HITACHI HTT1115S

HTT1115S
Silicon NPN Epitaxial Twin Transistor
ADE–208–1440C(Z)
Rev.3
Aug. 2001
Features
• Include 2 transistors in a small size SMD package: SMFPAK–6(6 Leads: 1.5 x 1.1 x 0.55 mm)
Q1:
Equivalent
Buffer transistor
Q2:
Equivalent
OSC transistor
2SC5700
2SC5757
Outline
SMFPAK-6
Pin Arrangement
6
5
B1 6
4
2
3
Index band
C1 1
1. Collector Q1
2. Emitter Q1
3. Collector Q2
Marking is “EK1”.
B2 4
Q2
Q1
1
Note:
E2 5
E1 2
C2
3
4. Base Q2
5. Emitter Q2
6. Base Q1
HTT1115S
Absolute Maximum Ratings
(Ta = 25 °C)
Ratings
Item
Symbol
Q1
Q2
Unit
Collector to base voltage
VCBO
15
10
V
Collector to emitter voltage
VCEO
4
3.5
V
Emitter to base voltage
VEBO
1.5
1.5
V
Collector current
IC
50
80
mA
Collector power dissipation
PC
Junction temperature
Tj
150
150
°C
Storage temperature
Tstg
–55 to +150
–55 to +150
°C
Total 220*
mW
*Value on PCB. (FR–4(13 x 13 x 0.635 mm))
Electrical Characteristics (Q1)
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Collector to base breakdown
voltage
V(BR)CBO
15


V
IC = 10 µA, IE = 0
Collector cutoff current
ICBO


0.1
µA
VCB = 15 V, IE = 0
Collector cutoff current
ICEO


1
µA
VCE = 4 V, RBE = infinite
Emitter cutoff current
IEBO


0.2
µA
VEB = 0.8 V, IC = 0
DC current transfer ratio
hFE
100
130
170

VCE = 1 V, IC = 5 mA
Reverse transfer capacitance
Cre


0.45
pF
VCB = 1 V, f = 1 MHz,
Emitter ground
Gain bandwidth product
fT
10
13

GHz
VCE = 1 V, IC = 5 mA,
f = 1 GHz
Forward transfer coefficient
|S21|
13
16

dB
VCE = 1 V, IC = 5 mA,
f = 900 MHz
Noise figure
NF

1.0
2.0
dB
VCE = 1 V, IC = 5 mA,
f = 900 MHz,
ΓS = ΓL = 50 Ω
Rev.3, Aug. 2001, page 2 of 10
2
HTT1115S
Electrical Characteristics (Q2)
(Ta = 25°C)
Item
Symbol
Min
Typ
Max
Unit
Test Condition
Collector to base breakdown
voltage
V(BR)CBO
10


