MAXIM MAX1438

19-0523; Rev 1; 2/11
KIT
ATION
EVALU
E
L
B
A
AVAIL
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
Features
The MAX1436B octal, 12-bit analog-to-digital converter
(ADC) features fully differential inputs, a pipelined
architecture, and digital error correction incorporating a
fully differential signal path. This ADC is optimized for
low-power and high-dynamic performance in medical
imaging instrumentation and digital communications
applications. The MAX1436B operates from a 1.8V single supply and consumes only 743mW (93mW per
channel) while delivering a 69.9dB (typ) signal-to-noise
ratio (SNR) at a 5.3MHz input frequency. In addition to
low operating power, the MAX1436B features a lowpower standby mode for idle periods.
o Excellent Dynamic Performance
69.9dB SNR at 5.3MHz
96dBc SFDR at 5.3MHz
95dB Channel Isolation
An internal 1.24V precision bandgap reference sets the
full-scale range of the ADC. A flexible reference structure allows the use of an external reference for applications requiring increased accuracy or a different input
voltage range. The reference architecture is optimized
for low noise.
o LVDS Outputs Support Up to 30 Inches FR-4
Backplane Connections
A single-ended clock controls the data-conversion
process. An internal duty-cycle equalizer compensates
for wide variations in clock duty cycle. An on-chip PLL
generates the high-speed serial low-voltage differential
signal (LVDS) clock.
The MAX1436B has self-aligned serial LVDS outputs for
data, clock, and frame-alignment signals. The output
data is presented in two’s complement or binary format.
The MAX1436B offers a maximum sample rate of
40Msps. See the Pin-Compatible Versions table below
for higher-speed versions. This device is available in a
small, 14mm x 14mm x 1mm, 100-pin TQFP package
with exposed pad and is specified for the extended
industrial (-40°C to +85°C) temperature range.
Applications
Ultrasound and Medical Imaging
o Ultra-Low Power
93mW per Channel (Normal Operation)
Fast 200μs Wake-Up Time from Standby
o Serial LVDS Outputs
o Pin-Selectable LVDS/SLVS (Scalable Low-Voltage
Signal) Mode
o Test Mode for Digital Signal Integrity
o Fully Differential Analog Inputs
o Wide Differential Input Voltage Range (1.4VP-P)
o On-Chip 1.24V Precision Bandgap Reference
o Clock Duty-Cycle Equalizer
o Compact, 100-Pin TQFP Package with Exposed
Pad
o Evaluation Kit Available (Order MAX1436BEVKIT)
Ordering Information
PART
TEMP RANGE
MAX1436BECQ+D
PIN-PACKAGE
100 TQFP-EP*
-40°C to +85°C
(14mm x 14mm x 1mm)
+Denotes a lead(Pb)-free/RoHS-compliant package.
D = Dry pack.
*EP = Exposed pad.
Instrumentation
Multichannel Communications
Pin-Compatible Versions
SAMPLING
RATE (Msps)
RESOLUTION
(Bits)
MAX1434
50
10
Power-down
MAX1436
40
12
Power-down
MAX1436B
40
12
Standby
MAX1437
50
12
Power-down
MAX1438
65
12
Power-down
PART
POWERSAVE MODE
Pin Configuration appears at the end of data sheet.
________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
1
MAX1436B
General Description
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
ABSOLUTE MAXIMUM RATINGS
(Voltages referenced to GND)
AVDD.....................................................................-0.3V to +2.0V
CVDD.....................................................................-0.3V to +3.6V
OVDD ....................................................................-0.3V to +2.0V
IN_P, IN_N ..............................................-0.3V to (VAVDD + 0.3V)
CLK ........................................................-0.3V to (VCVDD + 0.3V)
OUT_P, OUT_N, FRAME_, CLKOUT_ ......-0.3V to (VOVDD + 0.3V)
DT, SLVS/LVDS, LVDSTEST, PLL_, T/B, STBY,
