ETC BTA26

BTA/BTB24, BTA25, BTA26
and T25 Series
®
25A TRIACS
SNUBBERLESS™ & STANDARD
MAIN FEATURES:
A2
Symbol
Value
Unit
IT(RMS)
25
A
VDRM/VRRM
600 and 800
V
IGT (Q1)
35 to 50
A2
G
A1
A1
A2
G
mA
IT(RMS)
ITSM
I ²t
dI/dt
RMS on-state current (full sine wave)
Non repetitive surge peak on-state
current (full cycle, Tj initial = 25°C)
I²t Value for fusing
Critical rate of rise of on-state current
IG = 2 x IGT , tr ≤ 100 ns
PG(AV)
Tstg
Tj
Peak gate current
Average gate power dissipation
Storage junction temperature range
Operating junction temperature range
September 2002 - Ed: 6A
TO-220AB
(BTB24)
A1 A2
G
D2PAK
(T25G)
A1
A2
G
A1 A2
Value
D²PAK
TO-220AB
RD91
TOP3 Ins.
TO-220AB Ins.
F = 60 Hz
F = 50 Hz
G
TOP3
Insulated
(BTA26)
RD91
(BTA25)
Parameter
VDSM/VRSM Non repetitive surge peak off-state
voltage
IGM
A2
TO-220AB
Insulated
(BTA24)
DESCRIPTION
Available either in through-hole of surface and T25
mount packages, the BTA/BTB24-25-26 triac
series is suitable for general purpose AC power
switching. They can be used as an ON/OFF
function in applications such as static relays,
heating regulation, water heaters, induction motor
starting circuits...or for phase control operation in
high power motor speed controllers, soft start
circuits...The snubberless versions (BTA/BTB...W
and T25 series) are specially recommended for
use on inductive loads, thanks to their high
commutation performances.
By using an internal ceramic pad, the BTA series
provides voltage insulated tab (rated at 2500V
RMS) complying with UL standards (File ref.:
E81734).
ABSOLUTE MAXIMUM RATINGS
Symbol
A1
A2
G
A
Tc = 100°C
Tc = 90°C
Tc = 75°C
t = 16.7 ms
t = 20 ms
tp = 10 ms
Unit
25
260
250
A
340
A² s
F = 120 Hz
Tj = 125°C
50
A/µs
tp = 10 ms
Tj = 25°C
VDRM/VRRM
V
tp = 20 µs
Tj = 125°C
4
A
Tj = 125°C
1
W
- 40 to + 150
- 40 to + 125
°C
+ 100
1/9
BTA/BTB24, BTA25, BTA26 and T25 Series
ELECTRICAL CHARACTERISTICS (Tj = 25°C, unless otherwise specified)
■
SNUBBERLESS™ (3 Quadrants) T25-G, BTA/BTB24...W, BTA25...W, BTA26...W
Symbol
IGT (1)
VGT
Test Conditions
Quadrant
RL = 33 Ω
VD = 12 V
VGD
VD = VDRM
IH (2)
IT = 500 mA
IL
IG = 1.2 IGT
RL = 3.3 kΩ
Tj = 125°C
T25
■
CW
BW
35
35
50
mA
MAX.
I - II - III
MAX.
1.3
V
I - II - III
MIN.
0.2
V
I - III
VD = 67 % VDRM gate open Tj = 125°C
(dI/dt)c (2) Without snubber
Unit
T2535
I - II - III
MAX.
50
50
75
mA
MAX.
70
70
80
mA
80
80
100
MIN.
500
500
1000
V/µs
MIN.
13
13
22
A/ms
II
dV/dt (2)
BTA/BTB
Tj = 125°C
STANDARD (4 Quadrants): BTB24...B, BTA25...B, BTA26...B
Symbol
Test Conditions
IGT (1)
VD = 12 V
Quadrant
RL = 33 Ω
Value
Unit
I - II - III
IV
MAX.
