ETC UT61256


UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
REVISION HISTORY
DESCRIPTION
DATE
May 3 ,2001
Jul 27,2001
Sep 27,2001
Feb 1,2002
Nov 27,2002
Jan 10,2003
Original
Delete STSOP package
Add STSOP package
Revised STSOP package
Add under/overshoot range of VIL & VIH
Add package 28-pin 300 mil skinny PDIP
& Package outline dimension
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.IC
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in
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REVISION
Preliminary Rev. 0.1
Rev. 1.0
Rev. 1.1
Rev. 1.2
Rev. 1.3
Rev. 1.4
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
GENERAL DESCRIPTION
FEATURES
Fast access time : 8/10/12/15 ns (max.)
Low power operating : 80 mA (typical)
Single 5V power supply
All inputs and outputs TTL compatible
Fully static operation
Three state outputs
Package : 28-pin 300 mil SOJ
28-pin 8mm×13.4mm STSOP
28-pin 300 mil skinny PDIP
The UT61256C is a 262,144-bit high-speed
CMOS static random access memory organized
as 32,768 words by 8 bits. It is fabricated using
high performance, high reliability CMOS
technology.
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The UT61256C is designed for high-speed
system applications. It is particularly suited for
use in high-density high-speed system
applications.
The UT61256C operates from a single 5V power
supply and all inputs and outputs are fully TTL
compatible.
32K × 8
MEMORY
ARRAY
er
DECODER
in
A0-A14
.c
FUNCTIONAL BLOCK DIAGRAM
.IC
m
Vcc
Vss
I/O DATA
CIRCUIT
COLUMN I/O
w
w
w
I/O1-I/O8
CE
OE
CONTROL
CIRCUIT
WE
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
PIN CONFIGURATION
1
28
Vcc
A12
2
27
WE
A7
3
26
A6
4
25
A5
5
24
A4
6
23
A11
7
A2
8
OE
1
28
A11
2
27
CE
A9
3
26
I/O8
A8
A8
4
25
I/O7
A9
A13
5
24
I/O6
WE
6
23
I/O5
Vcc
7
22
I/O4
A14
8
21
Vss
A12
9
20
I/O3
A7
10
19
I/O2
A6
11
18
I/O1
17
A0
16
A1
15
A2
A13
22
OE
21
A10
9
A0
10
20
CE
19
I/O8
I/O1
11
18
I/O7
A5
12
I/O2
12
17
I/O6
A4
13
I/O3
13
16
I/O5
A3
14
Vss
14
15
I/O4
SOJ
2
WE
A7
3
26
A13
A6
4
25
A8
A5
5
A4
6
A3
7
A2
8
A1
9
A0
10
24
A9
23
A11
22
OE
21
A10
CE
19
I/O8
11
18
I/O2
12
17
I/O3
13
16
Vss
14
15
I/O7
I/O6
I/O5
I/O4
w
I/O1
.IC
20
in
A12
m
Vcc
27
UT61256C
28
er
STSOP
1
A14
A10
.c
A1
UT61256C
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A3
UT61256C
A14
w
skinny PDIP
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PIN DESCRIPTION
SYMBOL
A0 - A14
I/O1 - I/O8
CE
WE
OE
VCC
VSS
DESCRIPTION
Address Inputs
Data Inputs/Outputs
Chip Enable Input
Write Enable Input
Output Enable Input
Power Supply
Ground
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
ABSOLUTE MAXIMUM RATINGS*
PARAMETER
Terminal Voltage with Respect to Vss
Operating Temperature
Storage Temperature
Power Dissipation
DC Output Current
Soldering Temperature (under 10 sec)
SYMBOL
VTERM
TA
TSTG
PD
IOUT
Tsolder
RATING
-0.5 to +6.5
0 to +70
-65 to +150
1
50
260
UNIT
V
℃
℃
W
mA
℃
TRUTH TABLE
I/O OPERATION
WE
X
H
H
L
High - Z
High - Z
DOUT
DIN
SUPPLY CURRENT
ISB,ISB1
ICC
ICC
ICC
.c
Standby
Output Disable
Read
Write
OE
X
H
L
X
CE
H
L
L
L
er
MODE
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*Stress greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to the absolute maximum rating conditions for extended period may
affect device reliability.
Note: H = VIH, L=VIL, X = Don't care.
Output Leakage Current
m
w
Operating Power
Supply Current
Standby Current (TTL)
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ISB
VSS ≦VI/O ≦VCC
CE =VIH or OE =VIH or WE =VIL
IOH = - 4mA
IOL = 8mA
- 8
Cycle time=Min.
