PH8030L N-channel TrenchMOS logic level FET Rev. 01 — 6 February 2006 Product data sheet 1. Product profile 1.1 General description Logic level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. 1.2 Features ■ Optimized for use in DC-to-DC converters ■ Logic level compatible ■ Very low switching and conduction losses ■ Lead-free package 1.3 Applications ■ DC-to-DC converters ■ Voltage regulators ■ Switched-mode power supplies ■ Notebook computers 1.4 Quick reference data ■ VDS ≤ 30 V ■ RDSon ≤ 5.9 mΩ ■ ID ≤ 76.7 A ■ QGD = 3.1 nC (typ) 2. Pinning information Table 1: Pinning Pin Description 1, 2, 3 source (S) 4 gate (G) mb mounting base; connected to drain (D) Simplified outline Symbol D mb G mbb076 1 2 3 4 SOT669 (LFPAK) S PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 3. Ordering information Table 2: Ordering information Type number PH8030L Package Name Description Version LFPAK plastic single-ended surface mounted package (LFPAK); 4 leads SOT669 4. Limiting values Table 3: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage 25 °C ≤ Tj ≤ 150 °C - 30 V VDGR drain-gate voltage (DC) 25 °C ≤ Tj ≤ 150 °C; RGS = 20 kΩ - 30 V VGS gate-source voltage - ±20 V ID drain current Tmb = 25 °C; VGS = 10 V; see Figure 2 and 3 - 76.7 A Tmb = 100 °C; VGS = 10 V; see Figure 2 - 48.5 A IDM peak drain current Tmb = 25 °C; pulsed; tp ≤ 10 µs; see Figure 3 - 300 A Ptot total power dissipation Tmb = 25 °C; see Figure 1 - 62.5 W Tstg storage temperature −55 +150 °C Tj junction temperature −55 +150 °C Source-drain diode IS source current Tmb = 25 °C - 52 A ISM peak source current Tmb = 25 °C; pulsed; tp ≤ 10 µs - 208 A unclamped inductive load; ID = 31 A; tp = 0.14 ms; VDS ≤ 30 V; RGS = 50 Ω; VGS = 10 V; starting at Tj = 25 °C - 95 mJ Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 2 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 03aa15 120 03aa23 120 Pder Ider (%) (%) 80 80 40 40 0 0 0 50 100 50 0 200 150 100 150 Tmb (°C) P tot P der = ------------------------ × 100 % P ° ID I der = --------------------- × 100 % I ° tot ( 25 C ) D ( 25 C ) Fig 1. Normalized total power dissipation as a function of mounting base temperature Fig 2. Normalized continuous drain current as a function of mounting base temperature 003aab245 103 ID (A) 200 Tmb (°C) Limit RDSon = VDS / ID tp = 10 µ s 102 100 µ s 1 ms 10 10 ms 100 ms DC 1 10-1 10-1 1 10 VDS (V) 102 Tmb = 25 °C; IDM is single pulse Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 3 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 5. Thermal characteristics Table 4: Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to mounting base see Figure 4 Rth(j-mb) Min Typ Max Unit - - 2 K/W 003aab246 10 Zth(j-mb) (K/W) 1 δ = 0.5 0.2 0.1 10-1 0.05 0.02 δ= P tp T single pulse t tp T 10-2 10-5 10-4 10-3 10-2 10-1 1 tp (s) 10 Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 4 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 6. Characteristics Table 5: Characteristics Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Tj = 25 °C 30 - - V Tj = −55 °C 27 - - V Static characteristics V(BR)DSS drain-source breakdown voltage VGS(th) IDSS gate-source threshold voltage drain leakage current ID = 250 µA; VGS = 0 V ID = 1 mA; VDS = VGS; see Figure 9 and 10 Tj = 25 °C 1.3 1.7 2.15 V Tj = 150 °C 0.8 - - V Tj = −55 °C - - 2.6 V VDS = 30 V; VGS = 0 V Tj = 25 °C - - 1 µA Tj = 150 °C - - 100 µA IGSS gate leakage current VGS = ±16 V; VDS = 0 V - - 100 nA RG gate resistance f = 1 MHz - 1.75 - Ω RDSon drain-source on-state resistance VGS = 10 V; ID = 25 A; see Figure 6 and 8 Tj = 25 °C - 4.7 5.9 mΩ Tj = 150 °C - 8.5 10.6 mΩ VGS = 4.5 V; ID = 25 A; see Figure 6 and 8 - 7.3 9.7 mΩ ID = 25 A; VDS = 12 V; VGS = 4.5 V; see Figure 11 and 12 - 15.2 - nC - 8.5 - nC Dynamic characteristics QG(tot) total gate charge QGS gate-source charge QGS1 pre-VGS(th) gate-source charge - 4.1 - nC QGS2 post-VGS(th) gate-source charge - 4.4 - nC QGD gate-drain charge - 3.1 - nC VGS(pl) gate-source plateau voltage - 3.5 - V QG(tot) total gate charge ID = 0 A; VDS = 0 V; VGS = 4.5 V - 14 - nC VGS = 0 V; VDS = 12 V; f = 1 MHz; see Figure 14 - 2260 - pF - 460 - pF - 210 - pF 2540 - pF Ciss input capacitance Coss output capacitance Crss reverse transfer capacitance Ciss input capacitance VGS = 0 V; VDS = 0 V; f = 1 MHz - VDS = 12 V; RL = 0.5 Ω; VGS = 4.5 V; RG = 5.6 Ω - 25 - ns - 53 - ns td(on) turn-on delay time tr rise time td(off) turn-off delay time - 27 - ns tf fall time - 14 - ns Source-drain diode VSD source-drain voltage IS = 25 A; VGS = 0 V; see Figure 13 - 0.85 1.2 V trr reverse recovery time IS = 20 A; dIS/dt = −100 A/µs; VGS = 0 V - 34 - ns Qr recovered charge - 11.5 - nC PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 