SEMICONDUCTOR TECHNICAL DATA The MC10E/100E256 contains three 4:1 multiplexers followed by transparent latches with differential outputs. Separate Select controls are provided for the leading 2:1 mux pairs (see logic symbol). When the Latch Enable (LEN) is LOW, the latch is transparent, and output data is controlled by the multiplexer select controls. A logic HIGH on LEN latches the outputs. The Master Reset (MR) overrides all other controls to set the Q outputs LOW. • • • • • • 3-BIT 4:1 MUX-LATCH 950ps Max. D to Output 850ps Max. LEN to Output Split Select Differential Outputs Extended 100E VEE Range of – 4.2V to – 5.46V 75kΩ Input Pulldown Resistors Pinout: 28-Lead PLCC (Top View) D1b D1a D2d D2c D2b 25 24 23 22 21 D2a VCCO 20 19 SEL1A 26 18 Q2 SEL1B 27 17 Q2 SEL2 28 16 VCC VEE 1 15 Q1 LEN 2 14 Q1 MR 3 13 VCCO D1c 4 12 Q0 5 6 7 8 D1d D0a D0b D0c 9 10 D0d VCCO FN SUFFIX PLASTIC PACKAGE CASE 776-02 11 Q0 * All VCC and VCCO pins are tied together on the die. FUNCTION TABLE Pin SEL2 SEL1A SEL1B State H H H PIN NAMES Operation Output c/d Data Input d Data Input b Data Pin Function D0x – D2x SEL1A, SEL1B SEL2 LEN MR Q0, Q0 – Q2, Q2 12/93 Motorola, Inc. 1996 2–1 REV 2 Data Inputs First-stage Select Inputs Second-stage Select input Latch Enable Master Reset Data Outputs MC10E256 MC100E256 LOGIC DIAGRAM D0a D0b D0c D Q0 EN R Q0 D Q1 EN R Q1 D Q2 EN R Q2 D0d D1a D1b D1c D1d D2a D2b D2c D2d SEL1A SEL1B SEL2 LEN MR DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E MOTOROLA min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 69 69 83 83 2–2 69 69 83 83 69 79 83 96 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E256 MC100E256 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic 25°C 85°C min typ max min typ max min typ max 900 1050 900 800 825 400 550 450 350 350 600 775 650 500 600 900 1050 900 800 825 400 550 450 350 350 600 775 650 500 600 900 1050 900 800 825 tPLH tPHL Propagation Delay to Output D SEL1 SEL2 LEN MR 400 550 450 350 350 600 775 650 500 600 ts Setup Time D SEL1 SEL2 400 600 500 275 300 250 400 600 500 275 300 250 400 600 500 275 300 250 Hold Time D SEL1 SEL2 300 100 200 – 275 – 300 – 250 300 100 200 – 275 – 300 – 250 300 100 200 – 275 – 300 – 250 tRR Reset Recovery Time 700 600 700 600 700 600 tPW Minimum Pulse Width MR 400 th tSKEW Within-Device Skew tr tf Rise/Fall Times 20 - 80% Unit Condition ps ps ps ps ps 400 50 400 50 50 ps 1 ps 275 475 700 275 475 700 275 475 700 1. Within-device skew is defined as identical transitions on similar paths through a device. ECLinPS and ECLinPS Lite DL140 — Rev 4 2–3 MOTOROLA MC10E256 MC100E256 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MOTOROLA T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–4 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E256 MC100E256 Motorola reserves the right to make changes without further notice to any products herein. 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