VISHAY S593TR

Not for new design, this product will be obsoleted soon
S593T/S593TR/S593TRW
Vishay Semiconductors
MOSMIC® for TV-Tuner Prestage with 5 V Supply Voltage
2
1
Comments
MOSMIC - MOS Monolithic Integrated Circuit
Features
•
•
•
•
•
•
•
•
•
SOT143
3
Integrated gate protection diodes
Low noise figure
e3
High gain
Biasing network on chip
Improved cross modulation at gain reduction
High AGC-range
SMD package
Lead (Pb)-free component
Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
4
2
1
SOT143R
4
3
1
2
SOT343R
4
3
19216
Electrostatic sensitive device.
Observe precautions for handling.
Applications
Mechanical Data
Low noise gain controlled input stages in UHF-and
VHF- tuner with 5 V supply voltage.
Typ: S593T
Case: SOT-143 Plastic case
Weight: approx. 8.0 mg
Pinning: 1 = Source, 2 = Drain,
3 = Gate 2, 4 = Gate 1
Typ: S593TR
Case: SOT-143R Plastic case
Weight: approx. 8.0 mg
Pinning: 1 = Source, 2 = Drain,
3 = Gate 2, 4 = Gate 1
Typ: S593TRW
Case: SOT-343R Plastic case
Weight: approx. 6.0 mg
Pinning: 1 = Source, 2 = Drain,
3 = Gate 2, 4 = Gate 1
Typical Application
RFC
C block
AGC
VDD(VDS)
D
G2
RF out
RF in
G1
C block
Document Number 85047
Rev. 1.6, 08-Sep-08
S
C block
94 9296
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S593T/S593TR/S593TRW
Vishay Semiconductors
Parts Table
Part
Marking
Package
S593T
593
SOT-143
S593TR
93R
SOT-143R
S593TRW
W93
SOT-343R
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Test condition
Symbol
Value
VDS
8
V
ID
30
mA
± IG1/G2SM
10
mA
Drain - source voltage
Drain current
Gate 1/Gate 2 - source peak
current
Gate 1/Gate 2 - source voltage
Total power dissipation
Unit
± VG1/G2SM
6
V
Ptot
200
mW
Tamb ≤ 60 °C
Channel temperature
TCh
150
°C
Storage temperature range
Tstg
- 55 to + 150
°C
Symbol
Value
Unit
RthChA
450
K/W
Maximum Thermal Resistance
Parameter
Channel ambient
1)
Test condition
1)
on glass fibre printed board (25 x 20 x 1.5) mm3 plated with 35 μm Cu
Electrical DC Characteristics
Tamb = 25 °C, unless otherwise specified
Max
Unit
Gate 1 - source breakdown
voltage
Parameter
± IG1S = 10 mA, VG2S = VDS = 0 ± V(BR)G1SS
Test condition
7
10
V
Gate 2 - source breakdown
voltage
± IG2S = 10 mA, VG1S = VDS = 0 ± V(BR)G2SS
7
10
V
+ IG1SS
50
μA
- VG1S = 5 V, VG2S = VDS = 0
- IG1SS
100
μA
Gate 2 - source leakage current ± VG2S = 5 V, VG1S = VDS = 0
± IG2SS
20
nA
500
μA
18
mA
Gate 1 - source leakage current + VG1S = 5 V, VG2S = VDS = 0
Drain current
VDS = 5 V, VG1S = 0, VG2S = 4 V
Symbol
Min
IDSS
50
9
Self-biased operating current
VDS = 5 V, VG1S = nc, VG2S = 4 V
IDSP
Gate 2 - source cut-off voltage
VDS = 5 V, VG1S = nc, ID = 20 μA
VG2S(OFF)
Typ.
13
1.0
V
Caution for Gate 1 switch-off mode:
No external DC-voltage on Gate 1 in active mode!
Switch-off at Gate 1 with VG1S < 0.7 V is feasible.
Using open collector switching transistor (inside of PLL), insert 10 kΩ collector resistor.
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Document Number 85047
Rev. 1.6, 08-Sep-08
S593T/S593TR/S593TRW
Vishay Semiconductors
Electrical AC Characteristics
Tamb = 25 °C, unless otherwise specified
VDS = 5 V, VG2S = 4 V, ID= IDSP , f = 1 MHz
Symbol
Min
Typ.