REFIO, REFADJ, CMOUT...................-0.3V to (VAVDD + 0.3V)
Continuous Power Dissipation (TA = +70°C)
TQFP (derate 47.6mW/°C above +70°C) ................3809.5mW
Operating Temperature Range ...........................-40°C to +85°C
Maximum Junction Temperature .....................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TQFP
Junction-to-Ambient Thermal Resistance (θJA) ...........21°C/W
Junction-to-Case Thermal Resistance (θJC) ..................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
ELECTRICAL CHARACTERISTICS
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, external VREFIO = 1.24V, CREFIO = 0.1µF, CREFP = 10µF, CREFN = 10µF, fCLK
= 40MHz (50% duty cycle), VDT = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
±0.4
±3
LSB
DC ACCURACY (Note 4)
Resolution
N
Integral Nonlinearity
INL
Differential Nonlinearity
DNL
12
No missing codes over temperature
Bits
±1
LSB
Offset Error
±0.25
±0.5
%FS
Gain Error
±2.4
%FS
ANALOG INPUTS (IN_P, IN_N)
Input Differential Range
Common-Mode Voltage Range
VID
Differential input
VCMO
Common-Mode Voltage Range
Tolerance
(Note 5)
Differential Input Impedance
RIN
Differential Input Capacitance
CIN
Switched capacitor load
1.4
VP-P
0.76
V
±50
mV
2
kΩ
12.5
pF
CONVERSION RATE
Maximum Conversion Rate
fSMAX
Minimum Conversion Rate
fSMIN
Data Latency
2
40
MHz
4.0
MHz
6.5
Cycles
_______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, external VREFIO = 1.24V, CREFIO = 0.1µF, CREFP = 10µF, CREFN = 10µF, fCLK
= 40MHz (50% duty cycle), VDT = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DYNAMIC CHARACTERISTICS (differential inputs, 4096-point FFT) (Note 4)
Signal-to-Noise Ratio
SNR
Signal-to-Noise and Distortion
(First 4 Harmonics)
SINAD
Effective Number of Bits
ENOB
Spurious-Free Dynamic Range
SFDR
Total Harmonic Distortion
THD
Intermodulation Distortion
fIN = 5.3MHz at -0.5dBFS
fIN = 19.3MHz at -0.5dBFS
69.9
66.5
fIN = 5.3MHz at -0.5dBFS
fIN = 19.3MHz at -0.5dBFS
69.9
66.5
11.3
fIN = 19.3MHz at -0.5dBFS
11.3
fIN = 5.3MHz at -0.5dBFS
dB
69.6
fIN = 5.3MHz at -0.5dBFS
fIN = 19.3MHz at -0.5dBFS
dB
69.6
dB
96
79
dBc
90
fIN = 5.3MHz at -0.5dBFS
-96
fIN = 19.3MHz at -0.5dBFS
-92
IMD
f1 = 5.3MHz at -6.5dBFS
f2 = 6.3MHz at -6.5dBFS
89.8
dBc
Third-Order Intermodulation
IM3
f1 = 5.3MHz at -6.5dBFS
f2 = 6.3MHz at -6.5dBFS
96.6
dBc
Aperture Jitter
tAJ
Figure 11
< 0.4
psRMS
Aperture Delay
tAD
dBc
1
ns
Small-Signal Bandwidth
SSBW
Input at -20dBFS
100
MHz
Full-Power Bandwidth
LSBW
Input at -0.5dBFS
100
MHz
IN_P = IN_N
0.44
LSBRMS
1
Clock
cycle
Output Noise
Over-Range Recovery Time
tOR
Figure 11
-79
RS = 25Ω, CS = 50pF
INTERNAL REFERENCE
REFADJ Internal Reference-Mode
Enable Voltage
(Note 6)
0.1
REFADJ Low-Leakage Current
REFIO Output Voltage
Reference Temperature
Coefficient
1.5
VREFIO
1.18
TCREFIO
1.24
120
V
mA
1.30
V
ppm/°C
EXTERNAL REFERENCE
REFADJ External ReferenceMode Enable Voltage
(Note 6)
VAVDD 0.1
V
REFADJ High-Leakage Current
200
REFIO Input Voltage
1.24
V
±5
%
<1
µA
REFIO Input Voltage Tolerance
REFIO Input Current
IREFIO
µA
_______________________________________________________________________________________
3
MAX1436B
ELECTRICAL CHARACTERISTICS (continued)
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
ELECTRICAL CHARACTERISTICS (continued)
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, external VREFIO = 1.24V, CREFIO = 0.1µF, CREFP = 10µF, CREFN = 10µF, fCLK
= 40MHz (50% duty cycle), VDT = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
COMMON-MODE OUTPUT (CMOUT)
CMOUT Output Voltage
VCMOUT
0.76
V
CLOCK INPUT (CLK)
Input High Voltage
VCLKH
Input Low Voltage
VCLKL
0.8 x
VAVDD
0.2 x
VAVDD
Clock Duty Cycle
Clock Duty-Cycle Tolerance
