PANASONICBATTERY 2SK3892

This product complies with the RoHS Directive (EU 2002/95/EC).
Power MOSFETs
2SK3892
Silicon N-channel power MOSFET
For contactless relay, diving circuit for a solenoid,
driving circuit for a motor, control equipment and
switching power supply
 Package

Code
TO-220D-A1

Pin Name
1: Gate
2: Drain
3: Source
 Features
 Absolute Maximum Ratings TC = 25°C
Parameter
Symbol
Drain-source surrender voltage
VDSS
Gate-source surrender voltage
VGSS
Drain current
ID
Peak drain current
IDP
Avalanche energy capability *
Drain power dissipation
EAS
PD
Ta = 25°C
Junction temperature
Tj
Storage temperature
Tstg
Note) *: L = 2.67 mH, IL = 22 A, VDD = 50 V, 1 pulse
Rating
Unit
200
V
±30
V
22
A
88
A
986
mJ
40
W
2.0
W
150
°C
–55 to +150
°C
 Marking Symbol: K3892
 Internal Connection
D
G
S
on
tin
ue
 Electrical Characteristics TC = 25°C±3°C
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 Gate-source surrender voltage VGSS : ± 30 guaranteed
 Avalanche energy capacity guaranteed: EAS > 986 mJ
 High-speed switching: tf = 39 ns
Parameter
Symbol
ce
/D
Drain-source cutoff current
en
int
Gate threshold voltage
an
Gate-source cutoff current
Typ
Max
IDSS
VDS = 160 V, VGS = 0
10
mA
VGS = ±30 V, VDS = 0
±1.0
mA
4.5
V
62
mW
IGSS
Vth
VDS = 10 V, ID = 1.0 mA
RDS(on)
VGS = 10 V, ID = 11.0 A
Forward transfer admittance
Yfs
VDS = 10 V, ID = 11.0 A
200
Unit
ID = 1 mA, VGS = 0
Drain-source ON resistance
Ma
Min
VDSS
isc
Drain-source surrender voltage
Conditions
2.5
48
7
V
15
S
3 177
pF
456
pF
Short-circuit input capacitance
(Common source)
Ciss
Short-circuit output capacitance
(Common source)
Coss
Reverse transfer capacitance
(Common source)
Crss
41
pF
Turn-on delay time
td(on)
54
ns
60
ns
194
ns
39
ns
Rise time
Turn-off delay time
Fall time
tr
td(off)
VDS = 25 V, VGS = 0, f = 1 MHz
VDD = 100 V, ID = 11.0 A
RL = 9.1 W, VGS = 10 V
tf
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
Publication date: January 2009
SJG00043BED
1
This product complies with the RoHS Directive (EU 2002/95/EC).
2SK3892
 Electrical Characteristics (continued) TC = 25°C±3°C
Parameter
Symbol
Diode forward voltage
VDSF
Reverse recovery time
trr
Reverse recovery charge
Qrr
Gate charge load
Qg
Gate-source charge
Qgs
Gate-drain charge
Qgd
Conditions
Min
Typ
IDR = 22 A, VGS = 0
L = 230 mH, VDD = 100 V
IDR = 11.0 A, di / dt = 100 A/ms
VDD = 100 V, ID = 11.0 A, VGS = 10 V
Max
Unit
-1.5
V
127
ns
756
nC
50
nC
12
nC
18
nC
Rth(ch-c)
3.13
°C/W
Thermal resistance (ch-a)
Rth(ch-a)
62.5
°C/W
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Thermal resistance (ch-c)
Ma
int
en
an
ce
/D
isc
on
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ue
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Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2
SJG00043BED
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13.7 ±0.2
4.2 ±0.2
15.0 ±0.5
φ3.2 ±0.1
1.4 ±0.2
1.6 ±0.2
0.8 ±0.1
2.54 ±0.3
1
2
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3.0 ±0.5
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This product complies with the RoHS Directive (EU 2002/95/EC).
2SK3892
TO-220D-A1
Unit: mm
4.6 ±0.2
9.9 ±0.3
SJG00043BED
2.9 ±0.2
2.6 ±0.1
0.40 ±0.05
5.08 ±0.5
3
3
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any
other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any
other company which may arise as a result of the use of technical information described in this book.
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(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
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(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company.
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20080805