SEMICONDUCTOR TECHNICAL DATA The MC10E/100E163 contains two 8:1 multiplexers with differential outputs and common select inputs. The select inputs (SEL0, 1, 2) control which one of the eight data inputs (A0 – A7, B0 – B7) is propagated to the output. • • • • 850ps Max. D to Output 2-BIT 8:1 MULTIPLEXER Differential Outputs Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) B2 B3 B4 B5 B6 B7 VCCO 25 24 23 22 21 20 19 B1 26 18 QB B0 27 17 QB SEL0 28 16 VCC VEE 1 15 NC SEL1 2 14 VCCO SEL2 3 13 QA A0 4 12 QA 5 6 7 8 9 10 FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM 11 A1 A2 A3 A4 A5 A6 A7 * All VCC and VCCO pins are tied together on the die. A0 A1 A2 FUNCTION TABLE SEL2 SEL1 SEL0 A/B Data L L L L H H H H L L H H L L H H L H L H L H L H 0 1 2 3 4 5 6 7 A3 QA QA A4 A5 A6 A7 SEL0 SEL1 PIN NAMES Pin A0 – A7 B0 – B7 SEL0, 1, 2 QA, QB QA, QB SEL2 Function A Data Inputs B Data Inputs Select Inputs True Outputs Inverting Outputs To Side B 12/93 Motorola, Inc. 1996 2–1 REV 2 MC10E163 MC100E163 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 73 73 88 88 73 73 88 88 73 83 88 100 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) Symbol Characteristic tPLH tPHL Propagation Delay to Output D SEL0 SEL1 SEL2 tSKEW Within-Device Skew An, Bn to Q An, Am to QA Bn, Bm to QB tr tf Rise/Fall Time 20 - 80% min 0°C typ max min 25°C typ max min 85°C typ max 400 525 425 350 550 725 625 525 800 950 850 725 400 525 425 350 550 725 625 525 800 950 850 725 400 525 425 350 550 725 625 525 800 950 850 725 Unit Condition ps ps 40 30 30 40 30 30 1 40 30 30 ps 275 375 575 275 375 575 275 375 575 1. Within-device skew is defined as identical transitions on similar paths through a device; n = 0-7, m n, m = 0-7. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E163 MC100E163 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E163 MC100E163 Motorola reserves the right to make changes without further notice to any products herein. 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