Input Leakage Current
DIIN
Input Capacitance
DCIN
V
V
50
%
±30
%
Input at GND
5
Input at AVDD
80
5
µA
pF
DIGITAL INPUTS (PLL_, LVDSTEST, DT, SLVS, STBY, T/B)
Input Logic-High Voltage
VIH
Input Logic-Low Voltage
VIL
Input Leakage Current
DIIN
Input Capacitance
DCIN
0.8 x
VAVDD
V
0.2 x
VAVDD
Input at GND
5
Input at AVDD
80
5
V
µA
pF
LVDS OUTPUTS (OUT_P, OUT_N), SLVS/LVDS = 0
Differential Output Voltage
Output Common-Mode Voltage
VOHDIFF
RTERM = 100Ω
250
VOCM
RTERM = 100Ω
1.125
450
1.375
mV
V
Rise Time (20% to 80%)
tRL
RTERM = 100Ω, CLOAD = 5pF
350
ps
Fall Time (80% to 20%)
tFL
RTERM = 100Ω, CLOAD = 5pF
350
ps
SLVS OUTPUTS (OUT_P, OUT_N, CLKOUTP, CLKOUTN, FRAMEP, FRAMEN), SLVS/LVDS = 1, DT = 1
Differential Output Voltage
Output Common-Mode Voltage
VOHDIFF
RTERM = 100Ω
VOCM
205
mV
RTERM = 100Ω
220
mV
Rise Time (20% to 80%)
tRS
RTERM = 100Ω, CLOAD = 5pF
320
ps
Fall Time (80% to 20%)
tFS
RTERM = 100Ω, CLOAD = 5pF
320
ps
STANDBY MODE (STBY)
STBY Fall to Output Enable
tENABLE
200
µs
STBY Rise to Output Disable
tDISABLE
60
ns
4
_______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, external VREFIO = 1.24V, CREFIO = 0.1µF, CREFP = 10µF, CREFN = 10µF, fCLK
= 40MHz (50% duty cycle), VDT = 0V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.) (Notes 2, 3)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
POWER REQUIREMENTS
AVDD Supply Voltage Range
VAVDD
1.7
1.8
1.9
V
OVDD Supply Voltage Range
VOVDD
1.7
1.8
1.9
V
CVDD Supply Voltage Range
VCVDD
1.8
3.6
V
337
380
1.7
STBY = 0
AVDD Supply Current
IAVDD
fIN = 19.3MHz STBY = 0, DT = 1
at -0.5dBFS
STBY = 1, standby,
no clock input
337
37
STBY = 0
OVDD Supply Current
IOVDD
CVDD Supply Current
ICVDD
CVDD is used only to bias ESD-protection
diodes on CLK input, Figure 2
Power Dissipation
PDISS
fIN = 19.3MHz at -0.5dBFS
mA
76
fIN = 19.3MHz STBY = 0, DT = 1
at -0.5dBFS
STBY = 1, standby,
no clock input
mA
100
99
mA
16
µA
0
mA
743
864
mW
TIMING CHARACTERISTICS (Note 8)
Data Valid to CLKOUT Rise/Fall
tOD
Figure 5 (Notes 7, 8)
CLKOUT Output-Width High
tCH
Figure 5
CLKOUT Output-Width Low
tCL
Figure 5
FRAME Rise to CLKOUT Rise
tCF
Figure 4 (Note 8)
Sample CLK Rise to FRAME Rise
tSF
Figure 4 (Note 8)
Crosstalk
(Note 4)
(tSAMPLE/24)
- 0.15
(tSAMPLE/24)
+ 0.15
ns
tSAMPLE/12
ns
tSAMPLE/12
ns
(tSAMPLE/24)
- 0.15
(tSAMPLE/24)
+ 0.15
ns
(tSAMPLE/2)
+ 2.6
ns
(tSAMPLE/2)
+ 1.1
-95
dB
Gain Matching
CGM
fIN = 5.3MHz (Note 4)
±0.1
dB
Phase Matching
CPM
fIN = 5.3MHz (Note 4)
±0.25
Degrees
Note 2: Specifications at TA ≥ +25°C are guaranteed by production testing. Specifications at TA < +25°C are guaranteed by design
and characterization and not subject to production testing.
Note 3: All capacitances are between the indicated pin and GND, unless otherwise noted.
Note 4: See definition in the Parameter Definitions section at the end of this data sheet.
Note 5: See the Common-Mode Output (CMOUT) section.
Note 6: Connect REFADJ to GND directly to enable internal reference mode. Connect REFADJ to AVDD directly to disable the internal bandgap reference and enable external reference mode.
Note 7: Data valid to CLKOUT rise/fall timing is measured from 50% of data output level to 50% of clock output level.
Note 8: Guaranteed by design and characterization. Not subject to production testing.
_______________________________________________________________________________________
5
MAX1436B
ELECTRICAL CHARACTERISTICS (continued)
Typical Operating Characteristics
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, internal reference, differential input at -0.5dBFS, fIN = 5.3MHz, fCLK =
40MHz (50% duty cycle), VDT = 0V, CLOAD = 10pF, TA = +25°C, unless otherwise noted.)
