VISHAY SI4166DY

New Product
Si4166DY
Vishay Siliconix
N-Channel 30-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
RDS(on) (Ω)
ID (A)a
0.0039 at VGS = 10 V
30.5
0.0055 at VGS = 4.5 V
25.6
VDS (V)
30
• Halogen-free
• TrenchFET® Power MOSFET
Qg (Typ.)
• 100 % Rg and UIS Tested
21.5 nC
RoHS
COMPLIANT
APPLICATIONS
•
Low-Side DC/DC Conversion
- Notebook PC
- Gaming
SO-8
D
S
1
8
D
S
2
7
D
S
3
6
D
G
4
5
D
G
Top View
S
N-Channel MOSFET
Ordering Information: Si4166DY-T1-GE3 (Lead (Pb)-free and Halogen-free)
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 150 °C)
Symbol
VDS
VGS
TC = 25 °C
TC = 70 °C
TA = 25 °C
TA = 70 °C
Single Pulse Avalanche Current
Avalanche Energy
ID
IDM
Pulsed Drain Current
Continuous Source-Drain Diode Current
Limit
30
± 20
30.5
24.5
TC = 25 °C
TA = 25 °C
IS
L = 0.1 mH
IAS
EAS
TC = 25 °C
TC = 70 °C
Maximum Power Dissipation
TA = 25 °C
TA = 70 °C
Operating Junction and Storage Temperature Range
PD
Unit
V
20.5b, c
16.5b, c
70
5.9
A
2.7b, c
30
45
6.5
4.2
mJ
3.0b, c
1.9b, c
- 55 to 150
TJ, Tstg
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambientb, d
Maximum Junction-to-Foot (Drain)
t ≤ 10 s
Steady State
Symbol
RthJA
RthJF
Typical
34
15
Maximum
41
19
Unit
°C/W
Notes:
a. Based on TC = 25 °C.
b. Surface Mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under Steady State conditions is 80 °C/W.
Document Number: 68953
S-82661-Rev. A, 03-Nov-08
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New Product
Si4166DY
Vishay Siliconix
SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
30
Typ.
Max.
Unit
Static
Drain-Source Breakdown Voltage
VDS Temperature Coefficient
ΔVDS/TJ
VGS(th) Temperature Coefficient
ΔVGS(th)/TJ
Gate-Source Threshold Voltage
V
31
ID = 250 µA
mV/°C
- 5.4
VGS(th)
VDS = VGS , ID = 250 µA
2.4
V
Gate-Source Leakage
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
nA
Zero Gate Voltage Drain Current
IDSS
VDS = 30 V, VGS = 0 V
1
VDS = 30 V, VGS = 0 V, TJ = 55 °C
10
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
Forward Transconductancea
RDS(on)
gfs
VDS ≥ 5 V, VGS = 10 V
1.2
30
µA
A
VGS = 10 V, ID = 15 A
0.0032
0.0039
VGS = 4.5 V, ID = 10 A
0.0045
0.0055
VDS = 15 V, ID = 15 A
65
Ω
S
Dynamicb
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Rg
Gate Resistance
2730
VDS = 15 V, VGS = 0 V, f = 1 MHz
VDS = 15 V, VGS = 10 V, ID = 10 A
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
nC
7.1
f = 1 MHz
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 4.5 V, Rg = 1 Ω
0.2
0.8
1.6
30
50
19
35
60
15
30
td(on)
12
24
VDD = 15 V, RL = 1.5 Ω
ID ≅ 10 A, VGEN = 10 V, Rg = 1 Ω
tf
Fall Time
65
33
35
td(off)
Turn-Off Delay Time
42.5
21.5
tf
tr
Rise Time
pF
6.9
VDS = 15 V, VGS = 4.5 V, ID = 10 A
td(on)
Turn-On Delay Time
540
205
9
18
29
50
9
18
Ω
ns
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward
Currenta
Body Diode Voltage
IS
TC = 25 °C
5.9
ISM
VSD
70
IS = 3 A
0.74
1.1
A
V
Body Diode Reverse Recovery Time
trr
28
55
ns
Body Diode Reverse Recovery Charge
Qrr
21
42
nC
Reverse Recovery Fall Time
ta
Reverse Recovery Rise Time
tb
IF = 10 A, dI/dt = 100 A/µs, TJ = 25 °C
15
13
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
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Document Number: 68953
S-82661-Rev. A, 03-Nov-08
New Product
Si4166DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
10
70
VGS = 10 thru 4 V
8
I D - Drain Current (A)
I D - Drain Current (A)
56
42
VGS = 3 V
28
6
TC = 25 °C
4
2
14
TC = 125 °C
0
0.0
TC = - 55 °C
0
0.5
1.0
1.5
2.0
0
2.5
1
VDS - Drain-to-Source Voltage (V)