- 10
- 12
CE = VIL , II/O = 0mA
- 15
CE = VIH
ISB1
CE ≧VCC-0.2V
ILO
VOH
VOL
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Output High Voltage
Output Low Voltage
SYMBOL TEST CONDITION
VIH
VIL
ILI
VSS ≦VIN ≦VCC
.IC
PARAMETER
Input High Voltage
Input Low Voltage
Input Leakage Current
in
DC ELECTRICAL CHARACTERISTICS (VCC = 5V± 10%, TA = 0℃ to 70℃)
Standby Current (CMOS)
ICC
MIN.
2.2
- 0.5
-1
MAX.
VCC+0.5
0.8
1
UNIT
V
V
µA
-1
1
µA
2.4
-
0.4
190
180
160
140
30
V
V
mA
mA
mA
mA
mA
-
5
mA
Notes:
1. Overshoot : Vcc+2.0v for pulse width less than 6ns.
2. Undershoot : Vss-2.0v for pulse width less than 6ns.
3. Overshoot and Undershoot are sampled, not 100% tested.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
CAPACITANCE (TA=25℃, f=1.0MHz)
PARAMETER
Input Capacitance
Input/Output Capacitance
SYMBOL
CIN
CI/O
MIN.
MAX.
8
10
-
UNIT
pF
pF
Note : These parameters are guaranteed by device characterization, but not production tested.
AC TEST CONDITIONS
0V to 3.0V
3ns
1.5V
CL=30pF, IOH/IOL=-4mA/8mA
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Input Pulse Levels
Input Rise and Fall Times
Input and Output Timing Reference Levels
Output Load
AC ELECTRICAL CHARACTERISTICS (VCC = 5V± 10% , TA = 0℃ to 70℃)
(1) READ CYCLE
.IC
(2) WRITE CYCLE
PARAMETER
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w
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Write Cycle Time
Address Valid to End of Write
Chip Enable to End of Write
Address Set-up Time
Write Pulse Width
Write Recovery Time
Data to Write Time Overlap
Data Hold from End of Write Time
Output Active from End of Write
Write to Output in High Z
SYMBOL
tWC
tAW
tCW
tAS
tWP
tWR
tDW
tDH
tOW*
tWHZ*
8
8
4
4
4
-
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8
2
0
3
10
2
0
3
10
10
5
5
5
-
12
3
0
3
er
tRC
tAA
tACE
tOE
tCLZ*
tOLZ*
tCHZ*
tOHZ*
tOH
UT61256C UT61256C UT61256C UT61256C
-8
-10
-12
-15
UNIT
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
in
Read Cycle Time
Address Access Time
Chip Enable Access Time
Output Enable Access Time
Chip Enable to Output in Low Z
Output Enable to Output in Low Z
Chip Disable to Output in High Z
Output Disable to Output in High Z
Output Hold from Address Change
SYMBOL
m
PARAMETER
12
12
6
6
6
-
15
4
0
3
15
15
7
7
7
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
UT61256C UT61256C UT61256C UT61256C
-8
-10
-12
-15
UNIT
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
8
6.5
6.5
0
6.5
0
5
0
1.5
5
-
10
8
8
0
8
0
6
0
2
-
6
12
10
10
0
9
0
7
0
3
-
7
15
12
12
0
10
0
8
0
4
-
8
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
*These parameters are guaranteed by device characterization, but not production tested.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
TIMING WAVEFORMS
READ CYCLE 1 (Address Controlled)
(1,2,4)
tRC
Address
tAA
tOH
DOUT
Data Valid
RC
er
t
m
CE
.IC
OE
t CLZ
HIGH-Z
t OE
t
t OLZ
t CHZ
t OHZ
OH
HIGH-Z
Data Valid
w
Dout
in
Address
t AA
t ACE
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READ CYCLE 2 ( CE and OE Controlled) (1,3,5,6)
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tOH
w
Notes :
1. WE is HIGH for read cycle.
2. Device is continuously selected CE =VIL.
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3. Address must be valid prior to or coincident with CE transition; otherwise tAA is the limiting parameter.
4. OE is LOW.
5. tCLZ, tOLZ, tCHZ and tOHZ are specified with CL = 5pF. Transition is measured ± 500mV from steady state.
6. At any given temperature and voltage condition, tCHZ is less than tCLZ, tOHZ is less than tOLZ.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
WRITE CYCLE 1 ( WE
Controlled) (1,2,3,5,6)
t
WC
Address
t
AW
CE
t
CW
t
AS
t
WE
t
Dout
WR
WP
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t
t
WHZ
High-Z
(4)
t
t
(4)
DH
.c
Din
DW
OW
WRITE CYCLE 2 ( CE Controlled) (1,2,5)
t WC
in
Address
er
Data Valid
CE
t CW
.IC
t AS
m
t AW
WE
t WR
t WP
t WHZ
1.
Data Valid
w
Notes :
t DH
t DW
w
Din
High-Z
w
Dout
WE and CE must be HIGH during all address transitions.
