SEMICONDUCTOR TECHNICAL DATA The MC10E/100E166 is a 9-bit magnitude comparator which compares the binary value of two 9-bit words and indicates whether one word is greater than, or equal to, the other. • 1100ps Max. A=B • Extended 100E VEE Range of – 4.2V to – 5.46V • 75kΩ Input Pulldown Resistors 9-BIT MAGNITUDE COMPARATOR Pinout: 28-Lead PLCC (Top View) A2 B1 A1 B0 A0 VCCO 25 24 23 22 21 20 19 A3 26 18 A=B B3 27 17 NC NC 28 16 VCC VEE 1 15 B>A A4 2 14 VCCO B4 3 13 A>B A5 4 12 NC 5 6 7 8 9 10 11 B5 A6 B6 A7 B7 A8 B8 FN SUFFIX PLASTIC PACKAGE CASE 776-02 LOGIC DIAGRAM A0 – A8 9 * All VCC and VCCO pins are tied together on the die. B0 – B8 PIN NAMES Pin A0 – A8 B0 – B8 A>B B>A A=B Function A Data Inputs B Data Inputs A Greater than B Output B Greater than A Output A Equal to B Output (active-LOW) 7/96 Motorola, Inc. 1996 2–1 REV 3 9 COMPARATOR B2 A>B A=B B>A MC10E166 MC100E166 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 113 113 156 156 113 113 156 156 113 130 156 156 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic 25°C 85°C min typ max min typ max min typ max tPLH tPHL Propagation Delay to Output D to A = B D to A < B, A > B 500 500 750 850 1100 1400 500 500 750 850 1100 1400 500 500 750 850 1100 1400 tr tf Rise/Fall Time 20 - 80% 300 450 800 300 450 800 300 450 800 MOTOROLA Unit Condition ps ps 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E166 MC100E166 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E166 MC100E166 Motorola reserves the right to make changes without further notice to any products herein. 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