STMICROELECTRONICS STP40NE03L-20

STP40NE03L-20
N - CHANNEL ENHANCEMENT MODE
” SINGLE FEATURE SIZE ” POWER MOSFET
TYPE
V DSS
R DS(on)
ID
ST P40NE03L-20
30 V
<0.020 Ω
40 A
■
■
■
■
TYPICAL RDS(on) = 0.014 Ω
EXCEPTIONAL dv/dt CAPABILITY
LOW GATE CHARGE A 100 oC
APPLICATION ORIENTED
CHARACTERIZATION
DESCRIPTION
This Power MOSFET is the latest development of
SGS-THOMSON unique ”Single Feature Size ”
strip-based process. The resulting transistor
shows extremely high packing density for low onresistance, rugged avalanche characteristics and
less critical alignment steps therefore a remarkable manufacturing reproducibility.
APPLICATIONS
■
HIGH CURRENT, HIGH SPEED SWITCHING
■
SOLENOID AND RELAY DRIVERS
■
MOTOR CONTROL, AUDIO AMPLIFIERS
■
DC-DC & DC-AC CONVERTERS IN HIGH
PERFORMANCE VRMs
■
AUTOMOTIVE ENVIRONMENT (INJECTION,
ABS, AIR-BAG, LAMPDRIVERS, Etc.)
1
2
3
TO-220
INTERNAL SCHEMATIC DIAGRAM
ABSOLUTE MAXIMUM RATINGS
Symbol
Value
Unit
Drain-source Voltage (VGS = 0)
30
V
V DGR
Drain- gate Voltage (RGS = 20 kΩ)
30
V
V GS
Gate-source Voltage
V DS
Parameter
± 15
V
ID
Drain Current (continuous) at T c = 25 C
40
A
ID
Drain Current (continuous) at T c = 100 o C
28
A
160
A
I DM (•)
P to t
o
Drain Current (pulsed)
o
Total Dissipation at Tc = 25 C
Derating Factor
dv/dt( 1 )
T st g
Tj
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction T emperature
(•) Pulse width limited by safe operating area
October 1997
80
W
0.53
W/ C
7
V/ns
o
-65 to 175
o
C
175
o
C
(1) ISD ≤ 40 A, di/dt ≤ 300 A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
1/8
STP40NE03L-20
THERMAL DATA
R t hj-ca se
R t hj- amb
R thc- si nk
Tl
Thermal Resistance Junction-case
Thermal Resistance Junction-ambient
Thermal Resistance Case-sink
Maximum Lead Temperature For Soldering Purpose
Max
Max
T yp
o
1.88
62.5
0.5
300
C/W
C/W
o
C/W
o
C
o
AVALANCHE CHARACTERISTICS
Symb ol
Parameter
I AR
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by Tj max, δ < 1%)
E AS
Single Pulse Avalanche Energy
(starting Tj = 25 o C, I D = IAR , VDD = 15V)
Max Valu e
Unit
40
A
200
mJ
ELECTRICAL CHARACTERISTICS (Tcase = 25 oC unless otherwise specified)
OFF
Symb ol
V (BR)DSS
I DSS
I GSS
Parameter
Drain-source
Breakdown Voltage
Test Cond ition s
I D = 250 µA
Gate-body Leakage
Current (V DS = 0)
Typ .
Max.
30
V GS = 0
Zero G ate Voltage
V DS = Max Rating
Drain Current (VGS = 0) V DS = Max Rating
o
C
Min.
Un it
V
T c = 125
V GS = ± 15 V
1
10
µA
µA
± 100
nA
ON (∗)
Symb ol
Parameter
Test Cond ition s
ID = 250 µA
V GS(th)
Gate Threshold
Voltage
R DS( on)
Static Drain-source On V GS = 10V
Resistance
V GS = 5V
ID(o n)
V DS = VGS
Min.
Typ .
Max.
