SEMICONDUCTOR TECHNICAL DATA The MC10E/100E171 contains three 4:1 multiplexers with differential outputs. Separate Select controls are provided for the leading 2:1 mux pairs (see logic symbol). The three Select inputs control which one of the four data inputs in each case is propagated to the corresponding output. • • • • • 3-BIT 4:1 MULTIPLEXER 725ps Max. D to Output Split Select Differential Outputs Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D1b D1a D2d D2c D2b D2a VCCO 25 24 23 22 21 20 FN SUFFIX PLASTIC PACKAGE CASE 776-02 19 SEL1A 26 18 Q2 SEL1B 27 17 Q2 SEL2 28 16 VCC VEE 1 15 Q1 D0a 2:1 MUX NC 2 14 Q1 D0b SEL NC 3 13 VCCO D0c D1c 4 12 Q0 2:1 MUX D0d SEL D1a 2:1 MUX D1b D1c 5 6 7 8 D1d D0a D0b D0c 9 10 D0d VCCO Q0 PIN NAMES Function D0x – D2x SEL1A, SEL1B SEL2 Q0 – Q2 Q0 – Q2 Data Inputs First-stage Select Inputs Second-stage Select Input True Output Inverted Output FUNCTION TABLE Pin SEL2 SEL1A SEL1B H H H 2:1 MUX Q1 2:1 MUX SEL Q1 SEL 2:1 MUX Q2 2:1 MUX SEL 2:1 MUX D2b D2d SEL1A SEL2 12/93 2–1 SEL D2a SEL1B Motorola, Inc. 1996 Q0 SEL Operation Output c/d data Input d data Input b data Q0 SEL D1d D2c State 2:1 MUX 11 * All VCC and VCCO pins are tied together on the die. Pin LOGIC DIAGRAM REV 2 SEL Q2 MC10E171 MC100E171 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 56 56 67 67 56 56 67 67 56 65 67 77 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic tPLH tPHL Propagation Delay to Output D SEL1 SEL2 tSKEW Within-Device Skew Dnm, Dnm to Qn Da, Db, Dc, Dd to Q tr tf Rise/Fall Time 20 - 80% 25°C 85°C min typ max min typ max min typ max 275 450 350 480 650 550 650 850 700 275 450 350 480 650 550 650 850 700 275 450 350 480 650 550 650 850 700 Unit Condition ps ps 60 40 60 40 1 60 40 ps 300 475 650 300 475 650 300 475 650 1. Within-device skew is defined as identical transitions on similar paths through a device; n = 0,1,2 m = a,b,c,d. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E171 MC100E171 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E171 MC100E171 Motorola reserves the right to make changes without further notice to any products herein. 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