SEMICONDUCTOR TECHNICAL DATA The MC10E/100E167 contains six 2:1 multiplexers followed by D flip-flops with single-ended outputs. Input data are selected by the Select control, SEL. The selected data are transferred to the flip-flop outputs by a positive edge on CLK1 or CLK2 (or both). A HIGH on the Master Reset (MR) pin asynchronously forces all Q outputs LOW. • • • • • • • 6-BIT 2:1 MUX-REGISTER 1000MHz Min. Operating Frequency 800ps Max. Clock to Output Single-Ended Outputs Asynchronous Master Resets Dual Clocks Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D5a D4b D4a D3b D3a NC VCCO 25 24 23 22 21 20 19 D5b 26 18 Q5 CLK1 27 17 Q4 CLK2 28 16 VCC VEE 1 15 Q3 MR 2 14 Q2 SEL 3 13 VCCO D0a 4 12 Q1 5 6 7 8 D0b D1a D1b D2a 9 10 D2b VCCO Pin D0a – D5a D0b – D5b SEL CLK1, CLK2 MR Q0 – Q5 Function Input Data a Input Data b Select Input Clock Inputs Master Reset Data Outputs MUX D0b SEL D1a MUX 11 D1b SEL Q0 D2a MUX D2b SEL D3a MUX D3b SEL D4a MUX D4b D5a D5b FUNCTIONS SEL H L LOGIC DIAGRAM D0a * All VCC and VCCO pins are tied together on the die. PIN NAMES FN SUFFIX PLASTIC PACKAGE CASE 776-02 Data a b SEL CLK1 CLK2 MR 12/93 Motorola, Inc. 1996 2–1 REV 2 D SEL Q0 Q Q1 Q Q2 Q Q3 Q Q4 Q Q5 R D R D R D R D SEL MUX Q R D R MC10E167 MC100E167 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 94 94 113 113 94 94 113 113 94 108 113 130 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic min typ 25°C max min typ 1000 1400 450 450 650 650 85°C max min typ 1000 1400 450 450 650 650 fMAX Max. Toggle Frequency 1000 1400 tPLH tPHL Propagation Delay to Output Clk MR 450 450 650 650 ts Setup Time D SEL 100 275 – 50 125 100 275 – 50 125 100 275 – 50 125 Hold Time D SEL 300 75 50 –125 300 75 50 –125 300 75 50 –125 tRR Reset Recovery Time 750 550 750 550 750 550 tPW Minimum Pulse Width Clk, MR 400 th tSKEW Within-Device Skew tr tf Rise/Fall Times 20 - 80% max Unit Condition MHz ps 800 850 800 850 800 850 ps ps ps ps 400 75 400 75 75 ps 1 ps 300 450 800 300 450 800 300 450 800 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E167 MC100E167 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E167 MC100E167 Motorola reserves the right to make changes without further notice to any products herein. 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