ONSEMI MC10E154

SEMICONDUCTOR TECHNICAL DATA
The MC10E/100E154 contains five 2:1 multiplexers followed by
transparent latches with differential outputs. When both Latch Enables
(LEN1, LEN2) are LOW, the latch is transparent, and output data is
controlled by the multiplexer select control, SEL. A logic HIGH on either
LEN1 or LEN2 (or both) latches the outputs. The Master Reset (MR)
overrides all other controls to set the Q outputs LOW.
•
•
•
•
•
•
•
5-BIT 2:1
MUX-LATCH
850ps Max. LEN to Output
825ps Max. D to Output
Differential Outputs
Asynchronous Master Reset
Dual Latch-Enables
Extended 100E VEE Range of – 4.2V to – 5.46V
75kΩ Input Pulldown Resistors
Pinout: 28-Lead PLCC (Top View)
D4b
D4a
D3b
D3a VCCO
Q4
Q4
25
24
23
22
20
19
21
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
SEL
26
18
Q3
LEN1
27
17
Q3
LEN2
28
16
VCC
LOGIC DIAGRAM
VEE
15
1
Q2
MR
2
14
Q2
D0a
3
13
Q1
D0b
4
12
Q1
5
6
7
D1a
D1b
D2a
8
9
D2b VCCO
D0a
MUX
D0b
SEL
D1a
MUX
D1b
SEL
10
11
D2a
MUX
Q0
Q0
D2b
SEL
D3a
MUX
D3b
SEL
D4a
MUX
D4b
SEL
Q
D
EN Q
R
Q0
Q
D
EN Q
R
Q1
Q
D
EN Q
R
Q2
Q
D
EN Q
R
Q3
Q
D
EN Q
R
Q4
Q0
Q1
Q2
* All VCC and VCCO pins are tied together on the die.
PIN NAMES
Pin
D0a – D4a
D0b – D4b
SEL
LEN1, LEN2
MR
Q0 – Q4
Q0 – Q4
Function
Input Data a
Input Data b
Data Select Input
Latch Enables
Master Reset
True Outputs
Inverted Outputs
SEL
LEN1
LEN2
TRUTH TABLE
SEL
Data
H
L
a
b
MR
12/93
 Motorola, Inc. 1996
Q3
2–1
REV 2
Q4
MC10E154 MC100E154
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
IIH
Input HIGH Current
IEE
Power Supply Current
10E
100E
min
typ
25°C
max
min
85°C
typ
max
150
min
typ
150
max
Unit
150
µA
Condition
mA
76
76
91
91
76
76
91
91
76
87
91
105
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
25°C
85°C
min
typ
max
min
typ
max
min
typ
max
700
925
750
800
325
475
350
450
500
650
500
600
700
925
750
800
325
475
350
450
500
650
500
600
700
925
750
800
tPLH
tPHL
Propagation Delay to Output
D
SEL
LEN
MR
325
475
350
450
500
650
500
600
ts
Setup Time
D
SEL
300
500
100
250
300
500
100
250
300
500
100
250
Hold Time
D
SEL
300
200
–100
– 250
300
200
–100
– 250
300
200
–100
– 250
tRR
Reset Recovery Time
800
600
800
600
800
600
tPW
Minimum Pulse Width
MR
400
th
tSKEW
Within-Device Skew
tr
tf
Rise/Fall Times
20 - 80%
Unit
Condition
ps
ps
ps
ps
ps
400
50
400
50
50
ps
1
ps
300
475
800
300
475
800
300
475
800
1. Within-device skew is defined as identical transitions on similar paths through a device.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E154 MC100E154
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
ECLinPS and ECLinPS Lite
DL140 — Rev 4
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
MOTOROLA
MC10E154 MC100E154
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
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applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
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and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola and
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal
Opportunity/Affirmative Action Employer.
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MOTOROLA
2–4
*MC10E154/D*
MC10E154/D
ECLinPS and ECLinPS Lite
DL140 — Rev 4