Z-Power LED X10490 Technical Data Sheet Pb Free Specification SSC-UR101 (Rev 1.0, General) SSC Drawn Approval Customer Approval Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet [ Contents ] 1. Absolute maximum ratings 2. Electro-optical characteristics 3. Characteristic diagram 4. Soldering profile 5. Outline dimension 6. Packing 7. Reel packing structure 8. Precaution for use Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Technical Data Sheet Z-Power LED X10490 Technical Data Sheet SSC-UR101 Description - Surface-mounted and leadless chip LED device - Features Small size suitable for compact appliances - SSC-UR101 • 1.6 X 0.8 X 0.8 mm • Untinted, Diffused flat mold • Dominant Wavelength: 660nm High brightness, wide variety of colors are available - Tape and Reel packing - Increases the life time of battery Applications • Cellular phone’s keypad lightning • Other decoration lighting SSCSSC-UR101 Rev. 00 Revision 1.0 November 2007 www.ZLED.com www.ZLED.com 서식번호 : SSC-QP-7-07-24 (Rev.0.0) Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 1. Absolute maximum ratings (Ta=25℃) Parameter Symbol Value Unit Power Dissipation Pd 63 mW Forward Current IF 30 mA Peak Forward Current IFM *1 50 mA Reverse Voltage VR 5 V Operation Temperature Topr. -30 ~ 85 ℃ Storage Temperature Tstg. -40 ~ 100 ℃ *1 IFM conditions: Pulse width Tw≤0.1ms and Duty ratio≤1/10 2. Electro-Optical Characteristics (Ta=25℃) Parameter Symbol Condition Min Typ Max Forward Voltage VF Reverse Current Unit IF=5 ㎃ 1.6 1.8 2.1 IF=1 ㎂ 1.3 - 1.8 IR VR=5V - - 10 ㎂ Luminous Intensity*2 IV IF=20 ㎃ 40 80 140 mcd Wavelength λD IF=20 ㎃ 650 660 670 nm Spectral Bandwidth Δλ IF=20 ㎃ 20 nm Viewing Angle*3 2θ1/2 IF=20 ㎃ 120 ˚ V *2 The luminous intensity IV is measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. *3 θ1/2 is the off-axis where the luminous intensity is 1/2 the peak intensity. [Note] All products confirm to the listed minimum and maximum specifications for electric and optical characteristics, when operated at 20mA within the maximum ratings shown above. All measurements were made under the standardized environment of SSC. (Tolerance : Iv ±10 %, λD ±2 nm, VF ±0.1 V) Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 3. Characteristic Diagram Forward Current vs Forward Voltage Relative Intensity vs Forward Current 100 140 Relative Intensity IV(%) Forward Current IF(mA) 120 10 100 80 60 40 20 0 1 1.6 1.7 1.8 1.9 0 5 10 15 20 25 30 35 Forward Current IF(mA) Forward Voltage VF(V) Forward Current vs Derating Curve Radiation Diagram 50 Forward current IF(mA) 40 30 20 10 0 -25 0 25 50 75 100 o Ambient temperature Ta( C) Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Reflow Soldering Conditions/ Profile (1) Lead Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 240 ± 5℃max. for 5 seconds max. LED Surface temperature Z-Power LED X10490 Technical Data Sheet 4. Soldering profile °C Operation heating 240 150 Pre-heating Temperature rise: 5°C/sec. Cooling: -5°C/sec. ~ 120 0 60 to 120 sec. 5sec. max (2) Lead-Free Solder • Preliminary heating to be at 150℃max. for 2 minutes max. • Soldering heat to be at 255℃(+5/-0)℃max. for 10 seconds max. LED Surface temperature °C Operation heating 255 (+5) 150 Pre-heating Temperature rise: 5°C/sec. Cooling: -5°C/sec. ~ 120 0 60 to 120 sec. 5 to 10 sec. (3) Hand Soldering Condition • Not more than 3 seconds @MAX280℃, under Soldering iron. [Note] In case the soldered products are reused in soldering process, we don’t guarantee the products. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) 0.8 2.4 Polarity Mark 1.1 1.2 0.3 Tolerance: ±0.1, Unit: ㎜ 0.28 1.6 PCB 0.8 0.8 0.3 Z-Power LED X10490 Technical Data Sheet 5. Outline Dimension 0.8 [Recommended Solder Pattern] 6. Packing Tolerance: ±0.2, Unit: ㎜ (1) Quantity: 4,000pcs./Reel (2) Cumulative Tolerance: Cumulative Tolerance/10pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape: Adhesion strength to be 0.1-0.7N when the over tape is turned off from the carrier tape at 10˚ angle to be the carrier tape. (4) Package: P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Reel # # # # # # # # # # : N / P ## 제 품 명 : SSC-UR101 # # # # # # # # # # o N t o L Z-Power LED X10490 Technical Data Sheet 7. Reel Packing Structure 수 량 : 4000 Aluminum Vinyl Bag # # # # # # # # # # : N / P ## 제 품 명 : SSC-UR101 # # # # # # # # # # o N t o L 수 량 : 4000 Outer Box *Material: Paper(SW3B(B)) SIZE(mm) TYPE a 245 7inch b 220 c 142 c CHIP LED PART : SSC-UR101 CODE : Q 'YT : 40,000EA CHIP LED b a LOT NO : DATE : SEOUL S EM ICON DU CTOR C O.,LTD Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00) Z-Power LED X10490 Technical Data Sheet 8. Precaution for Use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5℃~30℃ Humidity : 60%HR max. (2) Attention after opened However LED is corresponded SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40℃ Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 10-12hr. at 60±5℃. (4) In case of supposed the components is humid, shall be dried dip-solder just before. 100Hr at 80±5℃ or 12Hr at 100±5℃. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall not be avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moisture-proof packing. (14) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice. Rev. 00 November 2007 www.ZLED.com Document No. : SSC-QP-7-07-24 (Rev.00)