Max
Unit
Forward transadmittance
Parameter
Test condition
|y21s|
35
40
50
mS
Gate 1 input capacitance
Cissg1
3.2
pF
Feedback capacitance
Crss
30
fF
Output capacitance
Coss
1.5
pF
GS = 2 mS, GL = 0.5 mS,
f = 200 MHz
Gps
28
dB
GS = 3,3 mS, GL = 1 mS,
f = 800 MHz
Gps
20
23
dB
ΔGps
40
Power gain
AGC range
VG2S = 1 to 4 V, f = 800 MHz
dB
Noise figure
GS = 2 mS, GL = 0.5 mS,
f = 200 MHz
F
1
dB
GS = 3.3 mS, GL = 1 mS,
f = 800 MHz
F
1.3
dB
Common Emitter S-Parameters
f/MHz
S11
S21
LOG
MAG
ANG
50
-0.02
100
150
S12
LOG
MAG
ANG
-6.1
11.83
-0.06
-12.3
-0.17
-18.2
200
-0.29
250
300
S22
LOG
MAG
ANG
LOG
MAG
ANG
172.1
-61.74
89.0
-0.07
-3.0
11.72
163.6
11.53
154.8
-55.68
87.3
-0.10
-6.0
-52.35
86.2
-0.15
-23.9
11.35
-8.8
146.8
-50.26
86.0
-0.19
-11.8
-0.41
-29.7
-0.59
-35.1
11.10
138.4
-48.69
86.2
-0.26
-14.7
10.83
130.7
-47.51
87.6
-0.33
350
-0.75
-17.3
-40.5
10.50
123.3
-46.72
89.9
-0.38
400
-20.0
-0.92
-45.7
10.18
115.6
-45.95
93.1
-0.47
-22.6
450
-1.10
-50.6
9.82
108.8
-45.27
97.4
-0.53
-27.6
500
-1.30
-55.5
9.51
101.8
-44.56
102.7
-0.60
-30.2
550
-1.46
-60.2
9.19
95.1
-43.72
109.4
-0.65
-33.1
600
-1.63
-64.9
8.78
88.2
-42.33
114.3
-0.72
-35.1
650
-1.79
-69.1
8.47
82.4
-41.42
116.7
-0.78
-37.6
700
-1.94
-73.5
8.14
76.1
-40.50
121.0
-0.82
-40.3
750
-2.12
-77.6
7.89
70.0
-39.46
125.4
-0.84
-42.8
800
-2.23
-81.7
7.56
63.7
-38.31
128.9
-0.87
-45.5
850
-2.37
-85.9
7.29
57.3
-37.06
131.4
-0.91
-48.2
900
-2.45
-89.8
6.93
50.6
-35.80
132.9
-0.97
-51.0
950
-2.56
-93.9
6.60
44.0
-34.52
132.4
-1.03
-54.1
1000
-2.70
-97.8
6.26
38.4
-33.56
131.2
-1.04
-56.8
1050
-2.81
-101.6
5.95
32.4
-32.82
131.0
-1.07
-59.3
1100
-2.92
-105.2
5.61
26.0
-32.10
131.9
-1.16
-59.3
1150
-3.02
-108.7
5.36
18.9
-31.19
132.0
-1.18
-62.4
1200
-3.05
-112.3
5.05
12.3
-30.25
132.5
-1.19
-66.0
1250
-3.09
-115.9
4.80
4.8
-29.32
131.9
-1.21
-69.8
1300
-3.16
-119.4
4.33
-2.6
-28.56
130.9
-1.31
-72.9
deg
Document Number 85047
Rev. 1.6, 08-Sep-08
deg
deg
deg
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3
S593T/S593TR/S593TRW
Vishay Semiconductors
250
y21s – Forward Transadmittance ( mS )
Ptot - Total Power Dissipation ( mW )
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
200
150
100
50
0
0
25
50
75
100
20
10
0
0
16
12
V G2S = 4 V
8
2V
4
0
1
2
3
4
2
1
V DS = 5 V
f = 200 MHz
0
2
3
6
5
4
Figure 5. Gate 1 Input Capacitance vs. Gate 2 Source Voltage
Coss – Output Capacitance ( pF )
2
V DS = 5 V
ID – Drain Current ( mA )
1
V G2S – Gate 2 Source Voltage ( V )
95 11165
20
16
12
8
4
1.5
1
0.5
V G2S = 4 V
f = 200 MHz
0
0
0
1
2
3
4
V G2S - Gate 2 Source V oltage ( V )
Figure 3. Drain Current vs. Gate 2 Source Voltage
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4
4
0
Figure 2. Drain Current vs. Drain Source Voltage
95 11163
3
3
5