-40
-50
-60
-70
-80
HD2
-30
-40
-50
-60
-70
-80
HD3
HD3
HD2
-20
-30
-40
-50
-60
-70
-90
-90
-90
-100
-100
10
15
20
0
5
10
15
0
20
5
10
15
20
FREQUENCY (MHz)
FREQUENCY (MHz)
FREQUENCY (MHz)
TWO-TONE INTERMODULATION DISTORTION
(16,384-POINT DATA RECORD)
BANDWIDTH
vs. ANALOG INPUT FREQUENCY
SIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT FREQUENCY
-30
FULL-POWER
BANDWIDTH
-0.5dBFS
-2
-3
-50
-60
72
71
70
69
-4
-5
68
67
66
-70
-6
-80
-7
65
-90
-8
64
-100
-9
63
62
-10
-110
0
5
10
15
10
1
20
100
0
1000
20
40
60
80
100
FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (MHz)
ANALOG INPUT FREQUENCY (MHz)
SIGNAL-TO-NOISE PLUS DISTORTION
vs. ANALOG INPUT FREQUENCY
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT FREQUENCY
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT FREQUENCY
70
-60
-65
THD (dBc)
69
68
67
66
65
64
100
95
90
-75
-80
80
75
-85
70
-90
65
63
-95
60
62
-100
55
20
40
60
80
100
ANALOG INPUT FREQUENCY (MHz)
120
120
85
-70
SFDR (dBc)
71
MAX1436B toc08
-55
MAX1436B toc07
72
0
MAX1436B toc06
-1
GAIN (dB)
-40
SMALL-SIGNAL
BANDWIDTH
-20.5dBFS
0
SNR (dB)
-20
1
MAX1436B toc05
fIN(IN1) = 5.298993MHz
fIN(IN2) = 6.298573MHz
AIN1 = -6.5dBFS
AIN2 = -6.5dBFS
IMD = 89.8dBc
IM3 = 96.6dBc
MAX1436B toc04
0
-10
AMPLITUDE (dBFS)
-110
-110
5
fIN(IN2)
-80
-100
0
MEASURED ON CHANNEL 1,
WITH INTERFERING SIGNAL
ON CHANNEL 2
fIN(IN1) = 5.304814MHz
fIN(IN2) = 19.2984215MHz
CROSSTALK = 97.2dB
-10
MAX1436B toc03
-20
-110
6
fCLK = 39.8871374MHz
fIN = 19.2984215MHz
AIN = -0.5dBFS
SNR = 69.641dB
SINAD = 69.618dB
THD = -92.410dBc
SFDR = 90.384dBc
MAX1436B toc09
AMPLITUDE (dBFS)
-30
0
MAX1436B toc02
-20
0
-10
AMPLITUDE (dBFS)
fCLK = 39.8871375MHz
fIN = 5.304814MHz
AIN = -0.5dBFS
SNR = 69.917dB
SINAD = 69.907dB
THD = -96.178dBc
SFDR = 95.807dBc
MAX1436B toc01
0
-10
CROSSTALK
(16,384-POINT DATA RECORD)
FFT PLOT
(16,384-POINT DATA RECORD)
AMPLITUDE (dBFS)
FFT PLOT
(16,384-POINT DATA RECORD)
SINAD (dB)
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
0
20
40
60
80
100
ANALOG INPUT FREQUENCY (MHz)
120
0
20
40
60
80
100
ANALOG INPUT FREQUENCY (MHz)
_______________________________________________________________________________________
120
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
57
47
37
37
-15
-10
-5
0
-70
-75
-85
-90
-95
-30
-25
-20
-15
-10
-5
-30
0
-20
-15
-10
-5
ANALOG INPUT POWER (dBFS)
SPURIOUS-FREE DYNAMIC RANGE
vs. ANALOG INPUT POWER
SIGNAL-TO-NOISE RATIO
vs. SAMPLING RATE
SIGNAL-TO-NOISE PLUS DISTORTION
vs. SAMPLING RATE
72
85
71
fIN = 5.304814MHz
72
70
71
68
68
65
SINAD (dB)
69
75
SNR (dB)
69
70
67
66
67
66
60
65
65
55
64
64
50
63
63
45
62
-25
-20
-15
-10
-5
0
fIN = 5.304814MHz
70
80
62
10
15
20
25
30
35
10
40
15
20
25
30
35
CLOCK FREQUENCY (MHz)
CLOCK FREQUENCY (MHz)
TOTAL HARMONIC DISTORTION
vs. SAMPLING RATE
SPURIOUS-FREE DYNAMIC RANGE
vs. SAMPLING RATE
SIGNAL-TO-NOISE RATIO
vs. DUTY CYCLE
-80
73
MAX1436B toc17
105
MAX1436B toc16
fIN = 5.304814MHz
fIN = 5.304814MHz
100
40
MAX1436B toc18
