DIODES ZXMHN6A07T8TC

ZXMHN6A07T8
60V N-CHANNEL MOSFET H-BRIDGE
SUMMARY
V(BR)DSS= 60V : RDS(on)= 0.3 ; ID= 1.6A
DESCRIPTION
This new generation of trench MOSFETs from Zetex
utilizes a unique structure that combines the benefits of
low on-resistance with fast switching speed. This
makes them ideal for high efficiency, low voltage,
power management applications.
SM8
FEATURES
· Compact package
· Low on state losses
· Low drive requirements
· Operates up to 60V
· 1 Amp continuous rating
APPLICATIONS
· Motor control
ORDERING INFORMATION
DEVICE
REEL
SIZE
TAPE
WIDTH
QUANTITY PER
REEL
ZXMHN6 A0 7 T8 TA
7”
12mm
1,000 units
ZXMHN6 A0 7 T8 TC
13”
12mm
4,000 units
PINOUT
DEVICE MARKING
· ZXMH
N6A07
TOP VIEW
ISSUE 2 - MAY 2004
1
SEMICONDUCTORS
ZXMHN6A07T8
ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
LIMIT
UNIT
Drain-source voltage
V DSS
60
V
Gate-source voltage
V GS
± 20
V
1.6
A
1.3
A
1.4
A
I DM
9
A
IS
1
A
I SM
9
A
Any Single transistor " on" (a) (d)
1.1
W
Single transistor ‘ on’ (b) (d)
1.4
W
Two transistors ‘ on’ equally (a) (e)
1.6
W
Single transistor " on" (a) (d)
8.8
mW/° C
Single transistor ‘ on’ (b) (d)
11.2
mW/° C
Two transistors ‘ on’ equally (a) (e)
13.2
mW/° C
114
° C/W
89
° C/W
76
° C/W
-55 to + 150
°C
Continuous drain current (V GS= 1 0 V; T A = 2 5 ° C)(b) (d) I D
(V GS= 1 0 V; T A = 7 0 ° C)(b) (d)
(V GS= 1 0 V; T A = 2 5 ° C)(a) (d)
Pulsed drain current
(c)
Continuous source current (body diode) (b) (d)
Pulsed source current (body diode)
(c)
Total power dissipation at T A = 2 5 ° C
PTOT
Linear derating factor above 2 5 ° C (a)
Thermal resistance - junction to ambient
Rth(j-amb)
Single transistor " on" (a) (d)
Single transistor " on"
(b) (d)
Two transistors ‘ on’ equally (a) (e)
Operating and storage temperature range
T j, T stg
(a) For a device mounted on 50mm x 50mm x 1.6mm FR4 PCB with a high coverage of single sided 2oz weight copper in still air conditions with the
heat sink split into three equal areas, one for each drain connection.
(b) For a device surface mounted on a FR4 PCB at t ⬍ = 10 sec.
(c) Repetitive rating on 50mm x 50mm x 1.6mm FR4 PCB, duty cycle 2% , pulse width 300␮S in still air conditions with the heat sink split into three
equal areas, one for each drain connection.
(d) For device with one active die.
(e) For any two die not sharing the same drain connection.
ISSUE 2 - MAY 2004
SEMICONDUCTORS
2
ZXMHN6A07T8
CHARACTERISTICS
ISSUE 2 - MAY 2004
3
SEMICONDUCTORS
ZXMHN6A07T8
ELECTRICAL CHARACTERISTICS (at Tamb = 25° C unless otherwise stated)
PARAMETER
SYMBOL
MIN.
Drain-source breakdown voltage
V (BR)DSS
60
Zero gate voltage drain current
I DSS
TYP.
MAX.
UNIT CONDITIONS
STATIC
Gate-body leakage
I GSS
Gate-source threshold voltage
V GS(th)
Static drain-source on-state
resistance (1 )
RDS(on)
Forward transconductance
(1 ) (3 )
1.0
␮A
I D = 2 5 0 ␮A, V GS = 0 V
V DS = 6 0 V , V GS = 0 V
100
nA
V GS = ± 2 0 V , V DS = 0 V
3.0
V
0.3
⍀
I D = 2 5 0 ␮A, V DS = V GS
V GS = 1 0 V , I D = 1 . 8 A
0.45
⍀
V GS = 4 . 5 V , I D = 1 . 3 A
V DS = 1 5 V , I D = 1 . 8 A
V
1.0
gfs
2.3
S
Input capacitance
C iss
166
pF
Output capacitance
C oss
20
pF
Reverse transfer capacitance
SWITCHING(2 ) (3 )
C rss
9
pF
DYNAMIC (3 )
V DS = 4 0 V , V GS = 0 V
f= 1 MHz
Turn-on-delay time
t d(on)
1.8
ns
Rise time
tr
1.4
ns
V DD = 3 0 V , I D = 1 . 8 A
Turn-off delay time
t d(off)
4.9
ns
RG @ 6 . 0 W, V GS = 1 0 V
Fall time
tf
2.0
ns
Total gate charge
Qg
3.2
nC
Gate-source charge
Q gs
0.7
nC
Gate drain charge
Q gd
0.8
nC
V DS = 3 0 V , V GS = 1 0 V
ID= 1 . 8 A
SOURCE-DRAIN DIODE
Diode forward voltage (1 )
V SD
Reverse recovery time (3 )
t rr
Reverse recovery charge (3 )
Q rr
0.95
V
T j= 2 5 ° C, I S = 0 . 4 5 A,
21
ns
21
nC
T j= 2 5 ° C, I F = 1 . 0 A,
di/ dt= 1 0 0 A/ ␮s
V GS = 0 V
NOTES
(1) Measured under pulsed conditions. Pulse width ⱕ 300␮s; duty cycle ⱕ 2% .
(2) Switching characteristics are independent of operating junction temperature.
(3) For design aid only, not subject to production testing.
ISSUE 2 - MAY 2004
SEMICONDUCTORS
4
ZXMHN6A07T8
TYPICAL CHARACTERISTICS
ISSUE 2 - MAY 2004
5
SEMICONDUCTORS
ZXMHN6A07T8
TYPICAL CHARACTERISTICS
ISSUE 2 - MAY 2004
SEMICONDUCTORS
6
ZXMHN6A07T8
PACKAGE OUTLINE
Controlling dimensions are in millimeters. Approximate conversions are given in inches
PACKAGE DIMENSIONS
DIM
Millimeters
Inches
DIM
Millimeters
Inches
Min
Max
Typ.
Min
Max
Typ.
Min
Max
Typ.
Min
Max
Typ.
A
-
1.7
-
-
0.067
-
e1
-
-
4.59
-
-
0.18
07
A1
0.02
0.1
-
0.008 0.004
-
e2
-
-
1.53
-
-
0.06
02
b
-
-
0.7
0.0275
He
6.7
7.3
-
0.264 0.287
-
-
-
c
0.24
0.32
-
0.009 0.013
-
Lp
0.9
-
-
0.035
-
-
D
6.3
6.7
-
0.248 0.264
-
␣
-
15°
-
-
15°
-
E
3.3
3.7
-
0.130 0.145
-
␤
-
-
10°
-
-
10°
©Zetex Semiconductors plc 2004
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For the latest product information, log on to www.zetex.com
ISSUE 2 - MAY 2004
7
SEMICONDUCTORS