SSM2304AGN
N-CHANNEL ENHANCEMENT-MODE POWER MOSFET
Simple drive requirement
D
Lower gate charge
Fast switching characteristics
30V
R DS(ON)
117mΩ
2.5A
ID
S
SOT-23-3
BV DSS
G
Description
D
Advanced Power MOSFETs from Silicon Standard provide the
designer with the best combination of fast switching,
ruggedized device design, low on-resistance and cost-effectiveness.
G
S
The SSM2304AGN is in the SOT-23-3 package, which is widely preferred for
lower power commercial and industrial surface mount applications, and is
well suited for low voltage applications such as DC/DC converters and switches.
RoHS compliant.
Absolute Maximum Ratings
Symbol
Parameter
VDS
Drain-Source Voltage
VGS
Gate-Source Voltage
ID @ TA=25°C
ID @ TA=70°C
Rating
Units
30
V
± 20
V
3
2.5
A
3
2
A
Continuous Drain Current
Continuous Drain Current
1
IDM
Pulsed Drain Current
10
A
PD @ TA=25°C
Total Power Dissipation
1.38
W
Linear Derating Factor
0.01
W/°C
TSTG
Storage Temperature Range
-55 to 150
°C
TJ
Operating Junction Temperature Range
-55 to 150
°C
Thermal Data
Symbol
Rthj-a
3/21/2005 Rev.2.01
Parameter
Thermal Resistance Junction-ambient
3
Max.
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Value
Unit
90
°C/W
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SSM2304AGN
Electrical Characteristics @ T j=25oC (unless otherwise specified)
Symbol
Parameter
Test Conditions
Min.
Typ.
Max. Units
30
-
-
V
BVDSS
Drain-Source Breakdown Voltage
∆ BV DSS/∆ Tj
Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1mA
-
0.1
-
V/°C
RDS(ON)
Static Drain-Source On-Resistance2
VGS=10V, ID=2.5A
-
-
117
mΩ
VGS=4.5V, ID=2A
-
-
190
mΩ
VDS=VGS, ID=250uA
1
-
3
V
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
IDSS
VDS=10V, ID=2.5A
-
2
-
S
o
VDS=30V, VGS=0V
-
-
1
uA
o
Drain-Source Leakage Current (Tj=70 C)
VDS=24V ,VGS=0V
-
-
10
uA
Gate-Source Leakage
VGS=±20V
-
-
±100
nA
ID=2.5A
-
3
5
nC
Drain-Source Leakage Current (Tj=25 C)
IGSS
VGS=0V, ID=250uA
2
Qg
Total Gate Charge
Qgs
Gate-Source Charge
VDS=24V
-
0.8
-
nC
Qgd
Gate-Drain ("Miller") Charge
VGS=4.5V
-
1.8
-
nC
VDS=15V
-
5
-
ns
2
td(on)
Turn-on Delay Time
tr
Rise Time
ID=1A
-
9
-
ns
td(off)
Turn-off Delay Time
RG=3.3Ω , VGS=10V
-
11
-
ns
tf
Fall Time
RD=15Ω
-
2
-
ns
Ciss
Input Capacitance
VGS=0V
-
120
190
pF
Coss
Output Capacitance
VDS=25V
-
62
-
pF
Crss
Reverse Transfer Capacitance
f=1.0MHz
-
24
-
pF
Rg
Gate Resistance
f=1.0MHz
-
1.67
-
Ω
Min.
Typ.
IS=1.2A, VGS=0V
-
-
1.2
V
IS=2A, VGS=0V,
-
24
-
ns
dI/dt=100A/µs
-
23
-
nC
Source-Drain Diode
Symbol
VSD
Parameter
2
Forward On Voltage
2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
Test Conditions
Max. Units
Notes:
1.Pulse width limited by max. junction temperature.
2.Pulse width <300us , duty cycle <2%.
3.Surface mounted on 1 in2 copper pad of FR4 board ; 270°C/W when mounted on min. copper pad.
3/21/2005 Rev.2.01
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SSM2304AGN
12
12
o
T A =150 C
T A =25 o C
10
10V
6.0V
5.0V
8
ID , Drain Current (A)
ID , Drain Current (A)
10
6
4.0V
4
2
10V
6.0V
5.0V
8
6
4.0V
4
V G =3.0V
2
V G =3.0V
0
0
0
1
2
3
4
5
6
7
0
1
2
3
4
5
6
7
V DS , Drain-to-Source Voltage (V)
V DS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
Fig 2. Typical Output Characteristics
140
1.8
I D =2 A
T A =25°C
130
V G =10V
I D =2.5A
1.6
Normalized RDS(ON)
RDS(ON) (mΩ )
120
110
100
90
1.4
1.2
1.0
0.8
80
0.6
70
3
5
7
9
-50
11
0
50
100
150
T j , Junction Temperature ( o C)
VGS , Gate-to-Source Voltage (V)
Fig 3. On-Resistance vs. Gate Voltage
Fig 4. Normalized On-Resistance
2.05
10.00
1.85
1.00
T j =25 o C
VGS(th) (V)
IS (A)
T j =150 o C
1.65
0.10
1.45
0.01
1.25
0.1
0.5
0.9
1.3
V SD , Source-to-Drain Voltage (V)
Fig 5. Forward Characteristic of
Reverse Diode
3/21/2005 Rev.2.01
-50
0
50
100
150
T j , Junction Temperature ( o C)
Fig 6. Gate Threshold Voltage vs.
Junction Temperature
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SSM2304AGN
f=1.0MHz
12
1000
I D =2.5A
V DS =24V
V DS =20V
V DS =15V
8
C (pF)
VGS , Gate to Source Voltage (V)
10
6
C iss
100
C oss
4
C rss
2
10
0
0
1
2
3
4
5
1
6
5
9
13
17
21
25
29
V DS , Drain-to-Source Voltage (V)
Q G , Total Gate Charge (nC)
Fig 7. Gate Charge Characteristics
Fig 8. Typical Capacitance Characteristics
100
1
Normalized Thermal Response (R thja)
Duty factor=0.5
ID (A)
10
1ms
1
10ms
100ms
0.1
o
T A =25 C
Single Pulse
1s
DC
0.2
0.1
0.1
0.05
PDM
t
0.01
0.01
T
Duty factor = t/T
Peak Tj = PDM x Rthja + T a
Single Pulse
Rthja = 270°C/W
0.001
0.01
0.1
1
10
100
0.0001
0.001
0.01
V DS , Drain-to-Source Voltage (V)
Fig 9. Maximum Safe Operating Area
0.1
1
10
100
1000
t , Pulse Width (s)
Fig 10. Effective Transient Thermal Impedance
VG
VDS
90%
QG
4.5V
QGS
QGD
10%
VGS
td(on) tr
td(off)tf
Fig 11. Switching Time Waveform
3/21/2005 Rev.2.01
Charge
Q
Fig 12. Gate Charge Waveform
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SSM2304AGN
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
3/21/2005 Rev.2.01
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