Spec. No. : C306S6R Issued Date : 2003.09.12 Revised Date : 2006.01.19 Page No. : 1/5 CYStech Electronics Corp. General Purpose PNP Epitaxial Planar Transistors (dual transistors) HBP1037S6R Features • Two BTA1037 chips in a SOT-363R package. • Mounting possible with SOT-323 automatic mounting machines. • Transistor elements are independent, eliminating interference. • Mounting cost and area can be cut in half. • Excellent hFE linearity • Complementary to HBN2412S6R. • Pb-free package Equivalent Circuit Outline HBP1037S6R Tr1 SOT-363R Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current Power Dissipation Junction Temperature Storage Temperature Symbol VCBO VCEO VEBO IC Pd Tj Tstg Limits -60 -50 -6 -150 200(total) 150 -55~+150 Unit *1 V V V mA mW °C °C Note : *1 150mW per element must not be exceeded HBP1037S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C306S6R Issued Date : 2003.09.12 Revised Date : 2006.01.19 Page No. : 2/5 Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *hFE fT Cob Min. -60 -50 -6 200 80 - Typ. -0.2 180 2 Max. -0.1 -0.1 -0.5 560 3.5 Unit V V V µA µA V MHz pF Test Conditions IC=-50µA IC=-1mA IE=-50µA VCB=-60V VEB=-6V IC=-50mA, IB=-5mA VCE=-6V, IC=-1mA VCE=-10V, IC=-1mA, f=100MHz VCB=-10V, f=1MHz *Pulse Test: Pulse Width ≤380µs, Duty Cycle≤2% Ordering Information Device HBP1037S6R HBP1037S6R Package SOT-363 (Pb-free) Shipping Marking 3000 pcs / Tape & Reel A2 CYStek Product Specification Spec. No. : C306S6R Issued Date : 2003.09.12 Revised Date : 2006.01.19 Page No. : 3/5 CYStech Electronics Corp. Characteristic Curves Current Gain vs Collector Current Saturation Voltage vs Collector Current 1000 1000 Saturation Voltage---(mV) Current Gain---HFE HFE@VCE=6V 100 VCE(SAT)@IC=10IB 100 10 10 0.1 1 10 100 0.1 1000 10 100 1000 Collector Current---IC(mA) Collector Current---IC(mA) Saturation Voltage vs Collector Current Cutoff Frequency vs Collector Current 1 Cutoff Frequency---FT(GHZ) 10000 Saturation Voltage---(mV) 1 VBE(SAT)@IC=10IB 1000 FT@VCE=12V 0.1 100 0.1 1 10 100 Collector Current---IC(mA) 1000 1 10 100 Collector Current---IC(mA) Power Derating Curves Power Dissipation---PD(mW) 250 dual 200 150 single 100 50 0 0 HBP1037S6R 50 100 150 Ambient Temperature --- Ta(℃ ) 200 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2005.11.30 Page No. : 4/5 Reel Dimension Carrier Tape Dimension HBN2412S6R CYStek Product Specification CYStech Electronics Corp. Spec. No. : C202S6R Issued Date : 2003.06.11 Revised Date : 2005.11.30 Page No. : 5/5 SOT-363R Dimension Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Marking: A2 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R *:Typical Inches Min. Max. 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026BSC 0.004 DIM A B C D G H Millimeters Min. Max. 1.8 2.2 1.15 1.35 0.8 1.1 0.1 0.3 0.65BSC 0.1 DIM J K N S Y Inches Min. Max. 0.004 0.010 0.004 0.012 0.008 REF 0.079 0.087 0.012 0.016 Millimeters Min. Max. 0.1 0.25 0.1 0.30 0.20 REF 2.00 2.40 0.30 0.40 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. HBN2412S6R CYStek Product Specification