STMICROELECTRONICS EMIF08

EMIF08-1502M16
8-line IPAD™
low capacitance EMI filter and ESD protection in micro QFN package
Features
■
EMI (I/O) low-pass filter
■
High efficiency in EMI filtering:
– Greater than 30 dB attenuation at
frequencies from 900 MHz to 1.8 GHz
■
Cut-off frequency: 300 MHz
■
Very low PCB space consumption:
3.3 mm x 1.5 mm
■
Very thin package: 0.6 mm max.
■
High efficiency in ESD suppression on inputs
pins (IEC 61000-4-2 level 4)
■
High reliability offered by monolithic integration
■
High reduction of parasitic elements through
integration
■
1
Micro QFN 16L 3.3 mm x 1.5 mm
(bottom view)
Figure 1.
Basic cell configuration
170 Ω
Input 1
Output 1
Lead-free package
Complies with following standards:
■
IEC 61000-4-2 level 4 input pins
– 15 kV (air discharge)
– 8 kV (contact discharge)
■
MIL STD 883G - Method 3015-7 Class 3A
(all pins)
Applications
Where EMI filtering in ESD sensitive equipment is
required:
■
LCD and camera for Mobile phones
■
Computers and printers
■
Communication systems
■
MCU boards
Typical line capacitance = 14 pF typ. @ 2.5 V
Description
The EMIF08-1502M16 is an 8-line, highly
integrated device designed to suppress EMI/RFI
noise in all systems exposed to electromagnetic
interference.
This filter includes an ESD protection circuitry,
which prevents damage to the application when
subjected to ESD surges up to 15 kV on the input
pins.
TM: IPAD is a trademark of STMicroelectronics
February 2008
Rev 2
1/10
www.st.com
Characteristics
1
EMIF08-1502M16
Characteristics
Figure 2.
Pin configuration (top view)
Pin 1
Output 1 Pin 16
Input 1
Output 2 Pin 15
Pin 2 Input 21
Table 1.
Symbol
VPP
Tj
2/10
Pin 3
Input 3
Output 3 Pin 14
Pin 4
Input 4
Output 4 Pin 13
Pin 5
Input 5
Output 5 Pin 12
Pin 6
Input 6
Output 6 Pin 11
Pin 7
Input 7
Output 7 Pin 10
Pin 8
Input 8
Output 8 Pin 9
Absolute ratings (limiting values)
Parameter
Value
Unit
ESD IEC 61000-4-2, air discharge on input pins
ESD IEC 61000-4-2, contact discharge on input pins
ESD IEC 61000-4-2, contact discharge on output pins
15
8
4
kV
Maximum junction temperature
125
°C
Top
Operating temperature range
- 40 to + 85
°C
Tstg
Storage temperature range
- 55 to + 150
°C
EMIF08-1502M16
Table 2.
Characteristics
Electrical characteristics (Tamb = 25 °C)
Symbol
Parameter
I
VBR
Breakdown voltage
IRM
Leakage current @ VRM
VRM
Stand-off voltage
VCL
Clamping voltage
Rd
Dynamic resistance
IPP
Peak pulse current
RI/O
Series resistance between Input & Output
Cline
Input capacitance per line
IF
VBR
VCL
VF
VRM
V
IRM
IR
Symbol
IPP
Test conditions
Min.
Typ.
Max.
Unit
VBR
IR = 1 mA
6
8
10
V
VF
IF = 10 mA
0.5
1.0
1.5
V
IRM
VRM = 3 V per line
100
nA
RI/O
Tolerance ± 10%
153
170
187
Ω
Cline
VLINE = 2.5 V dc, VOSC = 30 mV, F = 1 MHz
12
14
16.5
pF
Figure 3.
0.00
S21 attenuation measurement
Figure 4.
Analog cross talk measurements
dB
dB
0.00
-10.00
-20.00
-30.00
- 15.00
-40.00
-50.00
-60.00
- 30.00
-70.00
-80.00
F (Hz)
F (Hz)
-90.00
- 45.00
1.0M
3.0M
10.0M 30.0M
100.0M
300.0M
1.0G
3.0G
-100.00
100.0k
1.0M
10.0M
100.0M
1.0G
3/10
Ordering information scheme
EMIF08-1502M16
Figure 5.
ESD response to IEC 61000-4-2
Figure 6.
(+15 kV air discharge) on one input
(Vin) and on one output (Vout)
Figure 7.
Line capacitance versus reverse voltage applied (typical value)
ESD response to IEC 61000-4-2
(- 15 kV air discharge) on one input
(Vin) and on one output (Vout)
CLINE(pF)
24
22
20
18
16
14
12
10
8
6
4
2
0
VLINE(V)
0.0
2
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
5.0
Ordering information scheme
Figure 8.
Ordering information scheme
EMIF
EMI Filter
Number of lines
Information
x = resistance value (Ohms)
z = capacitance value / 10 (pF)
Package
Mx = Micro QFN x leads
4/10
4.5
yy
-
xxx z
Mx
EMIF08-1502M16
3
Package information
Package information
●
Epoxy meets UL94, V0
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the inner box label, in compliance with JEDEC
Standard JESD97. The maximum ratings related to soldering conditions are also marked on
the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at
www.st.com.
Table 3.
Micro QFN 3.3x1.5 16L dimensions
Dimensions
TOP VIEW
Ref.