ANALOG INPUT POWER (dBFS)
-75
0
MAX1436B toc15
ANALOG INPUT POWER (dBFS)
fIN = 5.304814MHz
-30
-25
ANALOG INPUT POWER (dBFS)
MAX1436B toc14
90
-20
MAX1436B toc13
95
-25
-65
-80
32
-30
SFDR (dBc)
47
42
32
-55
-60
52
42
fIN = 5.304814MHz
-50
THD (dBc)
57
SINAD (dB)
62
52
fIN = 5.304814MHz
67
62
-45
MAX1436B toc11
fIN = 5.304814MHz
67
SNR (dB)
72
MAX1436B toc10
72
TOTAL HARMONIC DISTORTION
vs. ANALOG INPUT POWER
SIGNAL-TO-NOISE PLUS DISTORTION
vs. ANALOG INPUT POWER
MAX1436B toc12
SIGNAL-TO-NOISE RATIO
vs. ANALOG INPUT POWER
fIN = 5.304814MHz
72
71
95
-90
70
SNR (dB)
SFDR (dBc)
THD (dBc)
-85
90
-95
85
-100
80
69
68
67
-105
66
65
75
10
15
20
25
30
CLOCK FREQUENCY (MHz)
35
40
10
15
20
25
30
CLOCK FREQUENCY (MHz)
35
40
30
35
40
45
50
55
60
65
70
DUTY CYCLE (%)
_______________________________________________________________________________________
7
MAX1436B
Typical Operating Characteristics (continued)
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, internal reference, differential input at -0.5dBFS, fIN = 5.3MHz, fCLK =
40MHz (50% duty cycle), VDT = 0V, CLOAD = 10pF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, internal reference, differential input at -0.5dBFS, fIN = 5.3MHz, fCLK =
40MHz (50% duty cycle), VDT = 0V, CLOAD = 10pF, TA = +25°C, unless otherwise noted.)
fIN = 5.304814MHz
72
fIN = 5.304814MHz
100
-80
MAX1436B toc21
-75
MAX1436B toc19
73
SPURIOUS-FREE DYNAMIC RANGE
vs. DUTY CYCLE
TOTAL HARMONIC DISTORTION
vs. DUTY CYCLE
MAX1436B toc20
SIGNAL-TO-NOISE PLUS DISTORTION
vs. DUTY CYCLE
fIN = 5.304814MHz
95
90
69
SFDR (dBc)
-85
70
THD (dBc)
SINAD (dB)
71
-90
68
85
-95
80
-100
75
67
66
40
45
50
55
60
65
30
70
35
40
45
50
55
60
65
30
70
35
40
45
50
55
60
65
DUTY CYCLE (%)
DUTY CYCLE (%)
DUTY CYCLE (%)
SIGNAL-TO-NOISE RATIO
vs. TEMPERATURE
SIGNAL-TO-NOISE PLUS DISTORTION
vs. TEMPERATURE
TOTAL HARMONIC DISTORTION
vs. TEMPERATURE
73
fCLK = 40MHz
fIN = 19.8MHz
4096-POINT DATA RECORD
72
71
71
70
70
-90
70
MAX1436B toc24
fCLK = 40MHz
fIN = 19.8MHz
4096-POINT DATA RECORD
MAX1436B toc23
72
35
MAX1436B toc22
30
73
70
-105
65
-91
-92
69
68
69
68
67
67
66
66
65
-98
60
85
-100
-40
-15
10
35
85
60
-15
-40
10
35
60
85
TEMPERATURE (°C)
TEMPERATURE (°C)
TEMPERATURE (°C)
SPURIOUS-FREE DYNAMIC RANGE
vs. TEMPERATURE
SUPPLY CURRENT
vs. SAMPLING RATE (AVDD)
ANALOG SUPPLY CURRENT
vs. SAMPLING RATE (0VDD)
fCLK = 40MHz
fIN = 19.8MHz
4096-POINT DATA RECORD
360
350
85
340
80
92
75
IAVDD (mA)
90
89
IOVDD (mA)
330
91
88
320
310
70
65
300
87
60
290
86
85
55
280
-40
-15
10
35
TEMPERATURE (°C)
8
fCLK = 40MHz
fIN = 19.8MHz
4096-POINT DATA RECORD
-99
MAX1436B toc27
93
35
-96
MAX1436B toc26
94
10
MAX1436B toc25
95
-15
-95
-97
65
-40
-94
THD (dBc)
SINAD (dB)
SNR (dB)
-93
SFDR (dBc)
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
60
85
0
5
10
15
20
25
30
CLOCK FREQUENCY (MHz)
35
40
0
5
10
15
20
25
30
CLOCK FREQUENCY (MHz)
_______________________________________________________________________________________
35
40
