SEMICONDUCTOR TECHNICAL DATA The MC10E/100E141 is an 8-bit full-function shift register. The E141 performs serial/parallel in and serial/parallel out, shifting in either direction. The eight inputs D0 – D7 accept parallel input data, while DL/DR accept serial input data for left/right shifting. The Qn outputs do not need to be terminated for the shift operation to function. To minimize noise and power, any Q output not used should be left unterminated. • • • • • • • 700MHz Min. Shift Frequency 8-BIT SHIFT REGISTER 8-Bit Full-Function, Bi-Directional Asynchronous Master Reset Pin-Compatible with E241 Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors The select pins, SEL0 and SEL1, select one of four modes of operation: Load, Hold, Shift Left, Shift Right, according to the Function Table. Input data is accepted a set-up time before the positive clock edge. A HIGH on the Master Reset (MR) pin asynchronously resets all the registers to zero. FN SUFFIX PLASTIC PACKAGE CASE 776-02 Pinout: 28-Lead PLCC (Top View) SEL0 DL D7 D6 D5 VCCO Q7 25 24 23 22 21 20 19 SEL1 26 18 Q6 CLK 27 17 Q5 MR 28 16 VCC VEE 1 15 NC DR 2 14 VCCO D0 3 13 Q4 D1 4 6 7 8 9 10 11 D2 D3 D4 VCCO Q0 Q1 Q2 SEL0 SEL1 L L H H L H L H Function Load Shift Right (Dn to Dn+1) Shift Left (Dn to Dn –1) Hold PIN NAMES Pin Q3 12 5 FUNCTION TABLE Function D0 – D7 DL, DR SEL0, SEL1 CLK Q0 – Q7 MR * All VCC and VCCO pins are tied together on the die. Parallel Data Inputs Serial Data Inputs Mode Select In Inputs Clock Data Outputs Master Reset EXPANDED FUNCTION TABLE Function DL DR SEL0 SEL1 MR CLK Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7 Load Shift Right X X X L L L L H L L Z Z D0 L D1 Q0 D2 Q1 D3 Q2 D4 Q3 D5 Q4 D6 Q5 D7 Q6 X H L H L Z H L Q0 Q1 Q2 Q3 Q4 Q5 L X H L L Z L Q0 Q1 Q2 Q3 Q4 Q5 L H X H L L Z Q0 Q1 Q2 Q3 Q4 Q5 L H Hold X X H H L Z Q0 Q1 Q2 Q3 Q4 Q5 L H Reset X X X X H X H X L H Z X Q0 L Q1 L Q2 L Q3 L Q4 L Q5 L L L H L Shift Left 7/96 Motorola, Inc. 1996 2–1 REV 3 MC10E141 MC100E141 LOGIC DIAGRAM DL BITS 1 – 6 D Q D Q D Q DR R D0 Q0 R R Q D7 D Q7 SEL1 SEL0 CLK MR DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E min typ 25°C max min typ 85°C max 150 min typ 150 max 150 Unit Condition µA mA 131 131 181 181 131 131 181 181 131 151 181 181 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic min typ 25°C max min typ 700 900 625 600 750 725 85°C max min typ 700 900 625 600 750 725 fSHIFT Max. Shift Frequency 700 900 tPLH tPHL Propagation Delay To Output Clk MR 625 600 750 725 ts Setup Time D SEL0 SEL1 175 350 300 25 200 150 175 350 300 25 200 150 175 350 300 25 200 150 Hold Time D SEL0 SEL1 200 100 100 – 25 – 200 –150 200 100 100 – 25 – 200 –150 200 100 100 – 25 – 200 –150 tRR Reset Recovery Time 900 700 900 700 900 700 tPW Minimum Pulse Width Clk, MR 400 th tSKEW Within-Device Skew tr tf Rise/Fall Times 20 - 80% max Unit Condition MH z ps 975 975 975 975 975 975 ps ps ps ps 400 60 400 60 60 ps 1 ps 300 525 800 300 525 800 300 525 800 1. Within-device skew is defined as identical transitions on similar paths through a device. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E141 MC100E141 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E141 MC100E141 Motorola reserves the right to make changes without further notice to any products herein. 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