SEMICONDUCTOR TECHNICAL DATA The MC10E404/100E404 is a 4-bit differential AND/NAND device. The differential operation of the device makes it ideal for pulse shaping applications where duty cycle skew is critical. Special design techniques were incorporated to minimize the skew between the upper and lower level gate inputs. Because a negative 2-input NAND function is equivalent to a 2-input OR function, the differential inputs and outputs of the device also allow for its use as a fully differential 2 input OR/NOR function. The output RISE/FALL times of this device are significantly faster than most other standard ECLinPS devices resulting in an increased bandwidth. The differential inputs have clamp structures which will force the Q output of a gate in an open input condition to go to a LOW state. Thus, inputs of unused gates can be left open and will not affect the operation of the rest of the device. Note that the input clamp will take affect only if both inputs fall 2.5V below VCC. • • • • • QUAD DIFFERENTIAL AND/NAND Differential D and Q 700ps Max. Propagation Delay High Frequency Outputs FN SUFFIX PLASTIC PACKAGE CASE 776-02 Extended 100E VEE Range of – 4.2V to – 5.46V Internal 75kΩ Input Pulldown Resistors D2b 26 D2b 27 D2a 28 D3a D3a D3b 25 24 23 D3b VCCO Q3 22 21 20 Q3 19 18 Q2 17 Q2 16 VCC 15 Q1 Pinout: 28-Lead PLCC (Top View) VEE 1 D2a 2 14 Q1 D1b 3 13 Q0 D1b 4 12 Q0 5 6 7 8 9 10 D1a D1a D0b D0b D0a LOGIC DIAGRAM D0a D0a D0b D0b D1a D1a D1b D1b 11 D2a D2a D2b D2b D0a VCCO * All VCC and VCCO pins are tied together on the die. Q0 Q0 Q1 Q1 Q2 Q2 PIN NAMES Pin D3a D3a D3b D3b Function D[0:4], D[0:4] Differential Data Inputs Q[0:4], Q[0:4] Differential Data Outputs FUNCTION TABLE Da Db Q Da Db Q L L H H L H L H L L L H L L H H L H L H L H H H 12/93 Motorola, Inc. 1996 2–1 REV 2 Q3 Q3 MC10E404 MC100E404 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic IIH Input HIGH Current IEE Power Supply Current 10E 100E VPP(DC) Input Sensitivity min typ 25°C max min typ 150 85°C max min typ 150 max Unit 150 µA Condition mA 106 106 127 127 50 106 106 127 127 50 106 122 127 146 50 mV 1 VCMR Common Mode Range –1.5 0 –1.5 0 –1.5 0 V 2 1. Differential input voltage required to obtain a full ECL swing on the outputs. 2. VCMR is referenced to the most positive side of the differential input signal. Normal operation is obtained when the input signals are within the VCMR range and the input swing is greater than VPP MIN and < 1.0V. AC CHARACTERISTICS (VEE= VEE(min) to VEE(max); VCC = VCCO = GND) 0°C Symbol Characteristic 25°C 85°C min typ max min typ max min typ max 350 300 375 325 475 475 500 500 650 700 675 725 350 300 375 325 475 475 500 500 650 700 675 725 350 300 375 325 475 475 500 500 650 700 675 725 tPLH tPHL Propagation Delay to Output Da (Diff) Da (SE) Db (Diff) Db (SE) tSKEW Within-Device Skew VPP(AC) Minimum Input Swing 150 tr tf Rise/Fall Time 20 - 80% 150 Unit Condition ps 50 50 50 150 400 150 150 400 150 400 ps 1 mV 2 ps 1. Within-device skew is defined as identical transitions on similar paths through a device. 2. Minimum input swing for which AC parameters are guaranteed. MOTOROLA 2–2 ECLinPS and ECLinPS Lite DL140 — Rev 4 MC10E404 MC100E404 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B Y BRK -N- T L –M M U 0.007 (0.180) X G1 M S N T L –M S S N S D Z -L- -M- D W 28 V 1 C A 0.007 (0.180) M R 0.007 (0.180) M T L –M S T L –M S N S N S H S N S 0.007 (0.180) M T L –M N S S 0.004 (0.100) G J -T- K SEATING PLANE F VIEW S G1 T L –M S N 0.007 (0.180) M T L –M S N S VIEW S S NOTES: 1. DATUMS -L-, -M-, AND -N- DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIM G1, TRUE POSITION TO BE MEASURED AT DATUM -T-, SEATING PLANE. 3. DIM R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). ECLinPS and ECLinPS Lite DL140 — Rev 4 T L –M K1 E S S VIEW D-D Z 0.010 (0.250) 0.010 (0.250) 2–3 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 — 0.025 — 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 — 0.020 2° 10° 0.410 0.430 0.040 — MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 — 0.64 — 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 — 0.50 2° 10° 10.42 10.92 1.02 — MOTOROLA MC10E404 MC100E404 Motorola reserves the right to make changes without further notice to any products herein. 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