V DS – Drain Source Voltage ( V )
95 11162
2
4
1V
0
1
V G2S – Gate 2 Source Voltage ( V )
Figure 4. Forward Transadmittance vs. Gate 2 Source Voltage
Cissg1 – Gate 1 Input Capacitance ( pF
20
ID – Drain Current ( mA )
30
95 11164
Figure 1. Total Power Dissipation vs. Ambient Temperature
3V
V DS = 5 V
f = 200 MHz
150
125
Tamb – AmbientTemperature (° C )
95 10759
40
3
95 11166
4
5
7
6
V DS – Drain Source Voltage ( V )
Figure 6. Output Capacitance vs. Drain Source Voltage
Document Number 85047
Rev. 1.6, 08-Sep-08
S593T/S593TR/S593TRW
Vishay Semiconductors
S21
2
- Transducer Gain ( dB )
20
V DS = 5 V
f = 800 MHz
0
-20
-40
-60
0
1
2
3
4
V G2S - Gate 2 Source V oltage ( V )
95 11167
Figure 7. Transducer Gain vs. Gate 2 Source Voltage
CM – Cross Modulation ( dB )
80
60
40
20
V DS = 5 V
f = 800 MHz
0
2
95 11168
3
4
5
6
V G2S – Gate 2 Source Voltage ( V )
Figure 8. Cross Modulation vs. Gate 2 Source Voltage
Document Number 85047
Rev. 1.6, 08-Sep-08
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5
S593T/S593TR/S593TRW
Vishay Semiconductors
VDS = 10 V, ID = 10 mA, Z0 = 50 Ω
S11
S12
j
90°
120°
j0.5
60°
j2
1300 MHz
150°
j0.2
30°
j5
1050
800
0
0.2
0.5
1
2
∞
5
180°
50
50
–j0.2
0.02
0.04
0°
–j5
300
1300 MHz
1050 800 550
–j0.5
550
–150°
–30°
–j2
–120°
–j
12 928
–60°
–90°
12 929
Figure 11. Reverse Transmission Coefficient
Figure 9. Input Reflection Coefficient
S21
S22
j
120°
300
150 °
90°
j0.5
60°
550
30°
800
j2
j5
j0.2
1050
180 °
50
1300 MHz
4
0°
0
0.2
0.5
1
2
5
50
∞
300
–150 °
–30 °
–120 °
12 930
–90 °
–60 °
Figure 10. Forward Transmission Coefficient
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6
–j0.2
550
800
–j0.5
12 931
1050
1300 MHz
–j5
–j2
–j
Figure 12. Output Reflection Coefficient
Document Number 85047
Rev. 1.6, 08-Sep-08
S593T/S593TR/S593TRW
Vishay Semiconductors
Package Dimensions in mm
96 12239
0.5 [0.020]
0.35 [0.014]
0.5 [0.020]
0.35 [0.014]
1.1 [0.043]
0.9 [0.035]
0.08 [0.003]
0.15 [0.006]
3 [0.118]
2.8 [0.110]
0.1 [0.004] max.
Package Dimensions in mm
2.6 [0.102]
2.35 [0.093]
1.8 [0.071]
1.6 [0.063]
0.5 [0.020]
0.35 [0.014]
0.9 [0.035]
0.75 [0.030]
foot print recommendation:
96 12240
Document Number 85047
Rev. 1.6, 08-Sep-08
0.8 [0.031]
1.2 [0.047]
0.8 [0.031]
0.8 [0.031]
2 [0.079]
2 [0.079]
1.8 [0.071]
0.9 [0.035] 0.9 [0.035]
1.4 [0.055]
1.2 [0.047]
1.7 [0.067]
1.9 [0.075]
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S593T/S593TR/S593TRW
Vishay Semiconductors
Package Dimensions in mm
96 12238
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Document Number 85047
Rev. 1.6, 08-Sep-08
S593T/S593TR/S593TRW
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 85047
Rev. 1.6, 08-Sep-08
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9
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1