50
100
mA
VGT
ALL
MAX.
1.3
V
VGD
VD = VDRM
ALL
MIN.
0.2
V
IH (2)
IT = 500 mA
MAX.
80
mA
IL
IG = 1.2 IGT
70
mA
RL = 3.3 kΩ
Tj = 125°C
I - III - IV
MAX.
II
dV/dt (2)
VD = 67 % VDRM gate open Tj = 125°C
(dV/dt)c (2) (dI/dt)c = 13.3 A/ms
Tj = 125°C
160
MIN.
500
V/µs
MIN.
10
V/µs
STATIC CHARACTERISTICS
Symbol
Test Conditions
VTM (2)
ITM = 35 A
Vto (2)
tp = 380 µs
Unit
Tj = 25°C
MAX.
1.55
V
Threshold voltage
Tj = 125°C
MAX.
0.85
V
Rd (2)
Dynamic resistance
Tj = 125°C
MAX.
16
mΩ
IDRM
VDRM = VRRM
Tj = 25°C
5
µA
3
mA
IRRM
Note 1: minimum IGT is guaranted at 5% of IGT max.
Note 2: for both polarities of A2 referenced to A1
2/9
Value
Tj = 125°C
MAX.
BTA/BTB24, BTA25, BTA26 and T25 Series
THERMAL RESISTANCES
Symbol
Rth(j-c)
Parameter
Value
Junction to case (AC)
Junction to ambient
Rth(j-a)
D²PAK
TO-220AB
0.8
RD91 (Insulated)
TOP3 Insulated
1.1
TO-220AB Insulated
1.7
D²PAK
45
TOP3 Insulated
50
S = 1 cm²
TO-220AB
TO-220AB Insulated
Unit
°C/W
°C/W
60
S: Copper surface under tab
PRODUCT SELECTOR
Voltage (xxx)
Part Number
Sensitivity
Type
Package
X
50 mA
Standard
TO-220AB
X
X
50 mA
Snubberless
TO-220AB
BTA/BTB24-xxxCW
X
X
35 mA
Snubberless
TO-220AB
BTA25-xxxB
X
X
50 mA
Standard
RD-91
BTA25-xxxBW
X
X
50 mA
Snubberless
RD-91
BTA25-xxxCW
X
X
35 mA
Snubberless
RD-91
BTA26-xxxB
X
X
50 mA
Standard
TOP3 Ins.
BTA26-xxxBW
X
X
50 mA
Snubberless
TOP3 Ins.
BTA26-xxxCW
X
X
35 mA
Snubberless
TOP3 Ins.
T2535-xxxG
X
X
35 mA
Snubberless
D²PAK
600 V
800 V
BTB24-xxxB
X
BTA/BTB24-xxxBW
BTB: Non insulated TO-220AB package
ORDERING INFORMATION
BT A 24 -
600
BW
(RG)
TRIAC
SERIES
INSULATION:
A: insulated
B: non insulated
VOLTAGE:
600: 600V
800: 800V
SENSITIVITY & TYPE
B: 50mA STANDARD
BW: 50mA SNUBBERLESS
CW: 35mA SNUBBERLESS
PACKING MODE
Blank: Bulk
RG: Tube
CURRENT:
24: 25A in TO-220AB
25: 25A in Rd91
26: 25A in TOP3
3/9
BTA/BTB24, BTA25, BTA26 and T25 Series
T 25 35
-
600 G
(-TR)
TRIAC
SERIES
PACKAGE:
G: D2PAK
CURRENT: 25A
VOLTAGE:
600: 600V
800: 800V
PACKING MODE:
Blank: Tube
-TR: Tape & Reel
SENSITIVITY:
35: 35mA
OTHER INFORMATION
Part Number
Marking
Weight
Base
quantity
Packing
mode
BTA/BTB24-xxxyz
BTA/BTB24xxxyz
2.3 g
250
Bulk
BTA/BTB24-xxxyzRG
BTA/BTB24-xxxyz
2.3 g
50
Tube
BTA25-xxxyz
BTA25xxxyz
20 g
25
Bulk
BTA26-xxxyz
BTA26xxxyz
4.5 g
120
Bulk
T2535-xxxG
T2535xxxG
1.5 g
50
Tube
T2535-xxxG-TR
T2535xxxG
1.5 g
1000
Tape & reel
Note: xxx= voltage, y = sensitivity, z = type
4/9
BTA/BTB24, BTA25, BTA26 and T25 Series
Fig. 1: Maximum power dissipation versus RMS
on-state current (full cycle).
