1N5806U Aerospace 2.5 A fast recovery rectifier Features Aerospace applications ■ Surface mount hermetic package ■ High thermal conductivity materials ■ Very small conduction losses ■ Negligible switching losses ■ Extremely fast switching ■ Low forward voltage drop ■ Package mass: 0.12 g ■ Target radiation qualification – 150 krad (Si) low dose rate – 3 Mrad (Si) high dose rate ■ K A ■ K A LCC2A Description This power ultrafast recovery rectifier is designed and packaged to comply with the ESCC5000 specification for aerospace products. It is housed in a surface mount hermetically sealed LCC2A package whose footprint is 100% compatible with industry standard solutions in D5A. ESCC qualified The 1N5806U is suitable for switching mode power supplies and high frequency DC to DC converters such as low voltage high frequency inverter, free wheeling or polarity protection. Table 1. Device summary(1) Order code ESCC detailed specification Quality level Lead finish EPPL 1N5806UA1 - Engineering model Gold plated - 1N5806U01A 5101/014/13 Flight part Gold plated Y 1N5806U02A 5101/014/14 Flight part Solder dip Y IF(AV) VRRM Tj(max) VF (max) 2.5 A 150 V 175 °C 1.0 V 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. March 2010 Doc ID 15986 Rev 2 1/7 www.st.com 7 Characteristics 1N5806U 1 Characteristics Table 2. Absolute ratings (limiting values) Symbol Parameter VRRM Repetitive peak reverse voltage IF(RMS) Forward rms current IF(AV) Average forward rectified current IFSM Forward surge current Tstg Storage temperature range Tj Tsol Value Unit 150 V 6 A Tc = 135 °C, δ = 0.5 2.5 A tp = 8.3 ms sinusoidal 35 tp = 10 ms sinusoidal 33 A -65 to + 175 °C Maximum operating junction temperature 175 °C Maximum soldering temperature (1) 245 °C Value Unit 13 °C/W 1. Maximum duration 5 s. The same package must not be re-soldered until 3 minutes have elapsed. Table 3. Thermal resistance Symbol Rth (j-c) (1) Parameter Junction to case 1. Package mounted on infinite heatsink Table 4. Symbol Static electrical characteristics Parameter Tests conditions Tj = 25 °C IR (1) Reverse current Tj = 125 °C Tj = 25 °C Tj = -65 °C VR = 150 V VR = 160 V Tj = 25 °C VF (2) Forward voltage Tj = 125 °C IF = 1 A Tj = -65 °C Tj = 25 °C IF = 2.5 A Min. Typ. Max. - - 0.5 - - 20 - - 10 - - 10 - - 880 - - 800 - - 1075 - - 1000 1. Pulse test: tp = 5 ms, δ < 2% 2. Pulse test: tp = 680 µs, δ < 2% To evaluate the conduction losses use the following equation: P = 0.70 x IF(AV) + 0.10 x IF2(RMS ) 2/7 Doc ID 15986 Rev 2 Unit µA mV 1N5806U Characteristics Table 5. Dynamic characteristics Symbol Test conditions Parameter Reverse recovery time tRR Min. Typ. Max. Unit IF = IR = 0.5 A, Irr = 0.05 A, dI/dt = -65 A/µs (min.) - IF = 1 A, VR = 30 V, dI/dt = -50 A/µs, - - 30 - 25 ns VFP Forward recovery voltage IFM = 250 mA - - 2.2 V tFR Forward recovery time IFM = 250 mA, VRF = 1.1 x VF - - 15 ns Cj Diode capacitance VR = 10 V, F = 1 MHz - - 25 pF Figure 1. Forward voltage drop versus forward current (typical values) Figure 2. IFM(A) Forward voltage drop versus forward current (maximum values) IFM(A) 10 10 8 8 6 6 4 Tj=125 °C 2 Tj=25 °C 4 Tj=-65 °C Tj=125 °C Tj=-65 °C Tj=25 °C 2 VFM(V) VFM(V) 0 0 0.0 0.2 Figure 3. 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Reverse leakage current versus reverse voltage applied (typical values) 0.0 0.2 Figure 4. IR(µA) 0.4 0.6 0.8 1.0 1.2 1.4 1.6 Relative variation of thermal impedance, junction to case, versus pulse duration Zth(j-c)/Rth(j-c) 1.E+01 1.0 0.9 1.E+00 Tj=125 °C 0.8 0.7 LCC2A 0.6 1.E-01 Tj=75 °C 0.5 0.4 1.E-02 Single pulse 0.3 Tj=25 °C 0.2 1.E-03 0 20 40 60 80 100 120 140 tP(s) 0.1 VR(V) 1.E-04 160 0.0 1.E-06 Doc ID 15986 Rev 2 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 3/7 Characteristics Figure 5. 1N5806U Reverse recovery time versus dIF/dt Figure 6. Junction capacitance versus reverse voltage applied (typical values) C(pF) tRR(ns) 100 40 F=1 MHz VOSC=30 mVRMS Tj=25 °C IF=IF(AV) VR=120 V 36 32 28 Tj=125 °C 24 20 10 16 Tj=25 °C 12 8 dIF/dt(A/µs) 4 VR(V) 0 1 0 4/7 50 100 150 200 250 300 350 400 450 500 1 Doc ID 15986 Rev 2 10 100 1000 1N5806U 2 Package information Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Table 6. Leadless chip carrier 2 (LCC2A) package dimensions Dimensions Ref. Millimeters Inches Min. Typ. Max. Min. Typ. Max. A(1) 1.86 2.03 2.20 0.073 0.080 0.087 B 4.54 4.67 4.87 0.179 0.184 0.192 C 2.33 2.46 2.59 0.92 D 1.53 1.70 1.87 0.060 0.067 0.074 E 0.48 - 0.71 0.019 - 0.028 F - 1.3 - - 0.051 - G - 2.16 - - 0.085 - H - 0.86 - - 00.34 - I - 0.15 - - 0.006 - r1 - 0.15 - - 0.006 - r2 - 0.20 - - 0.008 - A D B 2 C Note 1 1 F Pin 2 Cathode Pin 1 Anode Note 1 E 1 H I 0.97 0.102 Note 1 E 2 r1 G r2 Note 1: The anode is identified by metallization in two top internal angles and the index mark. 1. Measurement prior to solder coating the mounting pads on bottom of package Doc ID 15986 Rev 2 5/7 Ordering information 3 1N5806U Ordering information Table 7. Ordering information(1) Order code ESCC detailed specification 1N5806UA1 - 1N5806U01A 5101/014/13 1N5806U02A 5101/014/14 Package LCC2A Lead finish Marking EPPL Gold plated 06UA1 - Gold plated 06U01A Y Solder dip 06U02A Y Mass Packing 0.12 g 0.12 g Waffle pack 1. Contact ST sales office for information about the specific conditions for products in die form and QML-Q versions. 4 Revision history Table 8. 6/7 Document revision history Date Revision Changes 27-Jul-2009 1 First issue. 25-Mar-2010 2 Updated ESCC status in Features and added footnote to Table 3. Doc ID 15986 Rev 2 1N5806U Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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