TSC TSM1N80SCTB0

TSM1N80
800V N-Channel MOSFET
TO-92
SOT-223
PRODUCT SUMMARY
VDS (V)
RDS(on)(Ω)
Pin Definition:
1. Gate
2. Drain
3. Source
800
21.6 @ VGS =10V
ID (A)
0.15
General Description
The TSM1N80 is used an advanced termination scheme to provide enhanced voltage-blocking capability without
degrading performance over time. In addition, this advanced MOSFET is designed to withstand high energy in
avalanche and commutation modes. The new energy efficient design also offers a drain- to-source diode with a
fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters
and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and
commutating safe operating areas are critical and offer additional and safety margin against unexpected voltage
transients.
Block Diagram
Features
●
●
●
●
RDS(ON)=18Ω(Typ.) @ VGS=10V, ID=0.15A
Low gate charge @ 5nC (Typ.)
Low Crss @ 2.7pF (Typ.)
Fast switching
Ordering Information
Part No.
Package
Packing
TSM1N80SCT B0
TO-92
1Kpcs / Bulk
TSM1N80SCT A3
TO-92
2Kpcs / Ammo
TSM1N80CW RP
SOT-223
2.5kpcs / 13” Reel
N-Channel MOSFET
Absolute Maximum Rating (Ta = 25oC unless otherwise noted)
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current
Pulsed Drain Current (Note 1)
Single Pulse Avalanche Energy (Note 2)
Avalanche Current, Repetitive or Not-Repetitive (Note 1)
TO-92
o
Total Power Dissipation @TC = 25 C
SOT-223
Operating Junction and Storage Temperature Range
Lead Temperature (1/8” from case)
Symbol
Limit
Unit
VDS
VGS
ID
IDM
EAS
IAR
V
V
A
A
mJ
A
TJ, TSTG
TL
800
±30
0.3
1
90
1
3
2.1
-55 to +150
10
Symbol
Limit
Unit
RӨJA
130
60
PDTOT
W
o
C
S
Thermal Performance
Parameter
Thermal Resistance - Junction to Ambient
TO-92
SOT-223
o
C/W
Notes: Surface mounted on FR4 board t ≤ 10sec
1/9
Version: A10
TSM1N80
800V N-Channel MOSFET
Electrical Specifications (Ta=25oC, unless otherwise noted)
Parameter
Conditions
Symbol
Min
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VGS = 0V, ID = 1mA
BVDSS
800
--
--
V
Drain-Source On-State Resistance
VGS = 10V, ID = 0.15A
RDS(ON)
--
18
21.6
Ω
Gate Threshold Voltage
VDS = VGS, ID = 250uA
VGS(TH)
3
--
5
V
Zero Gate Voltage Drain Current
VDS = 800V, VGS = 0V
IDSS
--
--
25
uA
Gate Body Leakage
VGS = ±30V, VDS = 0V
IGSS
--
--
±10
uA
Forward Transconductance
VDS =40V, ID = 0.1A
gfs
--
0.36
--
S
Diode Forward Voltage
IS = 0.2A, VGS = 0V
VSD
--
--
1.4
V
Qg
--
5
6
Qgs
--
1
--
Qgd
--
2
--
Ciss
--
155
200
Coss
--
20
26
Crss
--
2.7
4
td(on)
--
10
30
Dynamic
b
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
VDS = 640V, ID = 0.3A,
VGS = 10V
VDS = 25V, VGS = 0V,
f = 1.0MHz
nC
pF
c
Turn-On Delay Time
Turn-On Rise Time
VGS = 10V, ID = 0.3A,
tr
--
20
50
Turn-Off Delay Time
VDS = 400V, RG = 25Ω
td(off)
--
16
45
Turn-Off Fall Time
tf
Note 1: Pulse test: pulse width <=300uS, duty cycle <=2%
Note 2: (VDD = 50V, IAS=0.8A, L=170mH, RG=25Ω)
Note 3: For design reference only, not subject to production testing.
Note 4: Switching time is essentially independent of operating temperature.
--
25
60
2/9
nS
Version: A10
TSM1N80
800V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
Output Characteristics
Transfer Characteristics
On-Resistance vs. Drain Current
Gate Charge
On-Resistance vs. Junction Temperature
Source-Drain Diode Forward Voltage
3/9
Version: A10
TSM1N80
800V N-Channel MOSFET
Electrical Characteristics Curve (Ta = 25oC, unless otherwise noted)
On-Resistance vs. Gate-Source Voltage
Threshold Voltage
Maximum Safe Operating Area
Normalized Thermal Transient Impedance, Junction-to-Ambient
4/9
Version: A10
TSM1N80
800V N-Channel MOSFET
Gate Charge Test Circuit & Waveform
Resistive Switching Test Circuit & Waveform
EAS Test Circuit & Waveform
5/9
Version: A10
TSM1N80
800V N-Channel MOSFET
Diode Reverse Recovery Time Test Circuit & Waveform
6/9
Version: A10
TSM1N80
800V N-Channel MOSFET
TO-92 Mechanical Drawing
DIM
A
B
C
D
E
F
G
H
TO-92 DIMENSION
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
4.30
4.70
0.169
0.185
4.30
4.70
0.169
0.185
13.53 (typ)
0.532 (typ)
0.39
0.49
0.015
0.019
1.18
1.28
0.046
0.050
3.30
3.70
0.130
0.146
1.27
1.31
0.050
0.051
0.33
0.43
0.013
0.017
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug,
I=Sep, J=Oct, K=Nov, L=Dec)
L = Lot Code
7/9
Version: A10
TSM1N80
800V N-Channel MOSFET
SOT-223 Mechanical Drawing
DIM
A
B
C
D
E
F
G
H
I
J
K
SOT-223 DIMENSION
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
6.350
6.850
0.250
0.270
2.900
3.100
0.114
0.122
3.450
3.750
0.136
0.148
0.595
0.635
0.023
0.025
4.550
4.650
0.179
0.183
2.250
2.350
0.088
0.093
0.835
1.035
0.032
0.041
6.700
7.300
0.263
0.287
0.250
0.355
0.010
0.014
10°
16°
10°
16°
1.550
1.800
0.061
0.071
Marking Diagram
Y = Year Code
M = Month Code
(A=Jan, B=Feb, C=Mar, D=Apl, E=May, F=Jun, G=Jul, H=Aug,
I=Sep, J=Oct, K=Nov, L=Dec)
L = Lot Code
8/9
Version: A10
TSM1N80
800V N-Channel MOSFET
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
9/9
Version: A10