Fig. 2-1: RMS on-state current versus case
temperature (full cycle).
P (W)
IT(RMS) (A)
30
30
25
25
20
20
15
15
10
10
BTB/T25
BTA24
5
0
5
IT(RMS) (A)
0
5
10
15
BTA25/26
20
25
Fig. 2-2: D²PAK RMS on-state current versus
ambient temperature (printed circuit board FR4,
copper thickness: 35 µm), full cycle.
0
Tc(°C)
0
25
50
75
100
125
Fig. 3: Relative variation of thermal impedance
versus pulse duration.
IT(RMS) (A)
K=[Zth/Rth]
4.0
1E+0
2
D PAK
(S=1cm2)
3.5
Zth(j-c)
3.0
1E-1
2.5
Zth(j-a)
BTA/BTB24/T25
2.0
1.5
1E-2
Zth(j-a)
BTA26
1.0
0.5
0.0
tp (s)
Tamb(°C)
0
25
Fig. 4:
values).
50
75
100
125
On-state characteristics (maximum
1E-3
1E-3
1E-1
1E+0
1E+1
1E+2 5E+2
Fig. 5: Surge peak on-state current versus
number of cycles.
ITM (A)
ITSM (A)
300
100
1E-2
300
250
Tj max
t=20ms
One cycle
Non repetitive
Tj initial=25°C
200
150
10
Repetitive
Tc=75°C
Tj=25°C
100
Tj max.
Vto = 0.85 V
Rd = 16 mΩ
VTM (V)
1
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
50
Number of cycles
4.5
0
1
10
100
1000
5/9
BTA/BTB24, BTA25, BTA26 and T25 Series
Fig. 6: Non-repetitive surge peak on-state
current for a sinusoidal pulse with width
tp < 10ms, and corresponding value of I²t.
Fig. 7: Relative variation of gate trigger current,
holding current and latching current versus
junction temperature (typical values).
IGT,IH,IL[Tj] / IGT,IH,IL [Tj=25°C]
ITSM (A), I²t (A²s)
2.5
3000
Tj initial=25°C
1000
2.0
dI/dt limitation:
50A/µs
IGT
1.5
IH & IL
ITSM
1.0
0.5
I²t
Tj(°C)
tp (ms)
100
0.01
0.10
1.00
10.00
Fig. 8: Relative variation of critical rate of
decrease of main current versus (dV/dt)c (typical
values).
100.0
50
40
30
20
S(cm²)
6/9
20
24
28
100
120
140
Fig. 9: Relative variation of critical rate of
decrease of main current versus junction
temperature.
1
60
16
80
2
D²PAK
12
60
3
70
8
40
4
Rth(j-a) (°C/W)
4
20
5
80
0
0
6
Fig. 10: D²PAK Thermal resistance junction to
ambient versus copper surface under tab (printed
circuit board FR4, copper thickness: 35 µm).
0
-20
(dI/dt)c [Tj] / (dI/dt)c [Tj specified]
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c
2.4
2.2
2.0
1.8
1.6
BW/CW/T2535
1.4
B
1.2
1.0
0.8
0.6
(dV/dt)c (V/µs)
0.4
0.1
1.0
10.0
10
0.0
-40
32
36
40
0
Tj (°C)
0
25
50
75
100
125
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
D²PAK (Plastic)
DIMENSIONS
REF.
