ONSEMI MSB92ASWT1

MSB92ASWT1
Preferred Device
PNP Silicon General
Purpose High Voltage
Transistor
This PNP Silicon Planar Transistor is designed for general purpose
amplifier applications. This device is housed in the SC-70/SOT-323
package which is designed for low power surface mount applications.
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COLLECTOR
3
MAXIMUM RATINGS (TA = 25°C)
Symbol
Value
Unit
Collector-Base Voltage
V(BR)CBO
-300
Vdc
Collector-Emitter Voltage
V(BR)CEO
-300
Vdc
Emitter-Base Voltage
V(BR)EBO
-5.0
Vdc
IC
500
mAdc
ESD
MBM16,000,
MM2,000
V
Rating
Collector Current - Continuous
Electrostatic Discharge
2
EMITTER
3
SC-70/SOT-323
CASE 419
STYLE 3
1
THERMAL CHARACTERISTICS
Rating
1
BASE
Symbol
Max
Unit
Power Dissipation (Note 1.)
PD
150
mW
Junction Temperature
TJ
150
°C
Storage Temperature Range
Tstg
- 55 ~ + 150
°C
2
MARKING DIAGRAM
1. Device mounted on a FR-4 glass epoxy printed circuit board using the
minimum recommended footprint.
D3 M
D3 = Specific Device Code
M = Date Code
ORDERING INFORMATION
Device
Package
Shipping
MSB92ASWT1
SC-70/
SOT-323
8mm Tape & Reel
(7-inch/3000 Unit)
Preferred devices are recommended choices for future use
and best overall value.
 Semiconductor Components Industries, LLC, 2003
May, 2003 - Rev. 0
1
Publication Order Number:
MSB92ASWT1/D
MSB92ASWT1
ELECTRICAL CHARACTERISTICS
Characteristic
Symbol
Min
Max
Unit
Collector-Emitter Breakdown Voltage (IC = -1.0 mAdc, IB = 0)
V(BR)CEO
-300
-
Vdc
Collector-Base Breakdown Voltage (IC = -100 Adc, IE = 0)
V(BR)CBO
-300
-
Vdc
Emitter-Base Breakdown Voltage (IE = -100 Adc, IE = 0)
V(BR)EBO
-5.0
-
Vdc
Collector-Base Cutoff Current (VCB = 300 Vdc, IE = 0)
ICBO
-
-0.25
A
Emitter-Base Cutoff Current (VEB = -3.0 Vdc, IB = 0)
IEBO
-
-0.1
A
DC Current Gain (Note )
MSB92AWT1: (VCE = -10 Vdc, IC = -1.0 mAdc)
(VCE = -10 Vdc, IC = -10 mAdc)
(VCE = -10 Vdc, IC = -30 mAdc)
hFE1
hFE2
hFE3
120
40
25
200
-
Collector-Emitter Saturation Voltage (Note )
(IC = -20 mAdc, IB = -2.0 mAdc)
VCE(sat)
-
-0.5
Vdc
Base-Emitter Saturation Voltage (IC = -20 mAdc, IB = -2.0 mAdc)
VBE(sat)
-
-0.9
Vdc
fT
50
-
MHz
Ccb
-
6.0
pF
-
SMALL SIGNAL CHARACTERISTICS
Current - Gain - Bandwidth Product
(IC = -10 mAdc, VCE = -20 Vdc, f = 20 MHz)
Collector-Base Capacitance
(VCB = -20 Vdc, IE = 0, f = 1.0 MHz)
2. Pulse Test: Pulse Width ≤ 300 s, D.C. ≤ 2%.
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MSB92ASWT1
INFORMATION FOR USING THE SC-70/SOT-323 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor packages must
be the correct size to insure proper solder connection
0.037
0.95
0.037
0.95
0.094
2.4
0.039
1.0
0.031
0.8
inches
mm
SC-70/SOT-323 POWER DISSIPATION
The power dissipation of the SC-70/SOT-323 is a function of the pad size. This can vary from the minimum pad
size for soldering to the pad size given for maximum power
dissipation. Power dissipation for a surface mount device
is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the
device junction to ambient; and the operating temperature,
TA. Using the values provided on the data sheet, PD can be
calculated as follows.
PD =
the equation for an ambient temperature TA of 25°C, one
can calculate the power dissipation of the device which in
this case is 200 milliwatts.
