STMICROELECTRONICS RH40N25FSY3

STRH40N25FSY3
N-channel 250V - 0.084Ω - TO-254AA
Rad-hard low gate charge STripFET™ Power MOSFET
PRELIMINARY DATA
Features
Type
VDSS
STRH40N25FSY3
250V
■
Low RDS(on)
■
Fast switching
■
Single event effect (SEE) hardened
■
Low total gate charge
■
Light weight
■
100% avalanche tested
■
Application oriented characterization
■
Hermetically sealed
■
Heavy ion SOA
■
100kRad TID
■
SEL & SEGR with 34Mev/cm²/mg LET ions
TO-254AA
Internal schematic diagram
Description
This Power MOSFET series realized with
STMicroelectronics unique STripFET process has
specifically been designed to improve immunity to
space effect. It is therefore suitable as power
switch in mainly high-efficiency DC-DC converters
and Motor Control applications. It is also intended
for any application with low gate charge drive
requirements.
Applications
■
Satellite
■
High reliability applications
Order codes
Part number
Marking
Package
Packaging
(1)
RH40N25FSY1
TO-254AA
Individual strip pack
(2)
RH40N25FSY3
TO-254AA
Individual strip pack
STRH40N25FSY1
STRH40N25FSY3
1. Mil temp range
2. Space flights parts (full ESA flow screening)
March 2007
Rev 2
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/13
www.st.com
13
Contents
STRH40N25FSY3
Contents
1
Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1
Pre-irradiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.2
Post-irradiation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Test circuit
4
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2/13
................................................ 9
STRH40N25FSY3
1
Electrical ratings
Electrical ratings
Table 1.
Absolute maximum ratings (pre-irradiation)
Symbol
Parameter
Value
Unit
VDS
Drain-source voltage (VGS = 0)
250
V
VGS
Gate-source voltage
±16
V
Drain current (continuous) at TC= 25°C
36
A
Drain current (continuous) at TC= 100°C
23
A
Drain current (pulsed)
144
A
Total dissipation at TC= 25°C
278
W
4
V/ns
-55 to 150
°C
150
°C
Value
Unit
0.45
°C/W
0.21
°C/W
48
°C/W
Value
Unit
ID
(1)
ID (1)
IDM (2)
PTOT
(1)
dv/dt (3)
Tstg
Tj
Peak diode recovery voltage slope
Storage temperature
Max. operating junction temperature
1. Rated according to the Rthj-case
2. Pulse width limited by safe operating area
3. ISD < 40A, di/dt < 400A/µs, VDD = 80% V(BR)DSS
Table 2.
Thermal data
Symbol
Parameter
Rthj-case Thermal resistance junction-case
Rthc-s
Case-to-sink
Rthj-amb Thermal resistance junction -amb
Table 3.
Symbol
Avalanche characteristics
Parameter
IAR
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj Max)
40
A
EAS
Single pulse avalanche energy
(starting Tj=25°C, Id=Iar, Vdd=50V)
320
mJ
EAR
Repetitive avalanche
25
mJ
3/13
Electrical characteristics
2
STRH40N25FSY3
Electrical characteristics
(TCASE = 25°C unless otherwise specified)
2.1
Pre-irradiation
Table 4.
Symbol
Parameter
Test conditions
Min.
Typ.
Max.
Unit
IDSS
Zero gate voltage drain
current (VGS = 0)
80% BVDss
10
µA
IGSS
Gate body leakage current
(VDS = 0)
VGS = ±16V
±100
nA
BVDSS
Drain-to-source breakdown
voltage
ID = 1mA, VGS = 0V
250
VGS(th)
Gate threshold voltage
VDS =VGS, ID = 1mA
2
RDS(on)
Static drain-source on
resistance
VGS = 12V, ID = 20A
Table 5.
Symbol
V
4.5
V
0.084
0.1
Ω
Typ.
Max.
Unit
Dynamic
Parameter
Test conditions
Min.
Ciss
Coss
Crss
Input capacitance
Output capacitance
Reverse transfer
capacitance
VDS = 0V, f=1MHz,
VGS=12V
9100
650
45
Qg
Qgs
Qgd
Total gate charge
Gate-to-source charge
Gate-to-drain (“Miller”)
charge
VDD = 200V, ID = 40A,
VGS=12V
202
34
58
280
47
80
nC
nC
nC
RG
Gate input resistance
f=1MHz Gate DC Bias=0
Test signal level=20mV
open drain
1.4
3
Ω
Table 6.
Symbol
td(on)
tr
td(off)
tf
4/13
On/off states
pF
pF
pF
Switching times
Parameter
Turn-on delay time
Rise time
Turn-off-delay time
Fall time
Test conditions
VDD = 125V, ID =40 A,
RG = 4.7Ω, VGS = 12V
Min.
