRESS: STATIC LATCH-UP, +/-140mA 85C CY7C1069G30 (7AP171069AO) BZ48A STRESS: STATIC LATCH-UP, +/-200mA 85C CY7C1069G30 (7AP171069AO) BZ48A STRESS: STATIC LATCH-UP, 9313001 9313001 +/-140mA 125C CY7C1069G30 (7AP171069AO) BZ48A STRESS: SOLDER BALL SHEAR STRESS: SOLDERABILITY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 10 Document No.002-04190 Rev. ** ECN # 4983511 Reliability Test Data QTP #: 143606 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C -65C TO 150C, PRECONDITION 192 HRS 30C/60%RH CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 500 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 1000 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404705 CML-RA 20000 68 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 500 77 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 1000 76 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404699 CML-RA 2000 75 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 500 80 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 1000 80 0 CY7C1069G30 (7AP171069AO) BZ48A 9313001 611404743 CML-RA 2000 75 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA 500 83 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440523 CML-RA 1000 83 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA 500 82 0 CY7C1061G30 (7AP1710612AO) BZ48A 9313001 611440525 CML-RA 1000 81 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 10 Document No.002-04190 Rev. ** ECN # 4983511 Document History Page Document Title:QTP#143606: AUTOMOTIVE 48L VFBGA (6X8X1.0MM) SAC-105 BALLFINISH, CUPD WIRE MSL3, 260C REFLOW CML-PHILIPPINES (RA) Document Number: 002-04190 Rev. ECN Orig. of No. Change ** 4983511 HSTO Description of Change Initial spec release Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 10