2. A write occurs during the overlap of a low CE and a low WE .
3. During a WE controlled with write cycle with OE LOW, tWP must be greater than tWHZ+tDW to allow the drivers to turn off
and data to be placed on the bus.
4. During this period, I/O pins are in the output state, and input singals must not be applied.
5. If the CE low transition occurs simultaneously with or after WE low transition, the outputs remain in a high impedance state.
6. tOW and tWHZ are specified with CL = 5pF. Transition is measured ± 500mV from steady state.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
PACKAGE OUTLINE DIMENSION
15
1
14
.c
28
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28 pin 300 mil SOJ Package Outline Dimension
.IC
m
in
er
A2
X
XX
Note:
w
w
w
CL
1. S/E/D DIM NOT INCLUDEING MOLD FLASH.
2. THE END FLASH IN PACKAGE LENGTHWISE IS
NOT MORE THAN 10 MILS EACH SIDE
UNIT
SYMBOL
A
A1
A2
B
B1
c
D
E
E1
e
L
S
Y
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
INCH(REF)
0.140 (MAX)
0.026 (MIN)
0.100± 0.005
0.018± 0.003
0.028 ± 0.003
0.010± 0.003
0.710± 0.010
0.337± 0.010
0.300± 0.005
0.050± 0.003
0.087± 0.010
0.030± 0.004
0.003 (MAX)
MM(BASE)
3.556 (MAX)
0.660 (MIN)
2.540± 0.127
0.457± 0.076
0.711± 0.076
0.254± 0.076
18.03± 0.254
8.560± 0.254
7.620± 0.127
1.270± 0.076
2.210± 0.254
0.762± 0.102
0.076 (MAX)
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
28 pin 8x13.4mm STSOP Package Outline Dimension
HD
cL
12° (2x)
28
14
15
12° (2x)
om
b
E
e
1
"A"
Seating Plane
y
.c
D
0.254
c
GAUGE PLANE
1
0
SEATING PLANE
12° (2X)
L
"A" DATAIL VIEW
L1
DIMENSIONS IN INCHES
MIN
NOM
MAX
0.040
0.043
0.047
0.002
0.006
0.036
0.039
0.041
0.007
0.009
0.011
0.004
0.006
0.008
0.520
0.528
0.535
0.461
0.465
0.469
0.311
0.315
0.319
0.0216
0.012
0.020
0.028
0.027
0.000
0.003
o
o
o
5
3
0
w
w
A
A1
A2
b
c
HD
D
E
e
L
L1
Y
Θ
DIMENSIONS IN MILLIMETERS
MIN
NOM
MAX
1.00
1.10
1.20
0.05
0.15
0.91
1.00
1.05
0.17
0.22
0.27
0.10
0.15
0.20
13.20
13.40
13.60
11.70
11.80
11.90
7.90
8.00
8.10
0.55
0.30
0.50
0.70
0.675
0.00
0.076
o
o
o
5
3
0
w
SYMBOLS
.IC
28
A1
m
in
A
15
A2
14
er
12° (2X)
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
PACKAGE OUTLINE DIMENSION
.IC
m
in
er
.c
om
28 pin 300 mil skinny PDIP Package Outline Dimension
UNIT
SYMBOL
w
w
w
A
A1
A2
D
E
E1
L
eB
Θ°
MIN
0.015
0.125
1.385
NOR.
0.130
1.390
0.310 BSC
0.288
0.130
0.350
7
0.283
0.115
0.330
0
MAX
0.210
0.135
1.400
0.293
0.150
0.370
15
Note:
1. JEDEC OUTLINE:N / A
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
ORDERING INFORMATION
PACKAGE
28 PIN SOJ
28 PIN SOJ
28 PIN SOJ
28 PIN SOJ
28 PIN STSOP
28 PIN STSOP
28 PIN STSOP
28 PIN STSOP
28 PIN SKINNY PDIP
28 PIN SKINNY PDIP
28 PIN SKINNY PDIP
28 PIN SKINNY PDIP
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ACCESS TIME (ns)
8
10
12
15
8
10
12
15
8
10
12
15
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.IC
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PART NO.
UT61256CJC-8
UT61256CJC-10
UT61256CJC-12
UT61256CJC-15
UT61256CLS-8
UT61256CLS-10
UT61256CLS-12
UT61256CLS-15
UT61256CKC-8
UT61256CKC-10
UT61256CKC-12
UT61256CKC-15
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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
UTRON
UT61256C
32K X 8 BIT HIGH SPEED CMOS SRAM
Rev. 1.4
w
w
w
.IC
m
in
er
.c
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THIS PAGE IS LEFT BLANK INTENTIONALLY.
UTRON TECHNOLOGY INC.
1F, No. 11, R&D Rd. II, Science-Based Industrial Park, Hsinchu, Taiwan, R. O. C.
TEL: 886-3-5777882 FAX: 886-3-5777919
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