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
OFFSET ERROR
vs. TEMPERATURE
0.6
0.01
0
-0.01
-0.02
-0.03
-0.04
0.4
0.3
0.4
0.2
0.2
0.1
0
-0.2
-0.4
-0.2
-0.6
-0.3
-0.8
-0.4
-0.5
-1.0
-15
10
35
60
85
-40
-15
TEMPERATURE (°C)
60
0
85
512 1024 1536 2048 2560 3072 3584 4096
DIGITAL OUTPUT CODE
INTERNAL REFERENCE VOLTAGE
vs. TEMPERATURE
INTERNAL REFERENCE VOLTAGE
vs. SUPPLY VOLTAGE
1.2510
MAX1436B toc31
0.2
35
TEMPERATURE (°C)
DIFFERENTIAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
0.3
10
1.26
MAX1436B toc32
-40
0
-0.1
VAVDD = VOVDD
MAX1436B toc33
GAIN ERROR (%FS)
0.02
MAX1436B toc30
0.8
INL (LSB)
0.03
0.5
MAX1436B toc29
1.0
MAX1436B toc28
0.04
OFFSET ERROR (%FS)
INTEGRAL NONLINEARITY
vs. DIGITAL OUTPUT CODE
GAIN ERROR
vs. TEMPERATURE
VAVDD = VOVDD
1.25
1.2500
0
VREFIO (V)
VREFIO (V)
DNL (LSB)
0.1
1.2490
1.24
-0.1
1.23
1.2480
-0.2
-0.3
1.22
1.2470
0
512 1024 1536 2048 2560 3072 3584 4096
DIGITAL OUTPUT CODE
1.7
1.8
1.9
SUPPLY VOLTAGE (V)
2.0
2.1
-40
-15
10
35
60
85
TEMPERATURE (°C)
_______________________________________________________________________________________
9
MAX1436B
Typical Operating Characteristics (continued)
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, internal reference, differential input at -0.5dBFS, fIN = 5.3MHz, fCLK =
40MHz (50% duty cycle), VDT = 0V, CLOAD = 10pF, TA = +25°C, unless otherwise noted.)
Typical Operating Characteristics (continued)
(VAVDD = 1.8V, VOVDD = 1.8V, VCVDD = 3.3V, VGND = 0V, internal reference, differential input at -0.5dBFS, fIN = 5.3MHz, fCLK =
40MHz (50% duty cycle), VDT = 0V, CLOAD = 10pF, TA = +25°C, unless otherwise noted.)
0.768
1.30
VCMOUT (V)
VREFIO (V)
1.25
1.20
1.15
VAVDD = VOVDD
0.766
0.764
VAVDD = VOVDD
0.768
VCMOUT (V)
1.35
0.770
MAX1436B toc35
0.770
MAX1436B toc34
1.40
CMOUT VOLTAGE
vs. TEMPERATURE
CMOUT VOLTAGE
vs. SUPPLY VOLTAGE
MAX1436B toc36
INTERNAL REFERENCE VOLTAGE
vs. REFERENCE LOAD CURRENT
0.766
0.764
1.10
0.762
0.762
1.05
0.760
-40
0.760
-50
50
150
250
350
1.7
1.8
IREFIO (μA)
1.9
2.1
2.0
CMOUT VOLTAGE
vs. LOAD CURRENT
1.6
1.4
SNR/SINAD (dB)
1.2
1.0
0.8
0.6
0.4
SNR
70.2
69.9
SINAD
69.6
fIN = 5.2966309MHz
AIN = -0.5dBFS
100.0
SFDR
98.0
96.0
-THD
10
DATA BASED ON 32,768 DATA POINTS
DATA BASED ON 32,768 DATA POINTS
1000
ICMOUT (μA)
1500
2000
85
94.0
69.3
500
60
102.0
0.2
0
35
-THD/SFDR vs. STBY DELAY TIME
SNR/SINAD vs. STBY DELAY TIME
fIN = 5.2966309MHz
AIN = -0.5dBFS
10
TEMPERATURE (°C)
70.5
MAX1436B toc37
1.8
0
-15
SUPPLY VOLTAGE (V)
-THD/SFDR (dBc)
-150
MAX1436B toc38
-350 -250
MAX1436B toc39
1.00
VCMOUT (V)
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
92.0
69.0
75
100
125
150
175
200
STBY DELAY TIME (μs)
225
250
75
100
125
150
175
200
STBY DELAY TIME (μs)
______________________________________________________________________________________
225
250
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
PIN
NAME
FUNCTION
1, 4, 7, 10, 16, 19, 22,
25, 26, 27, 30, 36, 89,
92, 96, 99, 100
GND
Ground. Connect all GND pins to the same potential.
