STMICROELECTRONICS STGB10NB37LZ

STGB10NB37LZ

N-CHANNEL CLAMPED 10A D2PAK
INTERNALLY CLAMPED PowerMESH IGBT
TYPE
V CES
V CE(s at)
IC
STGB10NB37LZ
CLAMPED
< 1.8 V
10 A
■
■
■
■
■
■
POLYSILICON GATE VOLTAGE DRIVEN
LOW THRESHOLD VOLTAGE
LOW ON-VOLTAGE DROP
HIGH CURRENT CAPABILITY
HIGH VOLTAGE CLAMPING FEATURE
SURFACE-MOUNTING D2PAK (TO-263)
POWER PACKAGE IN TUBE (NO SUFFIX)
OR IN TAPE & REEL (SUFFIX ”T4”)
3
1
D2PAK
TO-263
DESCRIPTION
Using the latest high voltage technology based
on patented strip layout, SGS-Thomson has
designed an advanced family of IGBTs with
outstanding performances.
The built in collector-gate zener exhibits a very
precise active clamping while the gate-emitter
zener supplies an ESD protection.
INTERNAL SCHEMATIC DIAGRAM
APPLICATIONS
AUTOMOTIVE IGNITION
■
ABSOLUTE MAXIMUM RATINGS
Symb ol
Parameter
V CES
Collector-Emitter Voltage (VGS = 0)
V ECR
Reverse Battery Protection
V GE
G ate-Emitter Voltage
o
Value
Un it
CLAMPED
V
18
V
CLAMPED
V
IC
Collector Current (continuous) at Tc = 25 C
20
A
IC
Collector Current (continuous) at Tc = 100 C
o
20
A
Collector Current (pulsed)
60
A
T otal Dissipation at Tc = 25 C
125
W
Derating Factor
0.83
W /o C
4
KV
I CM (•)
P tot
o
E SD
ESD (Human Body Model)
T s tg
Storage T emperature
Tj
Max. Operating Junction Temperature
-65 to 175
o
C
175
o
C
(•) Pulse width limited by safe operating area
June 1999
1/8
STGB10NB37LZ
THERMAL DATA
R thj -case
R thj -amb
R thc-sink
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Max
Max
T yp
o
1.2
62.5
0.2
C/W
C/W
o
C/W
o
ELECTRICAL CHARACTERISTICS (Tj = 25 oC unless otherwise specified)
OFF
Symbo l
Parameter
Test Con ditions
BV (CES)
Clamped Voltage
I C = 2 mA
T j = - 40 to 150 o C
BV (ECR)
Emitter Collector
Break-down Voltage
I C = 75 mA
T j = - 40 to 150 o C
BV GE
Gate Emitter
Break-down Voltage
I C =± 2 mA
Τ j = - 40 to 150 o C
I CES
Collector cut-off
Current (VGE = 0)
V CE = 15 V
V CE = 200 V
IGES
Gate-Emitter Leakage
Current (VCE = 0)
V GE = ± 10 V
R GE
Gate Emitter Resistance
V GE = 0
V GE = 0
Min.
Typ.
Max.
Unit
V GE = 0
375
400
425
V
V GE = 0
18
V
12
Tj = 150 oC
o
T j = 150 C
V CE = 0
16
V
10
100
µA
µA
± 0.7
mA
20
KΩ
ON (∗)
Symbo l
V GE(th)
V CE(SAT )
IC
Parameter
Test Con ditions
Gate Threshold
Voltage
V CE = V GE IC = 250 µA
T j = - 40 to 150 o C
Collector-Emitt er
Saturation Voltage
V GE = 4.5 V
V GE = 4.5 V
Collector Current
V GE = 4.5 V
IC = 10 A
IC = 10 A
Min.
Typ.
0.6
T j = 25 o C
o
T j = - 40 C
V CE = 9 V
1.2
1.3
Max.
Unit
2.4
V
1.8
V
V
20
A
DYNAMIC
Symbo l
gf s
C i es
C o es
C res
QG
2/8
Parameter
Test Con ditions
Forward
Transconductance
V CE = 25 V
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
V CE = 25 V
Gate Charge
V CE = 320 V
I C = 10 A
f = 1 MHz
IC = 10 A
V GE = 0
V GE = 5 V
Min.