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Output Characteristics
Transfer Characteristics
0.0055
3500
0.0050
2800
VGS = 4.5 V
C - Capacitance (pF)
R DS(on) - On-Resistance (Ω)
Ciss
0.0045
0.0040
0.0035
2100
1400
Coss
700
VGS = 10 V
Crss
0
0.0030
0
14
28
42
56
0
70
6
ID - Drain Current (A)
12
24
30
VDS - Drain-to-Source Voltage (V)
On-Resistance vs. Drain Current and Gate Voltage
Capacitance
10
1.8
ID = 10 A
1.6
8
ID = 15 A
VGS = 10 V
6
VDS = 10 V
VDS = 15 V
4
VDS = 20 V
2
1.4
(Normalized)
R DS(on) - On-Resistance
VGS - Gate-to-Source Voltage (V)
18
VGS = 4.5 V
1.2
1.0
0.8
0
0
9
18
27
36
45
0.6
- 50
- 25
0
25
50
75
100
125
Qg - Total Gate Charge (nC)
TJ - Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 68953
S-82661-Rev. A, 03-Nov-08
150
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New Product
Si4166DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
100
0.020
ID = 15 A
R DS(on) - On-Resistance (Ω)
I S - Source Current (A)
10
TJ = 150 °C
1
TJ = 25 °C
0.1
0.01
0.016
0.012
0.008
TJ = 125 °C
0.004
TJ = 25 °C
0.001
0.0
0.000
0.2
0.4
0.6
0.8
1.0
1.2
0
2
3
4
5
6
7
8
9
VGS - Gate-to-Source Voltage (V)
Source-Drain Diode Forward Voltage
On-Resistance vs. Gate-to-Source Voltage
0.4
10
250
0.2
200
0.0
Power (W)
VGS(th) Variance (V)
1
VSD - Source-to-Drain Voltage (V)
- 0.2
ID = 5 mA
150
100
- 0.4
ID = 250 µA
50
- 0.6
- 0.8
- 50
- 25
0
25
50
75
100
125
0
0.001
150
0.01
0.1
TJ - Temperature (°C)
Time (s)
Threshold Voltage
Single Pulse Power
1
10
100
Limited by RDS(on)*
I D - Drain Current (A)
10
1 ms
10 ms
1
100 ms
1s
10 s
0.1
DC
TA = 25 °C
Single Pulse
0.01
0.01
0.1
BVDSS Limited
1
10
100
VDS - Drain-to-Source Voltage (V)
* VGS > minimum VGS at which RDS(on) is specified
Safe Operating Area, Junction-to-Ambient
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Document Number: 68953
S-82661-Rev. A, 03-Nov-08
New Product
Si4166DY
Vishay Siliconix
35
8.0
28
6.4
21
4.8
Power (W)
I D - Drain Current (A)
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
14
3.2
1.6
7
0.0
0
0
25
50
75
100
125
0
150
25
50
TC - Case Temperature (°C)
75
100
125
150
TC - Case Temperature (°C)
Current Derating*
Power Derating, Junction-to-Foot
2.0
Power (W)
1.6
1.2
0.8
0.4
0.0
0
25
50
75
100
125
150
TA - Ambient Temperature (°C)
Power, Junction-to-Ambient
* The power dissipation PD is based on TJ(max) = 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
limit.
Document Number: 68953
S-82661-Rev. A, 03-Nov-08
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New Product
Si4166DY
Vishay Siliconix
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
Notes:
0.1
PDM
0.05
t1
t2
1. Duty Cycle, D =
t1
t2
2. Per Unit Base = RthJA = 80 °C/W
0.02
3. TJM - TA = PDMZthJA(t)
Single Pulse
0.01
10 -4
4. Surface Mounted
10 -3
10 -2
10 -1
1
Square Wave Pulse Duration (s)
100
10
1000
Normalized Thermal Transient Impedance, Junction-to-Ambient
1
Normalized Effective Transient
Thermal Impedance
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10 -4
10 -3
10 -2
10 -1
Square Wave Pulse Duration (s)
1
10
Normalized Thermal Transient Impedance, Junction-to-Foot
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?68953.
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Document Number: 68953
S-82661-Rev. A, 03-Nov-08
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
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information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
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Document Number: 91000
Revision: 18-Jul-08
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