UTC-IC 3N60

UNISONIC TECHNOLOGIES CO., LTD
3N60
Power MOSFET
3 Amps, 600/650 Volts
N-CHANNEL POWER MOSFET
DESCRIPTION
The UTC 3N60 is a high voltage and high current power
MOSFET , designed to have better characteristics, such as fast
switching time, low gate charge, low on-state resistance and have
a high rugged avalanche characteristics. This power MOSFET is
usually used at high speed switching applications in power
supplies, PWM motor controls, high efficient DC to DC converters
and bridge circuits.
FEATURES
1
TO-220
*Pb-free plating product number: 3N60L
* RDS(ON) = 3.6Ω @VGS = 10 V
* Ultra low gate charge ( typical 10 nC )
* Low reverse transfer capacitance ( CRSS = typical 5.5 pF )
* Fast switching capability
* Avalanche energy specified
* Improved dv/dt capability, high ruggedness
SYMBOL
2.Drain
1.Gate
3.Source
ORDERING INFORMATION
Order Number
Normal
Lead Free Plating
3N60-x-TA3-T
3N60L-x-TA3-T
Package
TO-220
Pin Assignment
1
2
3
G
D
S
Packing
Tube
3N60L-x-TA3-T
(1)Packing Type
(2)Package Type
(3)Drain-Source Voltage
(4)Lead Plating
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Copyright © 2007 Unisonic Technologies Co., Ltd
(1) T: Tube
(2) TA3: TO-220
(3) A: 600V, B: 650V
(4) L: Lead Free Plating, Blank: Pb/Sn
1 of 8
QW-R502-110,A
3N60
Power MOSFET
ABSOLUTE MAXIMUM RATINGS (TC = 25℃, unless otherwise specified)
PARAMETER
SYMBOL
RATINGS
UNIT
600
V
Drain-Source Voltage
VDSS
650
V
Gate-Source Voltage
VGSS
±30
V
Avalanche Current - (Note 1)
IAR
3.0
A
TC = 25°C
3.0
A
Continuous Drain Current
ID
TC = 100°C
1.9
A
Pulsed Drain Current, TP Limited by TJMAX - (Note 1)
IDM
12
A
Avalanche Energy, Single Pulsed (Note 2)
EAS
200
mJ
Avalanche Energy, Repetitive, Limited by TJMAX
EAR
7.5
mJ
Peak Diode Recovery dv/dt (Note 3)
dv/dt
4.5
V/ns
Power Dissipation
PD
75
W
Junction Temperature
TJ
+150
℃
Storage Temperature
TSTG
-55 ~ +150
℃
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
3N60-A
3N60-B
THERMAL DATA
PARAMETER
SYMBOL
θJC
θJA
Junction-to-Case
Junction-to-Ambient
TYP
MAX
1.67
62.5
UNIT
°C/W
°C/W
ELECTRICAL CHARACTERISTICS (TC =25℃, unless otherwise specified)
PARAMETER
Off Characteristics
Drain-Source Breakdown Voltage
SYMBOL
3N60-A
3N60-B
Drain-Source Leakage Current
Gate-Source Leakage Current
BVDSS
IDSS
Forward
Reverse
Breakdown Voltage Temperature
Coefficient
On Characteristics
Gate Threshold Voltage
Drain-Source On-State Resistance
Dynamic Characteristics
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching Characteristics
Turn-On Delay Time
Turn-On Rise Time
Turn-Off Delay Time
Turn-Off Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
IGSS
VGS = 0 V, ID = 250 µA
MIN TYP MAX UNIT
600
650
VDS = 600 V, VGS = 0 V
VDS = 480 V, TC = 125°C
VGS = 30 V, VDS = 0 V
VGS = -30 V, VDS = 0 V
10
100
100
-100
△BVDSS/△TJ ID = 250 µA, Referenced to 25°C
VGS(TH)
RDS(ON)
CISS
COSS
CRSS
tD(ON)
tR
tD(OFF)
tF
QG
QGS
QDD
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TEST CONDITIONS
VDS = VGS, ID = 250 µA
VGS = 10 V, ID = 1.5A
VDS = 25 V, VGS = 0 V, f = 1MHz
VDD = 300V, ID = 3.0 A, RG = 25Ω
(Note 4, 5)
VDS= 480V,ID= 3.0A, VGS= 10 V
(Note 4, 5)
0.6
2.0
V
V
µA
µA
nA
nA
V/℃
2.8
4.0
3.6
V
Ω
350
50
5.5
450
65
7.5
pF
pF
pF
10
30
20
30
10
2.7
4.9
30
70
50
70
13
ns
ns
ns
ns
nC
nC
nC
2 of 8
QW-R502-110,A
3N60
Power MOSFET
ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
Source- Drain Diode Ratings and Characteristics
Drain-Source Diode Forward Voltage
VSD
VGS = 0 V, IS = 3.0 A
Maximum Continuous Drain-Source
IS
Diode Forward Current
Maximum Pulsed Drain-Source Diode
ISM
Forward Current
Reverse Recovery Time
tRR
VGS = 0 V, IS = 3.0 A,
dIF/dt = 100 A/µs (Note 4)
Reverse Recovery Charge
QRR
Notes: 1. Repetitive Rating : Pulse width limited by TJ
2. L = 40mH, IAS = 3.0A, VDD = 50V, RG = 25 Ω, Starting TJ = 25°C
3. ISD ≤ 3.0A, di/dt ≤200A/µs, VDD ≤ BVDSS, Starting TJ = 25°C
4. Pulse Test: Pulse width ≤ 300µs, Duty cycle ≤ 2%
5. Essentially independent of operating temperature
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MIN
TYP MAX UNIT
210
1.2
1.4
V
3.0
A
12
A
ns
µC
3 of 8
QW-R502-110,A
3N60
Power MOSFET
TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
+
-
L
RG
Driver
* dv/dt controlled by RG
* I SD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
VDD
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
VGS
(Driver)
P.W.