PD =
150°C - 25°C
0.625°C/W
= 200 milliwatts
The 0.625°C/W assumes the use of the recommended
footprint on a glass epoxy printed circuit board to achieve
a power dissipation of 200 milliwatts. Another alternative
would be to use a ceramic substrate or an aluminum core
board such as Thermal Clad. Using a board material such
as Thermal Clad, a higher power dissipation of 300 milliwatts can be achieved using the same footprint.
TJ(max) - TA
RJA
The values for the equation are found in the maximum
ratings table on the data sheet. Substituting these values into
SOLDERING PRECAUTIONS
• The soldering temperature and time should not exceed
The melting temperature of solder is higher than the rated
temperature of the device. When the entire device is heated
to a high temperature, failure to complete soldering within
a short time could result in device failure. Therefore, the
following items should always be observed in order to
minimize the thermal stress to which the devices are subjected.
• Always preheat the device.
• The delta temperature between the preheat and soldering should be 100°C or less.*
• When preheating and soldering, the temperature of the
leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method,
the difference should be a maximum of 10°C.
•
•
•
260°C for more than 10 seconds.
When shifting from preheating to soldering, the maximum temperature gradient should be 5°C or less.
After soldering has been completed, the device should
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and result in latent failure due to mechanical stress.
Mechanical stress or shock should not be applied during cooling.
* Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage
to the device.
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3
MSB92ASWT1
SOLDER STENCIL GUIDELINES
The stencil opening size for the surface mounted package
should be the same as the pad size on the printed circuit
board, i.e., a 1:1 registration.
Prior to placing surface mount components onto a printed
circuit board, solder paste must be applied to the pads. A
solder stencil is required to screen the optimum amount of
solder paste onto the footprint. The stencil is made of brass
or stainless steel with a typical thickness of 0.008 inches.
TYPICAL SOLDER HEATING PROFILE
The line on the graph shows the actual temperature that
might be experienced on the surface of a test board at or
near a central solder joint. The two profiles are based on a
high density and a low density board. The Vitronics
SMD310 convection/infrared reflow soldering system was
used to generate this profile. The type of solder used was
62/36/2 Tin Lead Silver with a melting point between
177-189 °C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat
first. The components on the board are then heated by conduction. The circuit board, because it has a large surface
area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees
cooler than the adjacent solder joints.
For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and
a figure for belt speed. Taken together, these control settings make up a heating “profile” for that particular circuit
board. On machines controlled by a computer, the computer remembers these profiles from one operating session to
the next. Figure 1 shows a typical heating profile for use
when soldering a surface mount device to a printed circuit
board. This profile will vary among soldering systems but
it is a good starting point. Factors that can affect the profile
include the type of soldering system in use, density and
types of components on the board, type of solder used, and
the type of board or substrate material being used. This profile
shows
temperature
versus
time.
STEP 1
PREHEAT
ZONE 1
RAMP"
200°C
150°C
STEP 5
STEP 4
HEATING
HEATING
ZONES 3 & 6 ZONES 4 & 7
SPIKE"
SOAK"
STEP 2
STEP 3
VENT
HEATING
SOAK" ZONES 2 & 5
RAMP"
DESIRED CURVE FOR HIGH
MASS ASSEMBLIES
205° TO 219°C
PEAK AT
SOLDER JOINT
170°C
160°C
150°C
140°C
100°C
100°C
50°C
STEP 6 STEP 7
VENT COOLING
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
(DEPENDING ON
MASS OF ASSEMBLY)
DESIRED CURVE FOR LOW
MASS ASSEMBLIES
TIME (3 TO 7 MINUTES TOTAL)
TMAX
Figure 1. Typical Solder Heating Profile
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4
MSB92ASWT1
PACKAGE DIMENSIONS
SC-70/SOT-323
CASE 419-02
ISSUE L
A
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3
B
S
1
2
D
G
C
0.05 (0.002)
J
N
DIM
A
B
C
D
G
H
J
K
L
N
S
INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.032
0.040
0.012
0.016
0.047
0.055
0.000
0.004
0.004
0.010
0.017 REF
0.026 BSC
0.028 REF
0.079
0.095
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.00
0.30
0.40
1.20
1.40
0.00
0.10
0.10
0.25
0.425 REF
0.650 BSC
0.700 REF
2.00
2.40
K
H
STYLE 3:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 7:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
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5
STYLE 5:
PIN 1. ANODE
2. ANODE
3. CATHODE
MSB92ASWT1
SENSEFET is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make
changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all
liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
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For additional information, please contact your local
Sales Representative.
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MSB92ASWT1/D