D
SIDE VIEW
A1
A
Inches
Min.
Typ.
Max.
A
0.50
0.55
0.60 0.020 0.022 0.024
A1
0.00
0.02
0.05 0.000 0.001 0.002
b
0.15
0.20
0.25 0.006 0.008 0.010
D
3.20
3.30
3.40 0.126 0.130 0.134
D2
2.45
2.60
2.70 0.096 0.102 0.106
E
1.40
1.50
1.60 0.055 0.059 0.063
E2
0.20
0.35
0.45 0.008 0.014 0.018
INDEX AREA
(D/2 x E/2)
E
Millimeters
Min.
Typ.
Max.
BOTTOM VIEW
e
INDEX AREA
(D/2 x E/2)
b
EXPOSED PAD
PIN # 1 ID
E2
D2
L
Figure 9.
e
K
0.40
K
0.20
L
0.20
0.016
0.008
0.30
0.40 0.008 0.012 0.016
Micro QFN 3.3x1.5 16L
Figure 10. Marking
footprint (dimensions in mm)
0.40
Dot : Pin 1 Identification
X X= Marking
WW= DataCode (week)
Y=Data code(Year)
P=Assembly plant
0.20
0.60
0.275
0.35
XX
WW
YP
2.60
5/10
Package information
EMIF08-1502M16
Figure 11. Tape and reel specification
Dot identifying Pin A1 location
All dimensions in mm
Note:
6/10
5.5 ± 0.1
12.00 ± 0.3
3.70 ± 0.1
0.80 ± 0.1
Ø 1.55 ± 0.05
4.00 ± 0.1
1.75 ± 0.1
2.00 ± 0.1
XX
WW
YP
XX
WW
YP
1.70 ± 0.1
XX
WW
YP
XX
WW
YP
XX
WW
YP
XX
WW
YP
4.00 ± 0.1
User direction of unreeling
Product marking may be rotated by 90° for assembly plant differentiation. In no case should
this product marking be used to orient the component for its placement on a PCB. Only pin 1
mark is to be used for this purpose.
EMIF08-1502M16
Recommendation on PCB assembly
4
Recommendation on PCB assembly
4.1
Stencil opening design
1.
General recommendation on stencil opening design
a)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
Figure 12. Stencil opening dimensions
L
T
b)
W
General design rule
Stencil thickness (T) = 75 ~ 125 µm
W
Aspect Ratio = ----- ≥ 1.5
T
L×W
Aspect Area = ---------------------------- ≥ 0.66
2T ( L + W )
2.
Reference design
a)
Stencil opening thickness: 100 µm
b)
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
c)
Stencil opening for leads: Opening to footprint ratio is 90%.
Figure 13. Recommended stencil window position
5 µm
5 µm
570 µm
600 µm
15 µm
0.40
0.20
0.60
190 µm
15 µm
0.275
0.35
200 µm
2600 µm
350 µm
2.60
250 µm
50 µm
1820 µm
Footprint
50 µm
390 µm
390 µm
Stencil window
Footprint
7/10
Recommendation on PCB assembly
4.2
4.3
4.4
8/10
EMIF08-1502M16
Solder paste
1.
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
2.
“No clean” solder paste is recommended.
3.
Offers a high tack force to resist component movement during high speed
4.
Solder paste with fine particles: powder particle size is 20-45 µm.
Placement
1.
Manual positioning is not recommended.
2.
It is recommended to use the lead recognition capabilities of the placement system, not
the outline centering
3.
Standard tolerance of ± 0.05 mm is recommended.
4.
3.5 N placement force is recommended. Too much placement force can lead to
squeezed out solder paste and cause solder joints to short. Too low placement force
can lead to insufficient contact between package and solder paste that could cause
open solder joints or badly centered packages.
5.
To improve the package placement accuracy, a bottom side optical control should be
performed with a high resolution tool.
6.
For assembly, a perfect supporting of the PCB (all the more on flexible PCB) is
recommended during solder paste printing, pick and place and reflow soldering by
using optimized tools.
PCB design preference
1.
To control the solder paste amount, the closed via is recommended instead of open
vias.
2.
The position of tracks and open vias in the solder area should be well balanced. The
symmetrical layout is recommended, in case any tilt phenomena caused by
asymmetrical solder paste amount due to the solder flow away.
EMIF08-1502M16
4.5
Ordering information
Reflow profile
Figure 14. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Temperature (°C)
260°C max
255°C
220°C
180°C
125 °C
2°C/s recommended
2°C/s recommended
6°C/s max
6°C/s max
3°C/s max
3°C/s max
0
0
1
2
3
4
5
6
90 to 150 sec
7
Time (min)
10-30 sec
90 sec max
Note:
Minimize air convection currents in the reflow oven to avoid component movement.
5
Ordering information
Table 4.
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
EMIF08-1502M16
G8(1)
Micro QFN
7.2 mg
3000
Tape and reel (7”)
1. The marking can be rotated by 90° to differentiate assembly location
6
Revision history
Table 5.
Document revision history
Date
Revision
Changes
24-Oct-2006
1
Initial release.
04-Feb-2008
2
Reformatted to current standards. Updated ECOPACK statement.
Added Section 4: Recommendation on PCB assembly.
9/10
EMIF08-1502M16
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10/10