5 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 003aab247 100 VGS (V) = 10 ID (A) 80 6 5 4.5 003aab248 16 3.2 RDSon (mΩ) 4 3.4 3.6 12 VGS (V) = 4 60 3.6 4.5 8 5 6 3.4 40 3.2 20 10 4 3 2.8 0 0 0 0.2 0.4 0.6 VDS (V) 0.8 0 Tj = 25 °C 20 40 60 80 ID (A) 100 Tj = 25 °C Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values Fig 6. Drain-source on-state resistance as a function of drain current; typical values 003aab249 100 ID (A) 003aab273 2 a 80 1.6 60 1.2 40 0.8 20 Tj = 150 °C 0.4 25 °C 0 0 1 2 3 4 VGS (V) 5 Tj = 25 °C and 150 °C; VDS > ID × RDSon 0 -60 60 120 Tj (°C) 180 R DSon a = ----------------------------R DSon ( 25 °C ) Fig 7. Transfer characteristics: drain current as a function of gate-source voltage; typical values Fig 8. Normalized drain-source on-state resistance factor as a function of junction temperature PH8030L_1 Product data sheet 0 © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 6 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 003aab272 3 VGS(th) (V) 2.5 003aab271 10-3 ID (A) max 10-4 2 min typ 1.5 typ max min 10-5 1 0.5 0 -60 10-6 0 60 120 Tj (°C) 180 0 0.5 1 1.5 2 VGS (V) 2.5 Tj = 25 °C; VDS = 5 V ID = 1 mA; VDS = VGS Fig 9. Gate-source threshold voltage as a function of junction temperature Fig 10. Sub-threshold drain current as a function of gate-source voltage 003aab250 10 ID = 25 A Tj = 25 °C VGS (V) 8 VDS 12 V VDS = 19 V ID 6 VGS(pl) 4 VGS(th) VGS 2 QGS1 QGS2 QGS 0 0 10 20 30 QG (nC) 40 QGD QG(tot) 003aaa508 ID = 25 A; VDS = 12 V and 19 V Fig 11. Gate-source voltage as a function of gate charge; typical values Fig 12. Gate charge waveform definitions PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 7 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 003aab251 100 IS (A) 003aab252 104 C (pF) 80 Ciss 60 103 40 Coss Tj = 25 °C 150 °C 20 Crss 0 0.2 10 0.4 0.6 0.8 1 VSD (V) 1.2 Tj = 25 °C and 150 °C; VGS = 0 V 2 10-1 1 10 VDS (V) 102 VGS = 0 V; f = 1 MHz Fig 13. Source current as a function of source-drain voltage; typical values Fig 14. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 003aab253 104 C (pF) Ciss Crss 103 102 10-1 1 VGS (V) 10 VDS = 0 V; f = 1 MHz Fig 15. Input and reverse transfer capacitances as a function of gate-source voltage; typical values PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 8 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 7. Package outline Plastic single-ended surface mounted package (LFPAK); 4 leads A2 A E SOT669 C c2 b2 E1 b3 L1 mounting base b4 D1 D H L2 1 2 3 e 4 w M A b X c 1/2 e A (A 3) A1 C θ L detail X y C 0 2.5 5 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A1 A2 A3 b b2 1.20 0.15 1.10 0.50 4.41 0.25 1.01 0.00 0.95 0.35 3.62 b3 b4 2.2 2.0 0.9 0.7 c D (1) c2 D1(1) E(1) E1(1) max 0.25 0.30 4.10 4.20 0.19 0.24 3.80 5.0 4.8 3.3 3.1 e H L L1 L2 w y θ 1.27 6.2 5.8 0.85 0.40 1.3 0.8 1.3 0.8 0.25 0.1 8° 0° Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT669 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 03-09-15 04-10-13 MO-235 Fig 16. Package outline SOT669 (LFPAK) PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 9 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 8. Revision history Table 6: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes PH8030L_1 20060206 Product data sheet - - - PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 10 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 9. Data sheet status Level Data sheet status [1] Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). [1] Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 10. Definitions customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Right to make changes — Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 12. Trademarks Notice — All referenced brands, product names, service names and trademarks are the property of their respective owners. TrenchMOS — is a trademark of Koninklijke Philips Electronics N.V. 11. Disclaimers Life support — These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors 13. Contact information For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: [email protected] PH8030L_1 Product data sheet © Koninklijke Philips Electronics N.V. 2006. All rights reserved. Rev. 01 — 6 February 2006 11 of 12 PH8030L Philips Semiconductors N-channel TrenchMOS logic level FET 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 5 6 7 8 9 10 11 12 13 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 11 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Contact information . . . . . . . . . . . . . . . . . . . . 11 © Koninklijke Philips Electronics N.V. 2006 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 6 February 2006 Document number: PH8030L_1 Published in The Netherlands