Document No.001-97417 Rev. *B ECN # 4882971 Cypress Semiconductor Package Qualification Report QTP# 150201 VERSION *B September 2015 32L TQFP (7x7x1.0/1.4mm) Pure Sn Leadfinish, CuPd Wire MSL3, 260C Reflow Amkor-Philippines (M) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Don Darling Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 9 Document No.001-97417 Rev. *B ECN # 4882971 PACKAGE QUALIFICATION HISTORY QTP Number 150201 Description of Qualification Purpose Qualification of 32L TQFP (7x7x1.0/1.4mm) Package, using 1.0mil CuPd wire, G631 mold compound, AP4200 die attach material and Pure Sn leadfinish at MSL3, 260C Reflow Temperature. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 9 Date Apr 2015 Document No.001-97417 Rev. *B ECN # 4882971 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: AE32 Package Outline, Type, or Name: 32L TQFP (7x7x1.0mm) Mold Compound Name/Manufacturer: G631HQ / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A (not low alpha mold compound) Oxygen Rating Index: >28% >28% typical value Lead Frame Designation: Full Metal Pad Lead Frame Material: C194 Substrate Material: N/A Lead Finish, Composition / Thickness: Pure Sn Die Backside Preparation Method/Metallization: Grinding Die Separation Method: Wafer Saw Die Attach Supplier: Evertech Enterprise Die Attach Material: AP4200 Bond Diagram Designation 001-91284 Wire Bond Method: Thermosonic Wire Material/Size: CuPd / 1.0 mil Thermal Resistance Theta JA C/W: 76°C/W Package Cross Section Yes/No: No Assembly Process Flow: 001-97022 Name/Location of Assembly (prime) facility: Amkor-Philippines (M) MSL LEVEL 3 REFLOW PROFILE 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 9 Document No.001-97417 Rev. *B ECN # 4882971 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Latent Failure Rate (LFR) Pressure Cooker Test Temperature Cycle Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, 150°C, 2.3V, 500 Hours JESD22-A-108-B JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C, 60% RH, 260C Reflow) Result P/F P P P P Constructional Analysis Criteria: Meet external and internal characteristics of package P High Temp Storage JESD22-A103: 150 C, no bias P X-Ray MIL-STD-883 – 2012 P Internal Visual MIL-STD-883-2014 P Final Visual Inspection JESD22-B101B P Bond Pull MIL-STD-883 – Method 2011 P Ball Shear JESD22-B116A High Accelerated Saturation Test (HAST) JEDEC STD 22-A110, 130 C, 85%RH, 3.63V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) No Package Crack Dye Penetrant Test P P P Electrostatic Discharge Charge Device Model (ESD-CDM) Physical Dimension 500V, JESD22-C101 MIL-STD-1835, JESD22-B100 P Solderability J-STD-002, JESD22-B102 P Post Stress Ball Shear JESD22-A116 P Post Stress Bond Pull MIL-STD-883 – Method 2011 P Die Shear MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf >5001 sq. mils = 1.2 kgf P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 9 P Document No.001-97417 Rev. *B ECN # 4882971 Reliability Test Data QTP #: 150201 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 150 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 150 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 150 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 150 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 150 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 150 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 5 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 15 0 STRESS: DIE SHEAR STRESS: DYE PENETRANT STRESS: ESD-CHARGE DEVICE MODEL CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 500 9 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 1000 3 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 1250 3 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 9 Document No.001-97417 Rev. *B ECN # 4882971 Reliability Test Data QTP #: 150201 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: FINAL VISUAL INSPECTION CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 946 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 997 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 988 0 STRESS: HIGH ACCELERATED SATURATION TEST 130C, 3.63V, 85%RH, PRE COND 192 HR 30C/60%RH (MSL3) CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 96 32 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 192 22 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 96 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 192 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 96 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 192 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 5 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 5 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 5 0 STRESS: INTERNAL VISUAL STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.3V, Vcc Max 7C08323CC AZ120 4430901 611438709 AMKOR-M 500 80 0 7C08323CC AZ120 4430901 611438708 AMKOR-M 500 80 0 7C08323CC AZ120 4430901 611438707 AMKOR-M 500 80 0 STRESS: HIGH TEMPERATURE STORAGE CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 79 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423693 AMKOR-M 1000 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 500 80 0 CY8C27543 (8C27543BC) AZ44 4405950 611423692 AMKOR-M 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 9 Document No.001-97417 Rev. *B ECN # 4882971 Reliability Test Data QTP #: 150201 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 168 82 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 168 79 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 288 78 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 168 80 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 288 80 0 STRESS: PHYSICAL DIMENSION CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 30 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 30 0 96 5 0 STRESS: POST HIGH ACCELERATED SATURATION TEST BALL SHEAR TEST CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M STRESS: POST HIGH ACCELERATED SATURATION TEST BOND PULL CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 96 5 0 4324993 611443725 AMKOR-M COMP 1 0 4324993 611443725 AMKOR-M COMP 1 0 611443725 AMKOR-M COMP 1 0 STRESS: POST MSL BALL SHEAR CY2DP1510AXC (7C85500AC) AE32 STRESS: POST MSL BOND PULL CY2DP1510AXC (7C85500AC) AE32 STRESS: POST MSL CONSTRUCTIONAL ANALYSIS CY2DP1510AXC (7C85500AC) AE32 4324993 STRESS: POST PRESSURE COOKER TEST BALL SHEAR CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 168 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 288 5 0 STRESS: POST PRESSURE COOKER TEST BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 168 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 288 5 0 STRESS: POST TEMPERATURE CYCLE BALL SHEAR CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 9 Document No.001-97417 Rev. *B ECN # 4882971 Reliability Test Data QTP #: 150201 Device Package Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: POST TEMPERATURE CYCLE BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 500 5 0 CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 AMKOR-M 1000 5 0 STRESS: POST HIGH TEMPERATURE STORAGE BALL SHEAR TEST CY8C27543 (8C27543BC) AZ44 4405950 611423694 STRESS: POST HIGH TEMPERATURE STORAGE BOND PULL CY8C27543 (8C27543BC) AZ44 4405950 611423694 AMKOR-M 1000 5 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 3 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 3 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 3 0 STRESS: SOLDERABILITY STRESS: TEMPERATURE CYCLE CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 500 82 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M 1000 72 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 500 80 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M 1000 80 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 500 79 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M 1000 79 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443725 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443726 AMKOR-M COMP 15 0 CY2DP1510AXC (7C85500AC) AE32 4324993 611443727 AMKOR-M COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 9 Document No.001-97417 Rev. *B ECN # 4882971 Document History Page Document Title: QTP#150201: 32L TQFP (7X7X1.0/1.4MM) PURE SN LEADFINISH, CUPD WIRE MSL3, 260C REFLOW AMKOR-PHILIPPINES (M) Document Number: 001-97417 Rev. ECN No. ** 4748790 *A 4794191 *B 4882971 Orig. of Change HSTO HSTO HSTO Description of Change DCON Removed distribution and posting from the document history page. Initial spec release Update Electrical Test/Finish Description Table Added HAST robustness 192h readpoint test result. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 9