Document No.001-70518 Rev. *C ECN # 4450627 Cypress Semiconductor Package Qualification Report QTP# 112105 VERSION*C July, 2014 48 QFN (6X6X0.6 mm) / 56 QFN (7X7X0.6 mm) NiPdAu, MSL3, 260°°C Reflow ASEK-Taiwan (G) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 8 Document No.001-70518 Rev. *C ECN # 4450627 PACKAGE QUALIFICATION HISTORY QTP Number Description of Qualification Purpose Date 112105 Qualification of 48/56QFN 6x6x0.6mm/7x7x0.6mm package dimensions (LQ48A and LQ56A) at ASEKH (G) using G631 mold compound and EN-4900 epoxy Jun 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 8 Document No.001-70518 Rev. *C ECN # 4450627 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Mold Compound Name/Manufacturer: LQ48A / LQ56A 48 Quad Flat No-Lead (6x6x0.6mm)/ 56 Quad Flat No-Lead (7x7x0.6mm) G631 / Sumitomo Mold Compound Flammability Rating: V-0 / UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: >28% 54 (typical) / 28 (Min. value) Lead Frame Designation: Full Metal Pad Lead Frame Material: Copper /PPF Substrate Material: N/A Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: SAW Process Die Attach Supplier: Hitachi Die Attach Material: EN-4900 Bond Diagram Designation 001-69142 /001-69184 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 20.6°C/W, 18.69°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 49-41999 Name/Location of Assembly (prime) facility: G-ASEK Taiwan MSL LEVEL 3 REFLOW PROFILE 260C Package Outline, Type, or Name: ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-R Note: Please contact a Cypress Representative for other package availability. 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Page 3 of 8 Document No.001-70518 Rev. *C ECN # 4450627 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Pressure Cooker Test Temperature Cycle High Temp Storage Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Charge Device Model (ESD-CDM) Acoustic Microscopy Test Condition (Temp/Bias) Dynamic Operating Condition, Vcc = 2.07, 150 C JESD22-A108 Dynamic Operating Condition, Vcc = 2.07V, 150 C JESD22-A108 JEDEC STD 22-A110, 130 C, 85%RH, 5.25V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A102, 121 C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) MIL-STD-883, Method 1010, Condition C, -65 C to 150 C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-A103, 150 C, no bias Result P/F P P P P P P P Ball Shear (2200V) JEDEC EIA/JESD22-A114 (500V) JESD22-C101 J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30 C°, 60% RH, 260C Reflow) JESD22-B116, Cpk : 1.33, Ppk : 1.66 Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Die Shear Dye Penetrant Test Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: • <3000 sq. mils = 1.2 kgf • 30001-5000 sq. mils = 1.2 kgf • >5001 sq. mils = 1.2 kgf P P P P P P Internal Visual Test to determine the existence and extent of cracks, Criteria: No Package Crack MIL-STD-883-2014 Final Visual Inspection JESD22-B101 P Physical Dimension MIL-STD-1835, JESD22-B100 P Thermal Shock MIL-STD-883, Method 1011, Condition B, -55 C to 125C and JESD22-A106, Condition C, -55 C to 125C Solderability, Steam Aged J-STD-002, JESD22-B102 P P P 95% solder coverage minimum X-Ray MIL-STD-883 - 2012 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 8 P Document No.001-70518 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112105 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 15 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 10 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 10 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 10 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 10 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 10 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 10 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYIS CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 5 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 5 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 5 0 STRESS: DYE PENETRATION TEST CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 15 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 15 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 15 0 G-TAIWAN COMP 9 0 COMP 8 0 STRESS: DIE SHEAR STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C24794 (8C24795A) 5051012 611120647 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114, 2,200V CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 8 Document No.001-70518 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112105 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 130C, 5.25V, 85%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 128 80 0 STRESS: HIGH TEMP STORAGE, 150C CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 500 80 0 CY7C60323 (8C214340A) 4008254 611114333 G-TAIWAN 1000 80 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 5 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 5 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 5 0 STRESS: INTERNAL VISUAL STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.07V, Vcc Core CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 48 1500 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.07V, Vcc Core CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 500 116 0 STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 168 80 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 288 80 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 168 80 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 288 80 0 STRESS: PHYSICAL DIMENSION CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 30 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 30 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 30 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 3 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 3 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 3 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 200 80 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 1000 80 0 STRESS: SOLDERABILITY STRESS: THERMAL SHOCK Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 8 Document No.001-70518 Rev. *C ECN # 4450627 Reliability Test Data QTP #: 112105 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 500 80 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN 1000 80 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN 500 80 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN 1000 80 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 500 79 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN 1000 79 0 CY8C24794 (8C24795A) 5051012 611120647 G-TAIWAN COMP 15 0 CY8C24794 (8C24795A) 5051012 611120648 G-TAIWAN COMP 15 0 CY8CTMA301E5 (8C203135D) 5101114 611120229 G-TAIWAN COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 8 Document No.001-70518 Rev. *C ECN # 4450627 Document History Page Document Title: QTP 112105: 48 QFN (6X6X0.6 MM), 56 QFN (7X7X0.6 MM), NIPDAU, MSL3 260C REFLOW ASEK- TAIWAN 001-70518 Document Number: Rev. ECN No. ** 3283659 *A 3657926 Orig. of Change NSR NSR *B 4055318 JYF *C 4450627 JYF Description of Change Initial spec release Sunset Review. Remove the reference Cypress specs on the reliability test conditions and replace with the industry standards. Remove version 1.0 in the QTP# in title page. Added TCT 1000 Cycles and PCT 288H robustness readpoints. Sunset Review: Deleted revisions of ref. Jedec/Military standards in Reliability Tests Performed table. Revision changes from time to time. Sunset Review: Updated QTP title page for template alignment. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 8