V
IC = 10 µA, IE = 0
Collector cutoff current
ICBO


1
µA
VCB = 10 V, IE = 0
Collector cutoff current
ICEO


1
µA
VCE = 3.5 V, RBE = infinite
Emitter cutoff current
IEBO


1.0
µA
VEB = 1.5 V, IC = 0
DC current transfer ratio
hFE
80
100
130

VCE = 1 V, IC = 5 mA
Reverse transfer capacitance
Cre

0.8
1.1
pF
VCB = 1 V, f = 1 MHz,
Emitter ground
Gain bandwidth product
fT
4
6

GHz
VCE = 1 V, IC = 5 mA,
f = 1 GHz
Forward transfer coefficient
PG
7
12

dB
VCE = 1 V, IC = 5 mA,
f = 900 MHz
Noise figure
NF

1.5
2.3
dB
VCE = 1 V, IC = 5 mA,
f = 900 MHz,
ΓS = ΓL = 50 Ω
Rev.3, Aug. 2001, page 3 of 10
HTT1115S
Main Characteristics (Q1)
Typical Output Characteristics
450 µA
400 µA
0µ
40
I C (mA)
350 µA
50
300 µA
250 µA
30
200 µA
Collector Current
I C (mA)
Collector Current
Typical Forward Transfer Characteristics
50
VCE = 1 V
A
50
150 µA
20
100 µA
IB = 50 µA
10
0
1
2
3
4
40
30
20
10
0
Collector to Emitter Voltage VCE (V)
200
DC Current Transfer Ratio hFE
VCE = 1 V
100
0
1
2
5
10
Collector Current
Rev.3, Aug. 2001, page 4 of 10
20
50
IC (mA)
100
0.4
0.6
1.0
0.8
Base to Emitter Voltage VBE (V)
Reverse Transfer Capacitance Cre (pF)
DC Current Transfer Ratio vs.
Collector Current
0.2
Reverse Transfer Capacitance vs.
Collector to Base Voltage
0.5
IE = 0
f = 1MHz
0.4
0.3
0.2
0.1
0
0.4
0.8
1.2
1.6
Collector to Base Voltage VCB (V)
2.0
HTT1115S
Gain Bandwidth Product vs.
Collector Current
20
|S21|2 (dB)
VCE = 2V
16
12
8
VCE = 1 V
4
0
1
S21 Parameter vs. Collector Current
VCE = 2 V
f = 1 GHz
S21 Parameter
Gain Bandwidth Product
fT (GHz)
20
16
12
VCE = 1V
8
4
f = 900 MHz
0
2
5
10
Collector Current
20
50
100
1
2
5
10
Collector Current
IC (mA)
20
50
100
IC (mA)
Noise Figure vs. Collector Current
5
Noise Figure NF (dB)
f = 900MHz
4
VCE = 1 V
3
2
VCE = 2 V
1
0
1
2
5
10
20
50
100
Collector Current IC (mA)
Rev.3, Aug. 2001, page 5 of 10
HTT1115S
Typical Output Characteristics
500 µA
µA
50
450
µA
µA
400
350
µA
300
40
µA
250
30
A
200 µ
Typical Forward Transfer Characteristics
50
150 µ
A
20
100 µA
IB = 50 µA
10
0
0.5 1.0 1.5
2.0
2.5
3.0
Collector Current Ic (mA)
Collector Current IC (mA)
Main Characteristics (Q2)
3.5
VCE = 1 V
40
30
20
10
0
0.2
Collector to Emitter Voltage VCE (V)
Reverse Transfer Capacitance Cre (pF)
DC Current Transfer Ratio hFE
VCE = 1 V
100
0
1
2
5
10
20
50
Collector Current IC (mA)
Rev.3, Aug. 2001, page 6 of 10
100
0.6
0.8
1.0
Base to Emitter Voltage VBE (V)
Reverse Transfer Capacitance vs.
Collector to Base Voltage
DC Current Transfer Ratio vs.
Collector Current
200
0.4
1.6
IE = 0
f = 1MHz
1.4
1.2
1.0
0.8
0.6
0
0.4
0.8
1.2
1.6
Collector to Base Voltage VCB (V)
2.0
HTT1115S
Gain Bandwidth Product vs.
Collector Current
S21 Parameter vs. Collector Current
20
f = 900 MHz
16
|S21|2 (dB)
f = 1 GHz
V CE = 2 V
12
V CE = 1 V
S21 Parameter
Gain Bandwidth Product
fT (GHz)
20
8
4
0
16
VCE = 2 V
V CE = 1 V
12
8
4
0
1
2
5
10
20
50
100
1
2
5
10
Collector Current
Collector Current IC (mA)
20
50
100
IC (mA)
Noise Figure vs. Collector Current
5
Noise Figure NF (dB)
f = 900 MHz
4
3
VCE = 1 V
2
VCE = 2 V
1
0
1
2
5
10
Collector Current
20
50
100
IC (mA)
Rev.3, Aug. 2001, page 7 of 10
HTT1115S
Collector Power Dissipation
Pc* (mW)
Collector Power Dissipation Curve
250
*: Value on PCB.
(FR–4 (13 x13 x0.635 mm))
200
2 devices total
150
100
50
0
50
100
150
Ambient temperature Ta (°C)
Rev.3, Aug. 2001, page 8 of 10
200
HTT1115S
Package Dimensions
As of July, 2001
Unit: mm
+0.1
0.15–0.05
0.55MAX
(0.1)
(0.2)
1.1 ± 0.1
1.5 ± 0.05
(0.2)
+0.1
6-0.2 –0.05
(0.1)
1.5 ± 0.05
(0.5) (0.5)
1.0 ± 0.1
Hitachi Code
JEDEC
JEITA
Mass (reference value)
SMFPAK-6
—
Conforms
0.0025 g
Rev.3, Aug. 2001, page 9 of 10
HTT1115S
Disclaimer
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copyright, trademark, or other intellectual property rights for information contained in this document.
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received the latest product standards or specifications before final design, purchase or use.
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contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
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failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
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Copyright © Hitachi, Ltd., 2001. All rights reserved. Printed in Japan.
Colophon 5.0
Rev.3, Aug. 2001, page 10 of 10