2
IN1P
Channel 1 Positive Analog Input
3
IN1N
Channel 1 Negative Analog Input
5
IN2P
Channel 2 Positive Analog Input
6
IN2N
Channel 2 Negative Analog Input
8
IN3P
Channel 3 Positive Analog Input
9
IN3N
Channel 3 Negative Analog Input
11, 12, 13, 15, 37–42,
86, 87, 88
AVDD
Analog Power Input. Connect AVDD to a 1.7V to 1.9V power supply. Bypass AVDD to GND
with a 0.1µF capacitor as close as possible to the device. Bypass the AVDD power plane to
the GND plane with a bulk ≥ 2.2µF capacitor. Connect all AVDD pins to the same potential.
14, 31, 50, 51, 70,
75, 76
N.C.
No Connection. Not internally connected.
17
IN4P
Channel 4 Positive Analog Input
18
IN4N
Channel 4 Negative Analog Input
20
IN5P
Channel 5 Positive Analog Input
21
IN5N
Channel 5 Negative Analog Input
23
IN6P
Channel 6 Positive Analog Input
24
IN6N
Channel 6 Negative Analog Input
28
IN7P
Channel 7 Positive Analog Input
29
IN7N
Channel 7 Negative Analog Input
32
DT
Double-Termination Select. Drive DT high to select the internal 100Ω termination between the
differential output pairs. Drive DT low to select no output termination.
33
SLVS/LVDS
Differential Output-Signal Format-Select Input. Drive SLVS/LVDS high to select SLVS outputs.
Drive SLVS/LVDS low to select LVDS outputs.
34
CVDD
35
CLK
Clock Power Input. Connect CVDD to a 1.7V to 3.6V power supply. Bypass CVDD to GND
with a 0.1µF capacitor in parallel with a ≥ 2.2µF capacitor. Install the bypass capacitors as
close as possible to the device.
Single-Ended CMOS Clock Input
Output-Driver Power Input. Connect OVDD to a 1.7V to 1.9V power supply. Bypass OVDD to
GND with a 0.1µF capacitor as close as possible to the device. Bypass the OVDD power plane
to the GND plane with a bulk ≥ 2.2µF capacitor. Connect all OVDD pins to the same potential.
43, 46, 49, 54, 57, 60,
63, 64, 67, 71, 74, 77
OVDD
44
OUT7N
Channel 7 Negative LVDS/SLVS Output
45
OUT7P
Channel 7 Positive LVDS/SLVS Output
47
OUT6N
Channel 6 Negative LVDS/SLVS Output
48
OUT6P
Channel 6 Positive LVDS/SLVS Output
52
OUT5N
Channel 5 Negative LVDS/SLVS Output
53
OUT5P
Channel 5 Positive LVDS/SLVS Output
55
OUT4N
Channel 4 Negative LVDS/SLVS Output
56
OUT4P
Channel 4 Positive LVDS/SLVS Output
______________________________________________________________________________________
11
MAX1436B
Pin Description
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
MAX1436B
Pin Description (continued)
12
PIN
NAME
FUNCTION
58
FRAMEN
Negative Frame-Alignment LVDS/SLVS Output. A rising edge on the differential FRAME
output aligns to a valid D0 in the output data stream.
59
FRAMEP
Positive Frame-Alignment LVDS/SLVS Output. A rising edge on the differential FRAME output
aligns to a valid D0 in the output data stream.
61
CLKOUTN
62
CLKOUTP
Positive LVDS/SLVS Serial Clock Output
65
OUT3N
Channel 3 Negative LVDS/SLVS Output
66
OUT3P
Channel 3 Positive LVDS/SLVS Output
68
OUT2N
Channel 2 Negative LVDS/SLVS Output
69
OUT2P
Channel 2 Positive LVDS/SLVS Output
72
OUT1N
Channel 1 Negative LVDS/SLVS Output
73
OUT1P
Channel 1 Positive LVDS/SLVS Output
78
OUT0N
Channel 0 Negative LVDS/SLVS Output
79
OUT0P
Negative LVDS/SLVS Serial Clock Output
Channel 0 Positive LVDS/SLVS Output
80
LVDSTEST
LVDS Test Pattern Enable. Drive LVDSTEST high to enable the output test pattern (0000 1011
1101 MSB → LSB). As with the analog conversion results, the test pattern data is output LSB
first. Drive LVDSTEST low for normal operation.
81
STBY
Standby Input. An active-high level on STBY puts the MAX1436B into standby mode, leaving
the reference circuitry active. Drive STBY low for normal operation.
82
PLL3
PLL Control Input 3. See Table 1 for details.
83
PLL2
PLL Control Input 2. See Table 1 for details.
84
PLL1
PLL Control Input 1. See Table 1 for details.
Output Format-Select Input. Drive T/B high to select binary output format. Drive T/B low to
select two’s-complement output format.
85
T/B
90
REFN
Negative Reference Bypass Output. Connect a ≥ 1µF (10µF typ) capacitor between REFP and
REFN, and connect a ≥ 1µF (10µF typ) capacitor between REFN and GND. Place the
capacitors as close as possible to the device on the same side of the PCB.
