EMIF10-LCD01F2 IPAD™ 10 line EMI filter and ESD protection Main product characteristics: Where EMI filtering in ESD sensitive equipment is required : ■ LCD for Mobile phones ■ Computers and printers ■ Communication systems ■ MCU Boards Flip-Chip (25 bumps) Description The EMIF10-LCD01F2 is a 10 line highly integrated device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interferences. The EMIF10 Flip-Chip packaging means the package size is equal to the die size. This filter includes ESD protection circuitry, which prevents damage to the application when it is subjected to ESD surges up to 15 kV. Order code Part Number Marking EMIF10-LCD01F2 FL Figure 1. Benefits ■ EMI symmetrical (I/O) low-pass filter ■ High efficiency in EMI filtering ■ Very low PCB space consuming: < 6 mm2 ■ Lead free package ■ Very thin package: 0.69 mm ■ High efficiency in ESD suppression on input pins (IEC 61000-4-2 level 4) ■ High reliability offered by monolithic integration ■ High reducing of parasitic elements through integration and wafer level packaging. Figure 2. Pin Configuration (bump side) 5 4 3 2 1 I5 I4 I3 I2 I1 A I10 I9 I8 I7 I6 B GND GND GND GND GND C O10 O9 O8 O7 O6 D O5 O4 O3 O2 O1 E Basic Cell Configuration Low-pass Filter Output Input Ri/o = 100Ω Cline = 35pF Complies with following standards: GND GND GND IEC 61000-4-2 level 4 input pins 15 kV (air discharge) 8 kV (contact discharge) MIL STD 883G - Method 3015-7 Class 3 January 2007 TM: IPAD is a trademark of STMicroelectronics. Rev 3 1/8 www.st.com 8 Characteristics EMIF10-LCD01F2 1 Characteristics Table 1. Absolute Maximum Ratings (Tamb = 25° C) : Symbol Tj Parameter Value Unit 125 °C Junction temperature Top Operating temperature range -40 to + 85 °C Tstg Storage temperature range -55 to +150 °C Table 2. Electrical Characteristics (Tamb = 25° C) Symbol Parameter I VBR Breakdown voltage IRM Leakage current @ VRM VRM Stand-off voltage VCL Clamping voltage Rd Dynamic resistance IPP Peak pulse current RI/O Series resistance between Input and Output Cline Input capacitance per line IF Symbol IPP Min. Typ. Max. Unit 6 8 10 V 500 nA 100 110 Ω @ 0 V bias 28 35 pF Induced rise and fall time 10-90% at 26 MHz frequency signal V = 1.9 V (Rt / Ft input 1 ns, 50Ω impedance generator) 8(1) IR = 1 mA IRM VRM = 3 V 90 RI/O Rt / Ft V IRM IR Test conditions VBR Cline VF VCL VBR VRM ns 1. guaranteed by design Figure 3. 0 S21(dB) attenuation measurement Figure 4. dB 10 -10 -10 -20 -30 -30 -50 -40 Analog cross talk measurement dB -70 F(Hz) F(Hz) -50 0.1 M 2/8 1.0 M 10.0 M 100.0 M 1.0 G 10.0 G -90 0.1 M 1.0 M 10.0 M 100.0 M 1.0 G 10.0 G EMIF10-LCD01F2 Figure 5. Figure 7. ESD response to IEC 61000-4-2 Figure 6. (+15 kV air discharge) on one input and on one output ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input and on one output Vin Vin Vout Vout Line capacitance versus applied voltage CLine(pF) 35 30 25 20 15 10 5 0 0.0 1.0 Figure 9. Characteristics Figure 8. Rise time 10-90% measurements with 1.9 V signal at 26 MHz frequency (50 Ω generator) VLine(V) 2.0 3.0 4.0 5.0 Fall time 10-90% measurements with 1.9 V signal at 26 MHz frequency (50 Ω generator) 3/8 Characteristics EMIF10-LCD01F2 Figure 10. Aplac model EMIF10-LCD01F2 model Ground return Figure 11. Aplac parametersl ZRZ structure aplacvar Remif10low 100 aplacvar Cemif10flow 17.5pF Bumps aplacvar Lbump 50pH aplacvar Rbump 20m aplacvar Cbump 1.5pF Bulk aplacvar Rsub 100m Gnd connections aplacvar Rgnd 100m aplacvar Lgnd 200pH aplacvar Cgnd 0.15pF 4/8 BV = 7 CJO = Cemif10low IBV = 1u IKF = 1000 IS = 10f ISR = 100p N=1 M = 0.3333 RS = 0.015 VJ = 0.6 TT = 50n EMIF10-LCD01F2 2 Ordering information scheme Ordering information scheme EMIF yy - xxx zz Fx EMI Filter Number of lines Information x = resistance value (Ohms) z = capacitance value / 10(pF) or 3 letters = application 2 digits = version Package F = Flip-Chip x = 1: 500µm, Bump = 315µm = 2: Leadfree Pitch = 500µm, Bump = 315µm = 3: Leadfree Pitch = 400µm, Bump = 250µm Package information Figure 12. Flip-Chip Dimensions 500 µm ± 50 315 µm ± 50 2.42 mm ± 50µm Figure 13. Marking Dot, ST logo xx = marking z = manufacturing location yww = datecode (y = year ww = week) 650 µm ± 65 2.42 mm ± 50µm 500 µm ± 50 3 250 µm ± 40 Figure 14. Footprint recommendation Copper pad Diameter: 250µm recommended, 300 µm max E x x z y ww Solder stencil opening: 330 µm Solder mask opening recommendation: 340 µm min for 315 µm copper pad diameter 5/8 Ordering information EMIF10-LCD01F2 Figure 15. Flip-Chip tape and reel specification Dot identifying Pin A1 location 1.75 +/- 0.1 Ø 1.5 +/- 0.1 4 +/- 0.1 3.5 +/- 0.1 ST E xxz yww ST E xxz yww ST E xxz yww 8 +/- 0.3 0.73 +/- 0.05 4 +/- 0.1 User direction of unreeling All dimensions in mm In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Note: More packing information is available in the application notes: AN1235: “Flip-Chip: Package description and recommendations for use” AN1751: "EMI Filters: Recommendations and measurements" 4 6/8 Ordering information Ordering code Marking Package Weight Base qty Delivery mode EMIF10-LCD01F2 FL Flip-Chip 9.3 mg 5000 Tape and reel (7”) EMIF10-LCD01F2 5 Revision history Revision history Date Revision Changes 14-Feb-2005 1 Initial release. 17-Mar-2005 2 Capacitance Cline specification changed from 47 pF (typ) to 28 pF (typ) and 35 pF (max). 30-Jan-2007 3 Reformatted to current standards. Reduced die size and updated Figures 3 and 4. 7/8 EMIF10-LCD01F2 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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