MOTOROLA MC14006BD

SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC
CASE 632
The MC14006B shift register is comprised of four separate shift register
sections sharing a common clock: two sections have four stages, and two
sections have five stages with an output tap on both the fourth and fifth
stages. This makes it possible to obtain a shift register of 4, 5, 8, 9, 10, 12,
13, 14, 16, 17, or 18 bits by appropriate selection of inputs and outputs. This
part is particularly useful in serial shift registers and time delay circuits.
P SUFFIX
PLASTIC
CASE 646
•
•
•
•
•
Output Transitions Occur on the Falling Edge of the Clock Pulse
Fully Static Operation
Can be Cascaded to Provide Longer Shift Register Lengths
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4006B
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D SUFFIX
SOIC
CASE 751A
ORDERING INFORMATION
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Vin, Vout
lin, lout
PD
Tstg
TL
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
Input or Output Current (DC or Transient),
per Pin
± 10
mA
Power Dissipation, per Package†
Storage Temperature
500
mW
– 65 to + 150
_C
260
_C
Lead Temperature (8–Second Soldering)
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
TRUTH TABLE
(Single Stage)
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
Dn
C
Qn+1
0
1
x
X = Don’t Care
0
1
Qn
BLOCK DIAGRAM
1
13
DP1
Q4
VDD = PIN 14
VSS = PIN 7
NC = PIN 2
4
11
DP5
D
D
4
STAGES
C
4
STAGES
C
12
Q8
Q9
5
10
DP10 Q13
D
D
1
STAGE
C
4
STAGES
C
6
8
DP14
9
Q17
D
4
STAGES
C
Q18
D
1
STAGE
C
CLOCK 3
LOGIC DIAGRAM
(ONE REGISTER STAGE)
C
C
#
*
DATA
* Transmission Gate
(C)
1
IN
C
OUT
D+1
C
#Inverter used only on the first stage of
each four–stage element.
Input to output is
(A) A bidirectional low impedance when control input 1 is “low” and control input 2 is “high”.
(B) An open circuit when control input 1 is “high” and control input 2 is “low”.
2
(C)
REV 3
1/94
MOTOROLA
Motorola, Inc. 1995
CMOS LOGIC DATA
MC14006B
25
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
Vdc
mAdc
IT = (1.3 µA/kHz) f + IDD
IT = (2.6 µA/kHz) f + IDD
IT = (3.9 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
PIN ASSIGNMENT
DP1
1
14
VDD
NC
2
13
Q4
C
3
12
Q9
DP5
4
11
Q8
DP10
5
10
Q13
DP14
6
9
Q18
VSS
7
8
Q17
NC = NO CONNECTION
MC14006B
26
MOTOROLA CMOS LOGIC DATA
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SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
300
110
80
600
220
160
5.0
10
15
200
120
80
100
60
40
—
—
fcl
5.0
10
15
—
—
—
5.0
8.3
12
2.5
4.2
6.0
MHz
tTLH
tTHL
5.0
10
15
—
—
—
—
—
15
5
4
µs
—
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
tPLH, tPHL = (1.7 ns/pF) CL + 220 ns
tPLH, tPHL = (0.66 ns/pF) CL + 77 ns
tPLH, tPHL = (0.5 ns/pF) CL + 55 ns
tPLH
tPHL
Clock Pulse Width
tWH
Clock Pulse Frequency
Clock Pulse Rise and Fall Time**
Unit
ns
ns
ns
—
Setup Time
tsu
5.0
10
15
0
0
0
– 50
– 15
– 8.0
—
—
—
ns
Hold Time
th
5.0
10
15
180
90
75
75
25
20
—
—
—
ns
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** When shift register sections are cascaded, the maximum rise and fall times of the clock input should be equal to or less than the rise and fall times
** of the data outputs driving data inputs, plus the propagation delay of the output driving stage for the output capacitance load.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
VDD = – VGS
Vout
VDD = VGS
14
14
CLOCK Q4
Q8
DP1
Q9
DP5 Q13
DP10 Q17
DP14 Q18
7
VSS
Vout
IOH
EXTERNAL
POWER
SUPPLY
Figure 1. Typical Output Source Current
Characteristics Test Circuit
MOTOROLA CMOS LOGIC DATA
CLOCK Q4
Q8
DP1
Q9
DP5 Q13
DP10 Q17
DP14 Q18
VSS
IOL
EXTERNAL
POWER
SUPPLY
Figure 2. Typical Output Sink Current
Characteristics Test Circuit
MC14006B
27
VDD
14
PULSE
GENERATOR
CLOCK Q4
Q8
DP1
Q9
DP5 Q13
DP10 Q17
DP14 Q18
CL
14
TEST
VSS CL
7
50
µF
CL
CL
CL
CL
8
9
PRESET
7
1/3 MC14000
OR EQUIV
ID
1
f
CLOCK
50%
DATA
Figure 3. Power Dissipation Test Circuit and Waveforms
VDD
14
PULSE
GENERATOR 1
CLOCK Q4
Q8
DP1
Q9
DP5
Q13
DP10 Q17
DP14 Q18
PULSE
GENERATOR 2
7
20 ns
20 ns
tWL
VSS
CL
CL
th “1”
tsu “1”
tWH
VDD
VSS
th “0”
tsu “0”
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
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ÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
DATA
5–STAGE
OUTPUT
Q9, Q18
CL
CL
90%
50%
10%
CLOCK
4–STAGE
OUTPUT
Q4, Q8
Q13, Q17
CL
CL
20 ns
90%
50%
10%
20 ns
tPLH
tTLH
VDD
VSS
tPHL
VOH
90%
50%
10%
tTLH
VOL
tTHL
tPHL
90%
50%
10%
VOH
tTHL
VOL
Output state can change since data previously clocked in might be in either state.
Figure 4. Switching Time Test Circuit and Waveforms
MC14006B
28
MOTOROLA CMOS LOGIC DATA
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
M
T A
S
14 PL
0.25 (0.010)
M
T B
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
B
A
F
L
C
J
N
H
G
D
SEATING
PLANE
MOTOROLA CMOS LOGIC DATA
K
M
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
MC14006B
29
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
M
F
–T–
M
K
D 14 PL
0.25 (0.010)
M
T B
S
M
R X 45 _
C
SEATING
PLANE
B
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
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MC14006B
30
◊
*MC14006B/D*
MOTOROLA CMOS LOGIC
DATA
MC14006B/D