VISHAY SUD50P10-43L

New Product
SUD50P10-43L
Vishay Siliconix
P-Channel 100-V (D-S) 175 °C MOSFET
FEATURES
PRODUCT SUMMARY
rDS(on) (Ω)
ID (A)a
0.043 at VGS = - 10 V
- 37
0.048 at VGS = - 4.5 V
- 35
VDS (V)
- 100
• TrenchFET® Power MOSFET
Qg (Typ)
RoHS
54 nC
COMPLIANT
TO-252
S
G
Drain Connected to Tab
G
D
S
Top View
D
P-Channel MOSFET
Ordering Information: SUD50P10-43L-E3 (Lead (Pb)-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Symbol
Limit
Drain-Source Voltage
VDS
- 100
Gate-Source Voltage
VGS
± 20
TC = 125 °C
TA = 25 °C
- 31a
ID
- 9.2b, c
- 7.7b, c
TA = 125 °C
IDM
Pulsed Drain Current
Continuous Source Current (Diode Conduction)
Avalanche Current
Single Pulse Avalanche Energy
TC = 25 °C
TA = 25 °C
L = 0.1 mH
TC = 70 °C
TA = 25 °C
- 50a
IS
- 6.9b, c
IAS
- 35
EAS
61
mJ
136
95
PD
W
8.3b, c
5.8b, c
TA = 70 °C
TJ, Tstg
Operating Junction and Storage Temperature Range
A
- 40
TC = 25 °C
Maximum Power Dissipation
V
- 37.1a
TC = 25 °C
Continuous Drain Current (TJ = 175 °C)b
Unit
- 55 to 175
°C
THERMAL RESISTANCE RATINGS
Parameter
Junction-to-Ambienta
Junction-to-Case (Drain)
Notes:
a. Package limited.
b. Surface Mounted on 1" x 1" FR4 Board.
c. t = 10 sec.
d. Maximum under Steady State conditions is 40 °C/W.
Document Number: 73444
S-71660-Rev. B, 06-Aug-07
Symbol
t ≤ 10 sec
Steady State
RthJA
RthJC
Typical
Maximum
Unit
15
40
0.85
18
50
1.1
°C/W
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New Product
SUD50P10-43L
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min
VDS
VGS = 0 V, ID = - 250 µA
- 100
Typ
Max
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
ID = - 250 µA
VGS(th)
VDS = VGS, ID = - 250 µA
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
rDS(on)
Forward Transconductancea
gfs
V
- 109
mV/°C
5.9
-1
-3
V
± 100
nA
VDS = - 100 V, VGS = 0 V
-1
VDS = - 100 V, VGS = 0 V, TJ = 55 °C
- 10
VDS ≥ 5 V, VGS = - 10 V
- 40
µA
A
VGS = - 10 V, ID = - 9.2 A
0.036
0.043
VGS = - 4.5 V, ID = - 7.7 A
0.040
0.048
VDS = - 15 V, ID = - 9.2 A
38
Ω
S
b
Dynamic
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Gate Resistance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Rg
4600
VDS = - 50 V, VGS = 0 V, f = 1 MHz
VDS = - 50 V, VGS = - 10 V, ID = - 9.2 A
VDS = - 50 V, VGS = - 4.5 V, ID = - 9.2 A
td(off)
f = 1 MHz
VDD = - 50 V, RL = 6.5 Ω
ID ≅ - 7.7 A, VGEN = - 10 V, Rg = 1 Ω
tf
td(on)
tr
td(off)
106
160
54
81
14
nC
26
td(on)
tr
pF
230
175
VDD = - 50 V, RL = 6.5 Ω
ID ≅ - 7.7 A, VGEN = - 4.5 V, Rg = 1 Ω
tf
Ω
4
15
25
20
30
110
165
100
150
42
65
160
240
100
150
100
150
ns
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
IS
Pulse Diode Forward Currenta
ISM
Body Diode Voltage
VSD
Body Diode Reverse Recovery Time
trr
Body Diode Reverse Recovery Charge
Qrr
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
TC = 25 °C
- 50
- 40
IS = - 7.7 A
IF = - 7.7 A, di/dt = 100 A/µs, TJ = 25 °C
A
- 0.8
- 1.2
V
60
90
ns
150
225
nC
46
14
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 73444
S-71660-Rev. B, 06-Aug-07
New Product
SUD50P10-43L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
40
20
VGS = 10 thru 4 V
30
I D - Drain Current (A)
I D - Drain Current (A)
35
25
20
15
10
16
12
8
TA = 125 °C
3V
4
25 °C
5
2V
0
0.0
0.5
1.0
1.5
2.0
2.5
- 55 °C
0
0.0
3.0
0.5
VDS - Drain-to-Source Voltage (V)