Period
D=
P. W.
Period
VGS= 10V
I FM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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4 of 8
QW-R502-110,A
3N60
Power MOSFET
TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
VGS
D.U.T.
10V
10%
t D(ON )
Pulse Width ≤ 1μs
tD (OFF)
tF
tR
Duty Factor ≤0.1%
Fig. 2A Switching Test Circuit
Same Type
as D.U.T.
50kΩ
12V
0.2μF
Fig. 2B Switching Waveforms
QG
10V
0.3μF
VDS
QGS
QGD
VGS
DUT
VGS
3mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RD
10V
VDD
D.U.T.
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
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IAS
tp
Time
Fig. 4B Unclamped Inductive Switching Waveforms
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QW-R502-110,A
3N60
Power MOSFET
TYPICAL CHARACTERISTICS
1.2
1.1
1.0
Note:
1. VGS =0V
2. I D=250µA
0.9
0.8
-100
-50
0
50 100 150 200
On-Resistance Variation vs.
Junction Temperature
Drain-Source On-Resistance,
RDS(ON) (Normalized)
Drain-Source Breakdown Voltage,
BVDSS (Normalized)
Breakdown Voltage Variation vs.
Junction Temperature
Junction Temperature, T J (℃)
3.0
2.5
2.0
1.5
1.0
Note:
1. VGS=10V
2. ID=4A
0.5
0.0
-100 -50 0 50 100 150 200
Junction Temperature, TJ (℃)
Maximum Safe Operating Area
Maximum Drain Current vs.
Case Temperature
3.0
100µs
1ms
10
10ms
1
DC
Notes:
1 . T J=25℃
2 . T J=150 ℃
3 . Single Pulse
Drain Current, I D (A)
Drain Current, ID (A)
Operation in This Area is Limited by
R DS(on )
2.0
1.5
1.0
0.5
0.1
1
2.5
0
10
100
1000
Drain-Source Voltage, VDS (V)
25
Transfer Characteristics
On-State Characteristics
Top :
1
0.1
Notes:
1. 250µs Pulse Test
2. TC=25℃
0.1
1
10
Drain-to-Source Voltage, VDS (V)
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Drain Current, I D (A)
Drain Current, ID (A)
10
V GS
15.0V
10.0V
8.0V
7.0V
6.5V
6.0V
Bottorm :5.5V
10
150
50
75 100
125
Case Temperature, TC (℃)
150℃
1
25℃
55℃
Notes:
1. VDS=50V
2. 250µs Pulse Test
0.1
2
4
6
8
10
Gate-Source Voltage, VGS (V)
6 of 8
QW-R502-110,A
3N60
Power MOSFET
TYPICAL CHARACTERISTICS(Cont.)
On State Current vs.
Allowable Case Temperature
On-Resistance Variation vs.
Drain Current and Gate Voltage
Reverse Drain Current, I DR (A)
Drain-Source On-Resistance,
RDS(ON) (Ω)
6
5
VGS=20V
4
VGS =10V
3
2
1
0
Note: TJ =25℃
0
2
4
6
8
10
12
Drain Current, ID (A)
10
150℃
1
Notes:
1. VGS=0V
2. 250µs Test
0.1
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Source-Drain Voltage, VSD (V)
Capacitance Characteristics
(Non-Repetitive)
600
Gate Charge Characteristics
12
Gate-Source Voltage, VGS (V)
CISS =CGS +CGD (CDS=shorted )
COSS =CDS+CGD CRSS=CGD
Capacitance (pF)
500
C ISS
400
C OSS
300
Notes:
1. VGS =0V
2. f = 1MHz
200
CRSS
100
25℃
VDS=300V
VDS=480V
10
VDS=120V
8
6
4
2
Note: ID=3.0A
0
0
0.1
0
1
10
Drain-SourceVoltage, VDS (V)
2
4
6
8
10
Total Gate Charge, QG (nC)
Thermal Response, θJC (t)
Transient Thermal Response Curve
1
D=0.5
0.2
0.1
0.1
0.05
0.02
0.01
Single Pulse
0.01
10-5 10-4 10-3
Notes :
1. θJC (t) = 1.18℃/W Max.
2. Duty Factor , D=t 1/t2
3.TJM-TC=PDM ×θJC (t)
10-2
10-1
100
101
Square Wave Pulse Duration, t 1 (sec)
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7 of 8
QW-R502-110,A
3N60
Power MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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QW-R502-110,A