ONSEMI HN2D02FUTW1T1

HN2D02FUTW1T1
Ultra High Speed
Switching Diodes
These Silicon Epitaxial Planar Diodes are designed for use in ultra
high speed switching applications. These devices are housed in the
SC−88 package which is designed for low power surface mount
applications.
• Fast trr, < 3.0 ns
• Low CD, < 2.0 pF
• Available in 8 mm Tape and Reel
Use HN2D02FUTW1T1 to order the 7 inch/3000 unit reel.
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4
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MAXIMUM RATINGS (TA = 25°C)
Rating
Reverse Voltage
Peak Reverse Voltage
Forward Current
Peak Forward Current
Peak Forward Surge Current (10 ms)
Symbol
Value
VR
80
85
IF
100
mAdc
IFM
240
mAdc
IFSM
(Note 1)
1.0
mAdc
2
3
SC−88
CASE 419B
Unit
VRM
5
6
5
4
1
2
3
THERMAL CHARACTERISTICS
Symbol
Max
Unit
Power Dissipation
Rating
PD
300
mW
Junction Temperature
TJ
150
°C
Storage Temperature
Tstg
−55 to + 150
°C
1. t = 10 ms
2. This is maximum rating for a single diode. Derate by 75 percent when
using 2 or 3 diodes.
MARKING DIAGRAM
R7 M
R7 = for Specified
Device Code
M = Date Code
 Semiconductor Components Industries, LLC, 2004
January, 2004 − Rev. 1
1
Publication Order Number:
HN2D02FUTW1T1/D
HN2D02FUTW1T1
ELECTRICAL CHARACTERISTICS (TA = 25°C)
Characteristic
Symbol
Condition
Min
Max
Unit
IR
VR = 35 V
—
0.1
Adc
VR = 75 V
—
0.1
Reverse Voltage Leakage Current
Forward Voltage
VF
IF = 100 mA
—
1.2
Vdc
Reverse Breakdown Voltage
VR
IR = 100 A
80
—
Vdc
CD
VR = 0, f = 1.0 MHz
—
2.0
pF
trr (Note 3)
IF = 10 mA, VR = 6.0 V,
RL = 100 , Irr = 0.1 IR
—
3.0
ns
Diode Capacitance
Reverse Recovery Time (Figure 1)
3. trr Test Circuit
RECOVERY TIME EQUIVALENT TEST CIRCUIT
INPUT PULSE
tr
OUTPUT PULSE
tp
t
A
IF
trr
t
10%
RL
Irr = 0.1 IR
90%
VR
tp = 2 s
tr = 0.35 ns
Figure 1. Reverse Recovery Time Equivalent Test Circuit
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IF = 10 mA
VR = 6 V
RL = 100 HN2D02FUTW1T1
10
100
I R, REVERSE CURRENT (A)
µ
10
TA = 85°C
TA = 25°C
1.0
TA = −40°C
0.1
0.2
0.4
0.6
0.8
1.0
TA = 85°C
0.1
TA = 55°C
0.01
0.001
1.2
TA = 125°C
1.0
TA = 25°C
0
10
20
30
VF, FORWARD VOLTAGE (VOLTS)
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Forward Voltage
Figure 3. Leakage Current
0.68
CD , DIODE CAPACITANCE (pF)
IF, FORWARD CURRENT (mA)
TA = 150°C
0.64
0.60
0.56
0.52
0
2
4
6
VR, REVERSE VOLTAGE (VOLTS)
Figure 4. Capacitance
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3
8
40
50
HN2D02FUTW1T1
PACKAGE DIMENSIONS
SC−88 (SOT−363)
CASE 419B−02
ISSUE N
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419B−01 OBSOLETE, NEW STANDARD
419B−02.
G
6
5
4
1
2
3
DIM
A
B
C
D
G
H
J
K
N
S
−B−
S
D 6 PL
0.2 (0.008)
M
B
M
INCHES
MIN
MAX
0.071 0.087
0.045 0.053
0.031 0.043
0.004 0.012
0.026 BSC
−−− 0.004
0.004 0.010
0.004 0.012
0.008 REF
0.079 0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
−−−
0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
N
J
C
H
K
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
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HN2D02FUTW1T1/D