1.0
1.5
2.0
2.5
3.0
3.5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.044
7000
Ciss
C - Capacitance (pF)
rDS(on) - On-Resistance (Ω)
6000
0.042
VGS = 4.5 V
0.040
0.038
VGS = 10 V
5000
4000
3000
2000
Coss
0.036
1000
0.034
Crss
0
0
5
10
15
20
25
30
35
0
10
ID - Drain Current (A)
20
40
50
60
70
80
125
150
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
2.3
ID = 9.2 A
2.0
8
rDS(on) – On-Resistance
(Normalized)
V GS - Gate-to-Source Voltage (V)
30
VDS = 50 V
6
VDS = 80 V
4
2
ID = 9.2 A
VGS = 10 V, 4.5 V
1.7
1.4
1.1
0.8
0
0
20
40
60
80
Qg - Total Gate Charge (nC)
Gate Charge
Document Number: 73444
S-71660-Rev. B, 06-Aug-07
100
120
0.5
- 50
- 25
0
25
50
75
100
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
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New Product
SUD50P10-43L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
0.08
rDS(on) - Drain-to-Source On-Resistance (Ω)
I S - Source Current (A)
40
TJ = 150 °C
10
TJ = 25 °C
0.07
TA = 125 °C
0.06
0.05
0.04
TA = 25 °C
0.03
0.02
1
0.00
0.2
0.4
0.6
0.8
1.0
2
1.2
3
4
VSD - Source-to-Drain Voltage (V)
7
8
9
10
VGS - Gate-to-Source Voltage (V)
2.4
35
2.2
30
ID = 250 µA
25
1.8
Power (W)
VGS(th) (V)
6
On-Resistance vs. Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
2.0
5
1.6
20
15
1.4
10
1.2
5
1.0
0.8
- 50
- 25
0
25
50
75
100
125
150
0
0.01
175
0.1
TJ - Temperature (°C)
1
10
100
1000
Time (sec)
Single Pulse Power, Junction-to-Ambient
Threshold Voltage
100
100 µs
*Limited by rDS(on)
10
I D - Drain Current (A)
1 ms
10 ms
1
100 ms
1s
0.1
10 s
dc
TA = 25 °C
Single Pulse
0.01
0.001
0.1
1
*VGS
10
100
1000
VDS - Drain-to-Source Voltage (V)
minimum VGS at which rDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 73444
S-71660-Rev. B, 06-Aug-07
New Product
SUD50P10-43L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
140
50
120
40
30
Power
ID - Drain Current (A)
100
20
80
60
40
10
20
0
0
0
25
50
75
100
125
150
175
25
50
75
100
125
150
175
TC - Case Temperature (°C)
TC - Case Temperature (°C)
Current Derating*
Single Pulse Power, Junction-to-Ambient
IC - Peak Avalanche Current (A)
100
10
TA
L
BV
IA
V DD
1
0.000001
0.00001
0.0001
0.001
0.01
TA - Time In Avalanche (sec)
Single Pulse Avalance Capability
*The power dissipation PD is based on TJ(max) = 175 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 73444
S-71660-Rev. B, 06-Aug-07
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New Product
SUD50P10-43L
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
Notes:
0.1
0.1
PDM
0.05
t1
0.02
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 65 °C/W
3. TJM – TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-2
10-1
1
10
Square Wave Pulse Duration (sec)
100
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
Normalized Effective Transient
Thermal Impedance
2
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
Square Wave Pulse Duration (sec)
10-1
1
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73444.
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Document Number: 73444
S-71660-Rev. B, 06-Aug-07
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
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Document Number: 91000
Revision: 18-Jul-08
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