DIODES DMN2027LK3

A Product Line of
Diodes Incorporated
DMN2027LK3
20V N-CHANNEL ENHANCEMENT MODE MOSFET
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Product Summary
V(BR)DSS
20V
Features and Benefits
ID
RDS(on)
TA = 25°C
21mΩ @ VGS= 10V
17.0A
27mΩ @ VGS= 4.5V
15.0A
40mΩ @ VGS= 2.5V
12.3A
•
Low on-resistance
•
Fast switching speed
•
Low gate drive
•
“Green” component and RoHS compliant (Note 1)
Mechanical Data
•
Case: TO252-3L
•
Case Material: Molded Plastic, “Green” Molding Compound. UL
Flammability Classification Rating 94V-0 (Note 1)
This new generation MOSFET has been designed to minimize the onstate resistance (RDS(on)) and yet maintain superior switching
performance, making it ideal for high efficiency power management
applications.
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals Connections: See Diagram
•
Terminals: Matte Tin Finish annealed over Copper leadframe.
Solderable per MIL-STD-202, Method 208
•
Backlighting
•
Marking Information: See Below
•
DC-DC Converters
•
Ordering Information: See Below
•
Power management functions
•
Weight: 0.33 grams (approximate)
Description and Applications
D
D
G
D
G
TOP VIEW
Ordering Information
Product
DMN2027LK3-13
Note:
S
S
PIN OUT -TOP VIEW
Equivalent Circuit
(Note 1)
Marking
N2027L
Reel size (inches)
13
Tape width (mm)
16
Quantity per reel
2,500
1. Diodes, Inc. defines “Green” products as those which are Eu RoHS compliant and contain no halogens or antimony compounds; further information
about Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website.
Marking Information
YYWW
N2027L
DMN2027LK3
Document Revision: 1
= Manufacturer’s Marking
N2027L = Product Type Marking Code
YYWW = Date Code Marking
YY = Year (ex: 09 = 2009)
WW = Week (01-52)
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DMN2027LK3
Maximum Ratings
@TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VGS
Drain-Source voltage
Gate-Source voltage
Continuous Drain current
VGS = 10V
Pulsed Drain current
VGS = 10V
Continuous Source current (Body diode)
Pulsed Source current (Body diode)
(Note 3)
TA = 70°C (Note 3)
(Note 2)
(Note 4)
(Note 3)
(Note 4)
ID
IDM
IS
ISM
Value
20
±12
17.0
13.6
11.6
46.8
11.9
46.8
Unit
V
V
Value
4.18
33.44
8.9
71.4
2.14
17.1
29.9
14.0
58.4
2.46
-55 to 150
Unit
A
A
A
A
Thermal Characteristics @TA = 25°C unless otherwise specified
Characteristic
Symbol
(Note 2)
Power dissipation
Linear derating factor
(Note 3)
PD
(Note 5)
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and storage temperature range
Notes:
(Note 2)
(Note 3)
(Note 5)
(Note 6)
RθJA
RθJL
TJ, TSTG
W
mW/°C
°C/W
°C
2. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
3. Same as note 2, except the device is measured at t ≤ 10 sec.
4. Same as note 2, except the device is pulsed with D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Thermal resistance from junction to solder-point (at the end of the drain lead).