Typ.
10
18
1250
103
18
28
Max.
Unit
S
1700
140
25
pF
pF
pF
nC
STGB10NB37LZ
FUNCTIONAL CHARACTERISTICS
Symbo l
II
U.I. S.
Parameter
Test Con ditions
Latching Current
V CLAMP = 320 V
R GOF F = 1 KΩ
Unclamped Inductive
Switching Current
Functional Test
Min.
V GE = 5 V
T C = 125 o C
Typ.
Max.
Unit
20
A
R GOF F=1 KΩ L =200 µH Tj = 125 o C
15
A
R GOF F=1 KΩ L =3 mH
T start = 55 o C
12
A
E AS
Single Pulse
Avalanche Energy
T start = 55 o C
T start = 150 o C
215
150
mJ
mJ
E AR
Reverse Avalanche
Energy
T c = 125 oC duty cycle < 1%
pulse width limited by t jmax
10
mJ
Max.
Unit
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbo l
t d(on)
tr
(di/dt) on
Eo n
Parameter
Test Con ditions
Min.
Typ.
Delay Time
Rise Time
V CC = 320 V
V GE = 5 V
I C = 10 A
R G = 1 KΩ
520
340
ns
ns
Turn-on Current Slope
Turn-on
Switching Losses
V CC = 320 V
R G = 1 KΩ
I C = 10 A
V GE = 5 V
17
180
A/µs
µJ
SWITCHING OFF
Symbo l
Parameter
Test Con ditions
Min.
Typ.
Max.
Unit
tc
t r (v off )
tf
td (o ff )
E o ff(**)
Cross-O ver Time
V CLAMP = 320 V
Off Voltage Rise Time R GE = 1 KΩ
Fall T ime
Off Voltage Delay Time
Turn-off Switching Loss
I C = 10 A
V GE = 5 V
4
2.2
1.5
14.8
4.0
µs
µs
µs
µs
mJ
tc
t r (v off )
tf
td (o ff )
E o ff(**)
Cross-O ver Time
V CLAMP = 320 V
Off Voltage Rise Time R GE = 1 KΩ
Fall T ime
o
Off Voltage Delay Time T j = 125 C
Turn-off Switching Loss
I C = 10 A
V GE = 5 V
5.2
2.8
2
15.8
6.5
µs
µs
µs
µs
mJ
(•) Pulse width limited by safe operating area
Safe Operating Area
(*) Pulsed: Pulse duration = 300 ms, duty cycle 1.5 %
(**)Losses Include Also The Tail (jedec Standardization)
Thermal Impedance
3/8
STGB10NB37LZ
Output Characteristics
Transfer Characteristics
Normalized Gate Threshold Voltage vs
Temperature
Transconductance
Collector-Emitter On Voltage vs Temperature
Collector-Emitter On Voltage vs Gate-Emitter
Voltage
4/8
STGB10NB37LZ
Capacitance Variations
Gate Charge vs Gate-Emitter Voltage
Off Losses vs Gate Resistance
Off Losses vs Collector Current
Break-down Voltage vs Temperature
Clamping Voltage vs Gate Resistance
5/8
STGB10NB37LZ
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And DIode Recovery Times
6/8
STGB10NB37LZ
TO-263 (D2PAK) MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.4
4.6
0.173
0.181
A1
2.49
2.69
0.098
0.106
B
0.7
0.93
0.027
0.036
B2
1.14
1.7
0.044
0.067
C
0.45
0.6
0.017
0.023
C2
1.21
1.36
0.047
0.053
D
8.95
9.35
0.352
0.368
E
10
10.4
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15
15.85
0.590
0.624
L2
1.27
1.4
0.050
0.055
L3
1.4
1.75
0.055
0.068
D
C2
A2
A
C
DETAIL”A”
DETAIL ”A”
A1
B2
E
B
G
L2
L
L3
P011P6/E
7/8
STGB10NB37LZ
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibil ity for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specific ation mentioned in this publication are
subjec t to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products
are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
The ST logo is a trademark of STMicroelectronics
 1999 STMicroelectronics – Printed in Italy – All Rights Reserved
STMicroelectronics GROUP OF COMPANIES
Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia - Malta - Morocco Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A.
8/8
http://www.st.com
.