Un it
1
1.8
2.5
V
0.014
0.02
0.023
Ω
Ω
ID = 20 A
I D = 20 A
On State Drain Current V DS > I D(on) x R DS(on) max
V GS = 10 V
40
A
DYNAMIC
Symb ol
g fs (∗)
C iss
C oss
C rss
2/8
Parameter
Test Cond ition s
Forward
Transconductance
V DS > I D(on) x R DS(on) max
Input Capacitance
Output Capacitance
Reverse T ransfer
Capacitance
V DS = 25 V
f = 1 MHz
I D = 20 A
VGS = 0
Min.
Typ .
15
20
1850
450
160
Max.
Un it
S
2400
590
210
pF
pF
pF
STP40NE03L-20
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symb ol
Parameter
Test Cond ition s
t d(on)
tr
Turn-on Time
Rise Time
V DD = 15 V
R G =4.7 Ω
Qg
Q gs
Q gd
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
V DD = 24 V
Min.
ID = 20 A
V GS = 5 V
I D = 40 A
V GS = 5 V
Typ .
Max.
Un it
25
160
33
210
ns
ns
29
12
14
38
nC
nC
nC
Typ .
Max.
Un it
25
120
155
33
160
210
ns
ns
ns
Typ .
Max.
Un it
40
160
A
A
1.5
V
SWITCHING OFF
Symb ol
t r(Vof f)
tf
tc
Parameter
Off-voltage Rise Time
Fall Time
Cross-over Time
Test Cond ition s
V DD = 24 V
R G =4.7 Ω
Min.
I D = 40 A
VGS = 5 V
SOURCE DRAIN DIODE
Symb ol
Parameter
Test Cond ition s
I SD
I SDM (•)
Source-drain Current
Source-drain Current
(pulsed)
V SD (∗)
Forward On Voltage
I SD = 40 A
Reverse Recovery
Time
Reverse Recovery
Charge
Reverse Recovery
Current
I SD = 40 A
V DD = 20 V
t rr
Q rr
I RRM
Min.
V GS = 0
di/dt = 100 A/µs
o
Tj = 150 C
50
ns
0.9
µC
3.5
A
(∗) Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
(•) Pulse width limited by safe operating area
Safe Operating Area
Thermal Impedance
3/8
STP40NE03L-20
Output Characteristics
Transfer Characteristics
Transconductance
Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage
Capacitance Variations
4/8
STP40NE03L-20
Normalized Gate Threshold Voltage vs
Temperature
Normalized On Resistance vs Temperature
Source-drain Diode Forward Characteristics
5/8
STP40NE03L-20
Fig. 1: Unclamped Inductive Load Test Circuit
Fig. 2: Unclamped Inductive Waveform
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 4: Gate Charge test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Recovery Times
6/8
STP40NE03L-20
TO-220 MECHANICAL DATA
mm
DIM.
MIN.
inch
TYP.
MAX.
MIN.
TYP.
MAX.
A
4.40
4.60
0.173
0.181
C
1.23
1.32
0.048
0.051
D
2.40
2.72
0.094
D1
0.107
1.27
0.050
E
0.49
0.70
0.019
0.027
F
0.61
0.88
0.024
0.034
F1
1.14
1.70
0.044
0.067
F2
1.14
1.70
0.044
0.067
G
4.95
5.15
0.194
0.203
G1
2.4
2.7
0.094
0.106
H2
10.0
10.40
0.393
0.409
14.0
0.511
0.551
L2
16.4
L4
0.645
13.0
2.65
2.95
0.104
0.116
L6
15.25
15.75
0.600
0.620
L7
6.2
6.6
0.244
0.260
L9
3.5
3.93
0.137
0.154
DIA.
3.75
3.85
0.147
0.151
D1
C
D
A
E
L5
H2
G
G1
F1
L2
F2
F
Dia.
L5
L9
L7
L6
L4
P011C
7/8
STP40NE03L-20
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No
license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express
written approval of SGS-THOMSON Microelectonics.
 1997 SGS-THOMSON Microelectronics - Printed in Italy - All Rights Reserved
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - Canada- China - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
. ..
8/8