SEMICONDUCTOR TECHNICAL DATA The MC10E/100E116 is a quint differential line receiver with emitter-follower outputs. An internally generated reference supply (VBB) is available for single-ended reception. • • • • • 500ps Max. Propagation Delay QUINT DIFFERENTIAL LINE RECEIVER VBB Supply Output Dedicated VCCO Pin for Each Receiver Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Active current sources plus a deep collector feature of the MOSAIC III process provide the receivers with excellent common-mode noise rejection. Each receiver has a dedicated VCCO supply lead, providing optimum symmetry and stability. The receiver design features clamp circuitry to cause a defined state if both the inverting and non-inverting inputs are left open; in this case the Q output goes LOW, while the Q output goes HIGH. This feature makes the FN SUFFIX device ideal for twisted pair applications. PLASTIC PACKAGE If both inverting and non-inverting inputs are at an equal potential of CASE 776-02 > –2.5V, the receiver does not go to a defined state, but rather current-shares in normal differential amplifier fashion, producing output voltage levels midway between HIGH and LOW, or the device may even oscillate. The device VBB output is intended for use as a reference voltage for single-ended reception of ECL signals to that device only. When using for this purpose, it is recommended that VBB is decoupled to VCC via a 0.01µF capacitor. Please refer to the interface section of the design guide for information on using the E116 in specialized applications. The E116 features input pull-down resistors, as does the rest of the ECLinPS family. For applications which require bandwidths greater than that of the E116, the E416 device may be of interest. Pinout: 28-Lead PLCC (Top View) PIN NAMES Pin D0, D0 – D4, D4 Q0, Q0 – Q4, Q4 VBB D3 D4 D4 VCCO Q4 Q4 VCCO 25 24 23 22 21 20 19 D3 26 18 Q3 D2 27 17 Q3 D2 28 16 VCC VEE 1 15 Q2 VBB 2 14 Q2 D0 3 13 VCCO D0 4 12 Q1 Function Differential Input Pairs Differential Output Pairs Reference Voltage Output. 5 6 7 8 9 10 11 D1 D1 VCCO Q0 Q0 VCCO Q1 * All VCC and VCCO pins are tied together on the die. 5/95 Motorola, Inc. 1996 2–1 REV 3 MC10E116 MC100E116 LOGIC DIAGRAM D0 Q0 D0 Q0 D1 Q1 D1 Q1 D2 Q2 D2 Q2 D3 Q3 D3 Q3 D4 Q4 D4 Q4 VBB DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) –40°C Symbol VBB Characteristic Output Reference Voltage 10E 100E IIH Input HIGH Current IEE Power Supply Current 10E 100E VPP(DC) VCMR Min Typ 0°C Max Min Typ 25°C Max Min Typ 85°C Max Min Typ Max Unit Cond V –1.43 –1.38 –1.30 –1.26 –1.38 –1.38 –1.27 –1.26 200 –1.35 –1.38 –1.25 –1.26 200 –1.31 –1.38 –1.19 –1.26 200 200 µA mA 29 29 Input Sensitivity 150 Commom Mode Range –2.0 35 35 29 29 35 35 150 –0.6 –2.0 29 29 35 35 29 29 150 –0.6 35 40 150 –2.0 –0.6 –2.0 –0.6 mV 1 V 2 1. Differential input voltage required to obtain a full ECL swing on the outputs. 2. VCMR is defined as the range within which the VIH level may vary, with the device still meeting the propagation delay specification. The VIL level must be such that the peak to peak voltage is less than 1.0 V and greater than or equal to VPP(min). AC CHARACTERISTICS (VEE = VEE (min) to VEE (max); VCC = VCCO = GND) –40°C Symbol 0°C to 85°C Characteristic Min Typ Max Min Typ Max tPLH tPHL Propagation Delay to Output D (Differential) D (Single-Ended) 150 150 300 300 500 550 200 150 300 300 450 500 tskew tskew Within-Device Skew VPP(AC) tr/tf Minimum Input Swing 150 Rise/Fall Time 250 Duty Cycle Skew Unit Condition ps 50 50 ±10 tPLH – tPHL ±10 150 375 625 275 375 575 ps 1 ps 2 mV 3 ps 20–80% 1. Within-device skew is defined as identical transitions on similar paths through a device. 2. Duty cycle skew is defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of the outputs. 3. Minimum input swing for which AC parameters are guaranteed. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E116 MC100E116 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E116 MC100E116 Motorola reserves the right to make changes without further notice to any products herein. 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