DMN2027LK3
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DMN2027LK3
Thermal Characteristics
100
RDS(on)
RDS(on)
Limit
Limit
ID Drain Current (A)
ID Drain Current (A)
100
10
DC
1s
1
100ms
10ms
T amb=25°C
100m
1ms
25mm x 25mm
1oz FR4
1
DC 1s
1
100ms
10ms
T amb=25°C
10
25mm x 25mm
1oz FR4
40
D=0.5
20
D=0.1
D=0.2
D=0.05
10
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Thermal Resistance (°C/W)
Thermal Resistance (°C/W)
35
T amb=25°C
Single Pulse
T amb=25°C
100
50mm x 50mm
2oz FR4
10
25mm x 25mm
1oz FR4
1
100µ
1m
10m 100m
1
10
100
Pulse Width (s)
Tamb=25°C
30
50mm x 50mm
2oz FR4
25
20
D=0.5
15
10
D=0.1
D=0.2
D=0.05
5
Single Pulse
0
100µ
1m
10m 100m
1
10
100
1k
Pulse Width (s)
Transient Thermal Impedance
1k
Max Power Dissipation (W)
Max Power Dissipation (W)
Transient Thermal Impedance
4
50mm x 50mm
2oz FR4
3
25mm x 25mm
1oz FR4
2
1
0
0
Pulse Power Dissipation
Document Revision: 1
10
Safe Operating Area
60
DMN2027LK3
1
VDS Drain-Source Voltage (V)
Safe Operating Area
30
100µs
100m
VDS Drain-Source Voltage (V)
50
1ms
50mm x 50mm
2oz FR4
100m
100µs
100m
10
20
40
60
80
100 120 140 160
Temperature (°C)
Derating Curve
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DMN2027LK3
Electrical Characteristics @TA = 25°C unless otherwise specified
Characteristic
OFF CHARACTERISTICS
Symbol
Min
Typ
Max
Unit
Test Condition
Drain-Source Breakdown Voltage
BVDSS
20
⎯
⎯
V
ID = 250μA, VGS= 0V
Zero Gate Voltage Drain Current
IDSS
⎯
⎯
0.5
μA
VDS= 20V, VGS= 0V
Gate-Source Leakage
IGSS
⎯
⎯
±100
nA
VGS= ±12V, VDS= 0V
VGS(th)
0.6
⎯
2.0
V
ID= 250μA, VDS= VGS
Ω
VGS= 4.5V, ID= 10A
S
VDS= 15V, ID= 10A
IS= 10A, VGS= 0V
ON CHARACTERISTICS
Gate Threshold Voltage
0.021
VGS= 10V, ID= 20A
RDS (ON)
⎯
⎯
Forward Transconductance (Notes 7 & 8)
gfs
⎯
31.7
⎯
Diode Forward Voltage (Note 7)
VSD
⎯
0.89
1.0
V
121
⎯
ns
Static Drain-Source On-Resistance (Note 7)
0.027
0.040
VGS= 2.5V, ID= 4A
Reverse recovery time (Note 8)
trr
Reverse recovery charge (Note 8)
Qrr
⎯
583
⎯
nC
Input Capacitance
Ciss
⎯
857
⎯
pF
Output Capacitance
Coss
⎯
177
⎯
pF
Reverse Transfer Capacitance
Crss
⎯
102
⎯
pF
Total Gate Charge
Qg
⎯
5.2
⎯
nC
Total Gate Charge
Qg
⎯
9.1
⎯
nC
Gate-Source Charge
Qgs
⎯
1.9
⎯
nC
Gate-Drain Charge
Qgd
⎯
3.2
⎯
nC
Turn-On Delay Time (Note 9)
tD(on)
⎯
5.4
⎯
ns
Turn-On Rise Time (Note 9)
tr
⎯
22.3
⎯
ns
Turn-Off Delay Time (Note 9)
tD(off)
⎯
18.7
⎯
ns
tf
⎯
12.6
⎯
ns
IS= 10A, di/dt= 100A/μs
DYNAMIC CHARACTERISTICS (Note 8)
Turn-Off Fall Time (Note 9)
Notes:
VDS= 10V, VGS= 0V
f= 1MHz
VGS= 2.5V, ID= 4A
VGS= 4.5V
ID= 10A
VDS= 10V
VDD= 10V, VGS= 10V
ID= 10A, RG ≅ 6.0Ω
7. Measured under pulsed conditions. Pulse width ≤ 300μs; duty cycle ≤ 2%
8. For design aid only, not subject to production testing.
9. Switching characteristics are independent of operating junction temperatures.
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DMN2027LK3
Typical Characteristics
ID Drain Current (A)
3V
T = 150°C
2.5V
10
2V
1
1.5V
0.1
VGS
10V
2.5V
10
ID Drain Current (A)
10V
T = 25°C
2V
1.5V
1
0.1
1V
VGS
0.01
0.01
0.1
1
10
0.1
VDS Drain-Source Voltage (V)
1
10
VDS Drain-Source Voltage (V)
Output Characteristics
Output Characteristics
1.6
Normalised RDS(on) and VGS(th)
VDS = 10V
1
T = 150°C
0.1
T = 25°C
0.01
1E-3
1
2
VGS Gate-Source Voltage (V)
RDS(on) Drain-Source On-Resistance (Ω)
Typical Transfer Characteristics
DMN2027LK3
Document Revision: 1
10
VGS
1.5V
2V
1
T = 25°C
2.5V
0.1
3V
4.5V
0.01
0.1
10V
1
10
ID Drain Current (A)
On-Resistance v Drain Current
VGS = 10V
1.4
ID = 20A
RDS(on)
1.2
1.0
0.8
0.4
-50
VGS(th)
VGS = VDS
0.6
ID = 250uA
0
50
100
Tj Junction Temperature (°C)
150
Normalised Curves v Temperature
ISD Reverse Drain Current (A)
ID Drain Current (A)
10
10
1
T = 150°C
0.1
T = 25°C
0.01
Vgs = 0V
1E-3
0.2
0.4
0.6
0.8
1.0
VSD Source-Drain Voltage (V)
Source-Drain Diode Forward Voltage
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DMN2027LK3
Typical Characteristics - continued
VGS = 0V
C Capacitance (pF)
1000
f = 1MHz
800
CISS
COSS
600
CRSS
400
200
0
0.1
1
10
VDS - Drain - Source Voltage (V)
Capacitance v Drain-Source Voltage
VGS Gate-Source Voltage (V)
1200
4
3
2
VDS = 10V
1
ID = 10A
0
0
2
4
6
Q - Charge (nC)
8
10
Gate-Source Voltage v Gate Charge
Test Circuits
Current
regulator
QG
50k
12V
VG
Q GS
Same as
D.U.T
Q GD
V DS
IG
D.U.T
ID
V GS
Charge
Basic gate charge waveform
Gate charge test circuit
V DS
90%
RD
V GS
V DS
RG
VDD
10%
V GS
td(on)
tr
t(on)
td(off)
tr
t(on)
Switching time waveforms
DMN2027LK3
Document Revision: 1
Switching time test circuit
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DMN2027LK3
Package Outline Dimensions
DIM
Inches
Millimeters
DIM
Inches
Min
Max
Min
Max
A
0.086
0.094
2.18
2.39
e
A1
-
0.005
-
0.127
H
0.370
0.410
9.40
10.41
b
0.020
0.035
0.508
0.89
L
0.055
0.070
1.40
1.78
b2
0.030
0.045
0.762
1.14
L1
0.108 REF
2.74 REF
b3
0.205
0.215
5.21
5.46
L2
0.020 BSC
0.508 BSC
c
0.018
0.024
0.457
0.61
L3
0.035
0.065
0.89
1.65
c2
0.018
0.023
0.457
0.584
L4
0.025
0.040
0.635
1.016
D
0.213
0.245
5.41
6.22
L5
0.045
0.060
1.14
1.52
D1
0.205
-
5.21
-
θ1°
0°
10°
0°
10°
E
0.250
0.265
6.35
6.73
θ°
0°
15°
0°
15°
E1
0.170
-
4.32
-
-
-
-
-
-
DMN2027LK3
Document Revision: 1
Min
Millimeters
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Max
Min
0.090 BSC
Max
2.29 BSC
July 2009
© Diodes Incorporated
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Diodes Incorporated
DMN2027LK3
Suggested Pad Layout
6.2
0.244
3.0
0.118
5.8
0.228
1.6
0.063
2.58
0.101
6.17
0.243
mm
inches
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INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
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without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
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noted herein may also be covered by one or more United States, international or foreign trademarks.
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Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A.
B.
Life support devices or systems are devices or systems which:
1.
are intended to implant into the body, or
2.
support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
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representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2009, Diodes Incorporated
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Document Revision: 1
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