SEMICONDUCTOR TECHNICAL DATA The MC10E/100E452 is a 5-bit differential register with differential data (inputs and outputs) and clock. The registers are triggered by a positive transition of the positive clock (CLK) input. A high on the Master Reset (MR) asynchronously resets all registers so that the Q outputs go LOW. The differential input structures are clamped so that the inputs of unused registers can be left open without upsetting the bias network of the device. The clamping action will assert the D and the CLK sides of the inputs. Because of the edge triggered flip-flop nature of the device simultaneously opening both the clock and data inputs will result in an output which reaches an unidentified but valid state. Note that the input clamps only operate when both inputs fall to 2.5V below VCC. The fully differential design of the device makes it ideal for very high frequency applications where a registered data path is necessary. • • • • 5-BIT DIFFERENTIAL REGISTER Differential D, CLK and Q; VBB Reference Available 1100MHz Min. Toggle Frequency Asynchronous Master Reset Extended 100E VEE Range of – 4.2V to – 5.46V Pinout: 28-Lead PLCC (Top View) D3 D3 D4 D4 VCCO Q4 Q4 25 24 23 22 19 21 20 FN SUFFIX PLASTIC PACKAGE CASE 776-02 MR 26 18 Q3 CLK 27 17 Q3 CLK 28 16 VCC VEE 1 15 Q2 VBB 2 14 Q2 D2 3 13 Q1 12 Q1 D2 4 5 6 7 D1 D1 D0 8 9 10 11 D0 VCCO Q0 Q0 * All VCC and VCCO pins are tied together on the die. LOGIC DIAGRAM D0 D0 D Q Q0 Q0 Q Q1 Q1 Q Q2 Q2 Q Q3 Q3 Q Q4 Q4 R D1 D1 D R D2 D2 D R D3 D3 D R PIN NAMES Pin D[0:4], D[0:4] MR CLK, CLK VBB Q[0:4], Q[0:4] Function Differential Data Inputs Master Reset Input Differential Clock Input VBB Reference Output Differential Data Outputs D4 D4 CLK CLK MR VBB 12/93 Motorola, Inc. 1996 2–1 REV 2 D R MC10E452 MC100E452 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) –40°C Symbol VBB Characteristic Output Reference Voltage 10E 100E IIH Input HIGH Current IEE Power Supply Current 10E 100E VCMR Min Typ 0°C Max Min Typ 25°C Max Min 85°C Typ Max Min Typ Max Unit Cond V –1.43 –1.38 –1.30 –1.26 –1.38 –1.38 –1.27 –1.26 150 Common Mode Range –1.35 –1.38 –1.25 –1.26 150 –1.31 –1.38 –1.19 –1.26 150 150 µA mA 74 74 –2.0 89 89 74 74 –0.4 –2.0 89 89 –0.4 74 74 –2.0 89 89 –0.4 74 85 –2.0 89 102 –0.4 V 1 1. VCMR is referenced to the most positive side of the differential input signal. Normal specified operation is obtained when the input signals are within the VCMR range and the input swing is greater than VPP. AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) –40°C Symbol Characteristic fMAX tPLH tPHL Maximum Toggle Frequency tS tH tRR tPW Reset Recovery Time tskew VPP Within-Device Skew Min Typ 0°C to 85°C Max Min Typ 1100 1400 475 425 425 600 600 625 –50 ps ps 1000 1400 CLK (Diff) CLK (SE) MR 425 375 375 600 600 625 Setup Time D 175 –50 150 Hold Time D 225 50 200 50 750 450 700 450 Propagation Delay to Output Minimum Pulse Width Minimum Input Swing CLK MR 400 400 850 900 900 50 150 Condition ps ps 50 ps 150 2–2 Unit MHz 800 850 850 400 400 tr/tf Rise/Fall Times 250 475 725 275 1. Within-device skew is defined as identical transitions on similar paths through a device. 2. Minimum input swing for which AC parameters are guaranteed. MOTOROLA Max 475 675 1 mV 2 ps 20–80% ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E452 MC100E452 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E452 MC100E452 Motorola reserves the right to make changes without further notice to any products herein. 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