TYSEMI WNM3003-3TR

Product specification
WNM3003
N-Channel, 30V, 4.0A, Power MOSFET
V(BR)DSS
Rds(on)
(Ÿ)
0.033@ 10V
30V
0.033@ 10V
0.043 @ 4.5V
SOT-23
D
Descriptions
3
The WNM3003 is N-Channel enhancement MOS
Field Effect Transistor. Uses advanced trench technology
and design to provide excellent RDS
(ON)
with low gate
charge. This device is suitable for use in DC-DC
conversion and power switch applications. Standard
1
2
G
S
Product WNM3003 is Pb-free.
Configuration (Top View)
Features
z
Trench Technology
z
Supper high density cell design
z
Excellent ON resistance for higher DC current
z
Extremely Low Threshold Voltage
z
WT3*
Small package SOT-23
= Device Code
*
= Month (A~Z)
Marking
Applications
Order Information
z
Driver for Relay, Solenoid, Motor, LED etc.
z
DC-DC converter circuit
z
Power Switch
z
Load Switch
z
Charging
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WT3
Device
WNM3003-3/TR
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Package
SOT-23
Shipping
3000/Tape&Reel
1 of 3
Product specification
WNM3003
Absolute Maximum ratings
Parameter
Symbol
10 S
Steady State
Drain-Source Voltage
VDS
30
Gate-Source Voltage
VGS
±20
TA=25°C
Continuous Drain Current a
TA=70°C
TA=25°C
Maximum Power Dissipation a
TA=70°C
TA=25°C
Continuous Drain Current b
TA=70°C
TA=25°C
Maximum Power Dissipation b
TA=70°C
ID
PD
ID
PD
Unit
V
4.0
3.7
3.2
3.0
0.8
0.7
0.5
0.4
3.7
3.4
2.9
2.7
0.7
0.6
0.4
0.3
A
W
A
W
Pulsed Drain Current c
IDM
10
A
Operating Junction Temperature
TJ
150
°C
Lead Temperature
TL
260
°C
Storage Temperature Range
Tstg
-55 to 150
°C
Thermal resistance ratings
Parameter
Junction-to-Ambient Thermal Resistance a
Junction-to-Ambient Thermal Resistance b
Junction-to-Case Thermal Resistance
Symbol
t ” 10 s
Steady State
t ” 10 s
Steady State
Steady State
RșJA
RșJA
Typical
Maximum
120
145
132
168
145
174
158
202
60
75
RșJC
a
Surface mounted on FR4 Board using 1 square inch pad size, 1oz copper
b
Surface mounted on FR4 board using minimum pad size, 1oz copper
c
Repetitive rating, pulse width limited by junction temperature, tp=10μs, Duty Cycle=1%
d
Repetitive rating, pulse width limited by junction temperature TJ=150°C.
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Unit
°C/W
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Product specification
WNM3003
o
Electronics Characteristics (Ta=25 C, unless otherwise noted)
Parameter
Symbol
Test Conditions
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain-to-Source Breakdown Voltage
BVDSS
VGS = 0 V, ID = 250uA
Zero Gate Voltage Drain Current
IDSS
VDS =24 V, VGS = 0V
Gate-to-source Leakage Current
IGSS
VDS = 0 V, VGS = ±20V
VGS(TH)
VGS = VDS, ID = 250uA
30
V
1
uA
±100
nA
1.6
3.0
V
VGS = 10V, ID = 3.1A
33
47
VGS = 10V, ID = 2.5A
33
47
VGS = 4.5V, ID = 2.0A
43
59
VDS = 4.5V, ID = 2.8A
5.8
ON CHARACTERISTICS
Gate Threshold Voltage
Drain-to-source On-resistance
Forward Transconductance
RDS(on)
gFS
1.0
mŸ
S
CHARGES, CAPACITANCES AND GATE RESISTANCE
Input Capacitance
CISS
570
Output Capacitance
COSS
Reverse Transfer Capacitance
CRSS
Total Gate Charge
QG(TOT)
Threshold Gate Charge
QG(TH)
VGS =10 V, VDS =15 V,
0.8
Gate-to-Source Charge
QGS
ID = 3.1A
1.25
Gate-to-Drain Charge
QGD
VGS = 0 V, f = 1.0 MHz, VDS =
pF
72
15 V
64
11.6
nC
3.0
SWITCHING CHARACTERISTICS
Turn-On Delay Time
td(ON)
5
Rise Time
tr
VGS = 10 V, VDS = 15 V,
3.3
Turn-Off Delay Time
td(OFF)
ID=1A, RG=6 Ÿ
39
Fall Time
tf
ns
4.4
BODY DIODE CHARACTERISTICS
Forward Voltage
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VSD
VGS = 0 V, IS = 1.5A
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0.50
0.84
1.50
V
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