NEC UPC1675G

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
µPC1675G
GENERAL PURPOSE WIDE BNAD AMPLIFIER
DESCRIPTION
The µPC1675G is a silicon monolithic integrated circuit employing small package (4pins mini mold) and designed
for use as a wide bnad amplifier convers from HF band to UHF band.
FEATURES
• Excellent frequency response : 1.9 GHz TYP.
@ 3 dB down below flat gain.
• High isolation.
• Super small package.
• Uni- and low voltage operation : VCC = 5 V
• Input and output matching 50 Ω.
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Supply Voltage
VCC
6
V
Total Power Dissipation
PT
200
mW
Operating Temperature
Topt
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
ELECTRICAL CHARACTERISTICS (TA = 25 °C, VCC = 5 V)
CHARACTERISTIC
SYMBOL
MIN.
TYP.
MAX.
UNIT
Circuit Current
ICC
12
17
22
mA
No Signal
Power Gain
GP
10
12
14
dB
f = 0.5 GHz
Noise Figure
NF
5.5
7.0
dB
f = 0.5 GHz
Upper Limit Operating Frequency
TEST CONDITIONS
fu
1.6
1.9
GHz
Isolation
ISL
21
25
dB
f = 0.5 GHz
Input Return Loss
RLin
9
12
dB
f = 0.5 GHz
Output Return Loss
RLout
8
11
dB
f = 0.5 GHz
PO
2
4
dBm
Maximum Output Level
3 dB down below flat gain
f = 0.5 GHz, Pin = 0 dBm
NEC cannot assume any responsibility for any circuits shown or represent that
they are free from patent infringement.
Document No. P12446EJ2V0DS00 (2nd edition)
(Previous No. IC-1890)
Date Published March 1997 N
Printed in Japan
©
1989
µPC1675G
TYPICAL CHARACTERISTICS (TA = 25 °C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE
CIRCUIT CURRENT vs. OPERATING
TEMPERATURE
30
ICC-Circuit Current-mA
ICC-Circuit Current-mA
25
20
15
10
20
10
5
0
0
1
2
3
4
5
6
−50
VCC-Supply Voltage-V
7.5
5
2.5
NOISE FIGURE AND INSERTION POWER
GAIN vs. FREQUENCY
VCC = 5.5 V
16
GP
12
5.0 V
NF
8
4.5 V
4
0
0
60
100
200
500
20
GP-Insertion Power Gain-dB
NF-Noise Figure-dB
10
GP-Insertion Power Gain-dB
20
0
1000
VCC = 5 V
16
TA = −40 °C
12
+25 °C
8
+85 °C
4
0
2000
60
100
−10
−20
−30
200
500
f-Frequency-MHz
2
500
1000
2000
INPUT AND OUTPUT RETURN LOSS vs.
FREQUENCY
1000
2000
RLin-Input Return Loss-dB
RLout-Output Return Loss-dB
ISL-Isolation-dB
VCC = 5 V
100
200
f-Frequency-MHz
REVERSE INSERTION GAIN vs. FREQUENCY
60
100
INSERTION POWER GAIN vs. FREQUENCY
f-Frequency-MHz
0
50
Topt-Operating Temperature-°C
VCC = 5 V
0
RLin
−10
RLout
−20
−30
60
100
200
500
f-Frequency-MHz
1000
2000
µPC1675G
VCC = 5 V, f = 500 MHz
Po-Output Power-dBm
5
0
−5
−10
−15
−20
−30
−25
−20
−15
−10
−5
0
IM3-3rd Order Intermodulation Distortion-dBc
OUTPUT POWER vs. INPUT POWER
Pin-Input Power-dBm
THIRD ORDER INTERMODULATION DISTORTION
vs. OUTPUT POWER OF EACH TONE
f1 = 500 MHz
f2 = 504 MHz
−50
−40
5.5 V
5.0 V
−30
4.5 V
−20
−10
−20
−10
0
Pout-Output Power of Each Tone-dBm
S-PARAMETER
VCC = 5 V, ZO = 50
S11
∠ S11
S21
∠ S21
S12
∠ S12
S22
∠ S22
100
0.284
−27.1
3.853
−33.8
0.065
−27.0
0.225
159.1
200
0.287
−55.4
3.877
−67.6
0.064
−51.4
0.235
95.7
400
0.270
−114.3
3.933
−135.5
0.059
−98.3
0.266
15.6
600
0.228
−173.0
4.039
155.7
0.054
−142.3
0.294
−60.1
f (MHz)
800
0.178
132.5
4.167
85.3
0.052
177.3
0.305
−134.3
1000
0.136
85.8
4.239
12.8
0.053
138.4
0.283
151.9
1200
0.120
46.0
4.160
−61.0
0.060
97.5
0.229
80.2
1400
0.122
3.6
3.894
−135.0
0.068
53.3
0.156
13.3
1600
0.124
−45.4
3.512
152.1
0.078
6.4
0.084
−40.9
1800
0.114
−98.5
3.083
81.2
0.088
−42.4
0.048
−56.1
2000
0.085
−55.6
2.661
12.1
0.098
−92.6
0.067
−75.0
3
µPC1675G
PACKAGE DIMENSIONS
EQUIVALENT CIRCUIT
+VCC
PACKAGE DIMENSIONS
(Units: mm)
+0.2
3
IN
+0.1
0.4 −0.05
4
5°
GND
0 to 0.1
+0.1
0.16 −0.06
0.8
+0.1
0.6 −0.05
1
(1.9)
(1.8)
0.95 0.95
2.9±0.2
+0.2
−3.1
1.1
5°
5°
5°
PIN CONNECTIONS
1. GND
2. OUTPUT
3. VCC
4. INPUT
4
OUT
+0.1
+0.2
−0.1
2
1.5
0.4 −0.05
+0.1
0.4 −0.05
2.8 −0.3
µPC1675G
[MEMO]
5
µPC1675G
[MEMO]
6
µPC1675G
[MEMO]
7
µPC1675G
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consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
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the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
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Anti-radioactive design is not implemented in this product.
M4 96. 5