June 2004 ZMD-Standard Package SSOP44 (300 mil) MDS 771 Dimensions in millimetres 1 Dimensions View X A A2 X k x 45° 0,1 1 bp e Z HE E 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax 2,64 Amin 2,44 bPmin 0,28 A1min 0,1 bPmax 0,51 A1max 0,3 enom 0,8 A2min 2,14 HEmin 10,11 A2max 2,54 HEmax 10,51 cmin 0,23 LPmin 0,4 cmax 0,32 Zmax 0,51 Dmin* 17,73 Dmax* 17,93 2 Weight ≤ 0,8 g Emin* 7,40 3 Package Body Material Low Stress Epoxy Emax* 7,60 4 Lead Material Cu-Alloy kmin 0,5 5 Lead Finish solder plating θmin 0° 6 Lead Form Z-bends θmax 8° * without mold-flash Zentrum Mikroelektronik Dresden Editor: signed Schoder Date: 4. June 2004 Check: signed Marx Quality: signed Tina Kochan Doc-No. QS-000771-HD-01 θ A1 LP c 44