CYStech Electronics Corp. Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 1/6 Small Signal Schottky diode RB751S-40C2 Description Planar silicon Schottky barrier diode encapsulated in a SOD-523 plastic SMD package. Features •Extremely small surface mounting type.(SC-79/SOD523) •Low reverse current and low forward voltage •High reliability Applications Low current rectification and high speed switching Symbol Outline RB751S-40C2 Ordering Information Device RB751S-40C2-0-T5-G Package SOD-523 (Pb-free lead plating and halogen-free package) Shipping 8000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T5 : 8000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name RB751S-40C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 2/6 Absolute Maximum Ratings • Maximum Temperatures Storage Temperature Tstg..................................................................................................... -45~+125°C Junction Temperature Tj .............................................................................................................. +125°C • Maximum Voltages and Currents (Ta=25°C) Peak Reverse Voltage VRM…………………………………………………………………………. 40 V DC Reverse Voltage VR ...................................................................................................................... 30 V Mean Rectifying Current IF ........................................................................................................... 30 mA Peak Forward Surge Current IFSM………………………………….. ……………………………………….200 mA Characteristics (Ta=25°C) Characteristic Forward Voltage VF IF=1mA - Typ - Reverse Leakage Current IR VR=30V - - 0.5 μA Capacitance Between Terminals CT VR=1V, f=1MHz - 2 - pF RB751S-40C2 Symbol Condition Min. Max. Unit 370 mV CYStek Product Specification Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 3/6 CYStech Electronics Corp. Characteristic Curves Forward Current vs Forward Voltage Forward Current Derating Curve 100 M ounting on glass epoxy PCBs 100 Forward Current---I F(mA) Percentage of Rated Forward Current---(%) 120 80 60 40 10 125℃ 1 75℃ 25℃ 0.1 20 - 25℃ 0 0.01 0 25 50 75 100 125 150 0 0.1 0.2 0.3 0.4 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage Capacitance vs Reverse Voltage 0.5 10 T a= 125℃ 10 T a= 75℃ 1 0.1 T a= 25℃ Ta=-25℃ 0.01 Typ. pulse easurement Capacitance between terminals---C T(pF) 100 Reverse Leakage Current---IR(μA) T yp. pulse measurement f=1MHz Ta=25℃ 1 0.001 0 10 20 Reverse Voltage---VR(V) 30 0 2 4 6 8 10 12 14 Reverse Voltage---VR(V) Recommended Footprint RB751S-40C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 4/6 Reel Dimension Carrier Tape Dimension RB751S-40C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 5/6 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 °C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5°C of actual peak temperature(tp) Ramp down rate Time 25 °C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3°C/second max. 3°C/second max. 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds 183°C 60-150 seconds 240 +0/-5 °C 217°C 60-150 seconds 260 +0/-5 °C 10-30 seconds 20-40 seconds 6°C/second max. 6 minutes max. 6°C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. RB751S-40C2 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C345C2 Issued Date : 2003.12.11 Revised Date : 2013.10.16 Page No. : 6/6 SOD-523 Dimension Marking Code : 1 1 2 5 2 Style : Pin 1. Cathode 2. Anode 2-lead SOD-523 Plastic Package CYStek Package Code : C2 *: Typical Millimeters Min. Max. 0.510 0.770 0.500 0.700 0.250 0.350 0.080 0.150 0.750 0.850 DIM A A1 b c D Inches Min. Max. 0.020 0.031 0.020 0.028 0.010 0.014 0.003 0.006 0.030 0.033 DIM Min. E E1 E2 L θ Millimeters Min. Max. 1.100 1.300 1.500 1.700 0.200 REF 0.010 0.070 7° REF Inches Min. Max. 0.043 0.051 0.059 0.067 0.008 REF 0.001 0.003 7° REF Notes: 1.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 2.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: • Lead: Pure tin plated. • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. RB751S-40C2 CYStek Product Specification