Typ.
33
80
123
145
Max
Unit
ns
ns
ns
ns
STRH40N25FSY3
Table 7.
Symbol
Electrical characteristics
Source drain diode
Parameter
Test conditions
ISD
ISDM (1)
Source-drain current
Source-drain current (pulsed)
VSD (2)
Forward on voltage
ISD = 40A, VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 40A, di/dt = 100A/µs
VDD= 50V, Tj = 150°C
trr
Qrr
IRRM
Min. Typ. Max Unit
36
144
A
A
1.5
V
484
8.4
35
ns
µC
A
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300µs, duty cycle 1.5%
2.2
Post-irradiation
The ST Rad-Hard Power MOSFETs are tested to verify the radiation capability. The
technology is extremely resistant to assurance well functioning of the device inside the
radiation environments. Every manufacturing lot is tested for total ionizing dose.
(@Tj=25°C up to 100Krad (a))
Table 8.
Symbol
On/off states
Parameter
Test conditions
Min.
IDSS
Zero gate voltage drain current
80% BVDss
(VGS = 0)
IGSS
Gate body leakage current
(VDS = 0)
VGS = ±16V
BVDSS
Drain-to-source breakdown
voltage
ID = 1mA, VGS = 0V
250
VGS(th)
Gate threshold voltage
VDS =VGS, ID = 1mA
2
RDS(on)
Static drain-source on
resistance
VGS = 12V, ID = 20A
Typ.
Max.
Unit
10
µA
±100
nA
V
0.084
4.5
V
0.1
Ω
a. According to ESCC 22900 specification, Co60 gamma rays, dose rags:0.1rad/sec.
5/13
Electrical characteristics
Table 9.
STRH40N25FSY3
Single event effect, SOA(1)
Ion
Let (Mev/(mg/cm2))
Energy (MeV)
Range (µm)
VDS (V) @VGS0V
Kr
34
316
43
250
Xe
55.9
459
43
244
1. Rad-Hard Power MOSFETs have been characterized in heavy ion environment for single event effect
(SEE). Single event effect characterization is illustrated
Table 10.
Symbol
Source drain diode
Parameter
Test conditions
ISD
ISDM (1)
Source-drain current
Source-drain current (pulsed)
VSD (2)
Forward on voltage
ISD = 40A, VGS = 0
Reverse recovery time
Reverse recovery charge
Reverse recovery current
ISD = 40A, di/dt = 100A/µs
VDD= 50V, Tj = 150°C
trr
Qrr
IRRM
1. Pulse width limited by safe operating area
2. Pulsed: pulse duration = 300µs, duty cycle 1.5%
6/13
Min. Typ. Max Unit
484
8.4
35
36
144
A
A
1.5
V
ns
µC
A
STRH40N25FSY3
Electrical characteristics
2.3
Electrical characteristics (curves)
Figure 1.
Safe operating area
Figure 2.
Thermal impedance
Figure 3.
Output characteristics
Figure 4.
Transfer characteristics
7/13
Electrical characteristics
STRH40N25FSY3
Figure 5.
Gate charge vs. gate-source
voltage
Figure 7.
Normalized BVDSS vs. temperature Figure 8.
8/13
Figure 6.
Capacitance variations
Static drain-source on resistance
STRH40N25FSY3
Figure 9.
Normalized gate threshold voltage
vs. temperature
Electrical characteristics
Figure 10. Normalized on resistance vs.
temperature
Figure 11. Source drain-diode forward
characteristics
9/13
Test circuit
3
STRH40N25FSY3
Test circuit
Figure 12. Switching times test circuit for resistive load (1)
1. Max driver VGS slope = 1V/ns (no DUT)
10/13
STRH40N25FSY3
4
Package mechanical data
Package mechanical data
TO-254AA MECHANICAL DATA
DIM.
A
B
C
D
E
F
G
H
I
J
K
L
M
N
R1
R2
MIN.
13.59
13.59
20.07
6.32
1.02
3.53
16.89
mm.
TYP
MAX.
13.84
13.84
20.32
6.60
1.27
3.78
17.40
MIN.
0.535
0.535
0.790
0.249
0.040
0.139
0.665
1.14
0.035
6.86
0.89
0.045
0.150
0.150
14.50
3.05
0.510
0.570
0.120
0.71
1.0
1.65
MAX.
0.545
0.545
0.80
0.260
0.050
0.149
0.685
0.270
3.81
3.81
12.95
inch
TYP.
0.025
0.040
0.065
11/13
Revision history
5
STRH40N25FSY3
Revision history
Table 11.
12/13
Revision history
Date
Revision
Changes
18-Dec-2006
1
First release
02-Mar-2007
2
Some values changed on Table 4 and Table 8
STRH40N25FSY3
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