A
E
Min.
C2
L2
D
L
L3
A1
B2
Millimeters
R
C
B
G
A2
2.0 MIN.
FLAT ZONE
V2
A
A1
A2
B
B2
C
C2
D
E
G
L
L2
L3
R
V2
4.30
2.49
0.03
0.70
1.25
0.45
1.21
8.95
10.00
4.88
15.00
1.27
1.40
Typ.
Min.
Typ.
Max.
4.60
2.69
0.23
0.93
1.40
0.40
0°
Max.
Inches
0.169
0.181
0.098
0.106
0.001
0.009
0.027
0.037
0.048 0.055
0.60 0.017
0.024
1.36 0.047
0.054
9.35 0.352
0.368
10.28 0.393
0.405
5.28 0.192
0.208
15.85 0.590
0.624
1.40 0.050
0.055
1.75 0.055
0.069
0.016
8°
0°
8°
FOOTPRINT DIMENSIONS (in millimeters)
D²PAK (Plastic)
16.90
10.30
5.08
1.30
3.70
8.90
7/9
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
RD91 (Plastic)
DIMENSIONS
L2
A2
L1
REF.
Millimeters
Min.
B2
B1
C
C2
C1
A1
N2
N1
B
F
E3
I
A
A
A1
A2
B
B1
B2
C
C1
C2
E3
F
I
L1
L2
N1
N2
Max.
40.00
30.30
22.00
27.00
16.50
24.00
14.00
3.50
3.00
0.90
4.50
13.60
3.50
1.90
43°
38°
29.90
13.50
1.95
0.70
4.00
11.20
3.10
1.70
33°
28°
Inches
Min.
Max.
1.575
1.193
0.867
1.063
0.650
0.945
0.551
0.138
0.118
0.035
0.177
0.535
0.138
0.075
43°
38°
1.177
0.531
0.077
0.027
0.157
0.441
0.122
0.067
33°
28°
PACKAGE MECHANICAL DATA
TOP3 (Plastic)
DIMENSIONS
REF.
Millimeters
Min.
A
B
C
D
E
F
G
H
J
K
L
P
R
8/9
Typ.
4.4
1.45
14.35
0.5
2.7
15.8
20.4
15.1
5.4
3.4
4.08
1.20
4.60
Inches
Max.
Min.
4.6
1.55
15.60
0.7
2.9
16.5
21.1
15.5
5.65
3.65
4.17
1.40
0.173
0.057
0.565
0.020
0.106
0.622
0.815
0.594
0.213
0.134
0.161
0.047
Typ.
Max.
0.181
0.061
0.614
0.028
0.114
0.650
0.831
0.610
0.222
0.144
0.164
0.055
0.181
BTA/BTB24, BTA25, BTA26 and T25 Series
PACKAGE MECHANICAL DATA
TO-220AB (Plastic)
DIMENSIONS
B
REF.
C
Millimeters
Inches
b2
Min.
L
F
I
A
l4
c2
a1
l3
l2
a2
b1
M
c1
e
A
a1
a2
B
b1
b2
C
c1
c2
e
F
I
I4
L
l2
l3
M
Typ.
15.20
Max.
Min.
Typ.
15.90 0.598
3.75
Max.
0.625
0.147
13.00
14.00 0.511
0.551
10.00
10.40 0.393
0.409
0.61
0.88 0.024
0.034
1.23
1.32 0.048
0.051
4.40
4.60 0.173
0.181
0.49
0.70 0.019
0.027
2.40
2.72 0.094
0.107
2.40
2.70 0.094
0.106
6.20
6.60 0.244
0.259
3.75
3.85 0.147
0.151
15.80 16.40 16.80 0.622 0.646 0.661
2.65
2.95 0.104
0.116
1.14
1.70 0.044
0.066
1.14
1.70 0.044
0.066
2.60
0.102
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences
of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted
by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject
to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not
authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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