91
REFP
Positive Reference Bypass Output. Connect a ≥ 1µF (10µF typ) capacitor between REFP and
REFN, and connect a ≥ 1µF (10µF typ) capacitor between REFP and GND. Place the
capacitors as close as possible to the device on the same side of the PCB.
93
REFIO
Reference Input/Output. For internal reference operation (REFADJ = GND), the reference
output voltage is 1.24V. For external reference operation (REFADJ = AVDD), apply a stable
reference voltage at REFIO. Bypass to GND with ≥ 0.1µF.
94
REFADJ
Internal/External Reference-Mode-Select and Reference Adjust Input. For internal reference
mode, connect REFADJ directly to GND. For external reference mode, connect REFADJ
directly to AVDD. For reference-adjust mode, see the Full-Scale Range Adjustments Using the
Internal Reference section.
95
CMOUT
Common-Mode Reference Voltage Output. CMOUT outputs the input common-mode voltage
for DC-coupled applications. Bypass CMOUT to GND with ≥ 0.1µF capacitor.
97
IN0P
Channel 0 Positive Analog Input
98
IN0N
Channel 0 Negative Analog Input
—
EP
Exposed Pad. EP is internally connected to GND. Connect EP to GND.
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
REFADJ REFIO REFP REFN
STBY
REFERENCE SYSTEM
POWER
CONTROL
CMOUT
AVDD OVDD
DT
MAX1436B
SLVS/LVDS
OUTPUT
CONTROL
LVDSTEST
T/B
ICMV*
T/H
12-BIT
PIPELINE
ADC
12:1
SERIALIZER
OUT0P
12-BIT
PIPELINE
ADC
12:1
SERIALIZER
OUT1P
T/H
IN0P
IN0N
IN1P
IN1N
OUT0N
OUT1N
LVDS/SLVS
OUTPUT
DRIVERS
IN7P
12-BIT
PIPELINE
ADC
T/H
IN7N
OUT7P
12:1
SERIALIZER
OUT7N
FRAMEP
FRAMEN
CLK
CLOCK
CIRCUITRY
CVDD
CLKOUTP
PLL
6x
PLL1
PLL2
CLKOUTN
PLL3
GND
*ICMV = INPUT COMMON-MODE VOLTAGE (INTERNALLY GENERATED).
Detailed Description
The MAX1436B ADC features fully differential inputs, a
pipelined architecture, and digital error correction for
high-speed signal conversion. The ADC pipeline architecture moves the samples taken at the inputs through
the pipeline stages every half clock cycle. The converted digital results are serialized and sent through the
LVDS/SLVS output drivers. The total clock-cycle latency
from input to output is 6.5 clock cycles.
The MAX1436B offers eight separate fully differential
channels with synchronized inputs and outputs.
Configure the outputs for binary or two’s complement with
the T/B digital input. Global power-down minimizes power
consumption.
Input Circuit
Figure 1 displays a simplified diagram of the input T/H
circuits. In track mode, switches S1, S2a, S2b, S4a, S4b,
S5a, and S5b are closed. The fully differential circuits
sample the input signals onto the two capacitors (C2a
and C2b) through switches S4a and S4b. S2a and S2b
set the common mode for the operational transconductance amplifier (OTA), and open simultaneously with S1,
sampling the input waveform. Switches S4a, S4b, S5a,
and S5b are then opened before switches S3a and S3b
connect capacitors C1a and C1b to the output of the
amplifier and switch S4c is closed. The resulting differential voltages are held on capacitors C2a and C2b. The
amplifiers charge capacitors C1a and C1b to the same
values originally held on C2a and C2b. These values are
then presented to the first-stage quantizers and isolate
______________________________________________________________________________________
13
MAX1436B
Functional Diagram
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
SWITCHES SHOWN IN TRACK MODE
INTERNAL
COMMON-MODE
BIAS*
AVDD
INTERNALLY
GENERATED
COMMON-MODE
LEVEL*
INTERNAL
BIAS*
S5a
S2a
MAX1436B
C1a
S3a
C2a
S4a
IN_P
OUT
S4c
OTA
S1
OUT
IN_N
S4b
C2b
C1b
S3b
GND
S2b
INTERNAL
COMMON-MODE
BIAS*
INTERNAL
BIAS*
S5b
INTERNALLY
GENERATED
COMMON-MODE
LEVEL*
*NOT EXTERNALLY ACCESSIBLE
Figure 1. Internal Input Circuit
the pipelines from the fast-changing inputs. Analog
inputs, IN_P to IN_N, are driven differentially. For differential inputs, balance the input impedance of IN_P and
IN_N for optimum performance.
Reference Configurations (REFIO,
REFADJ, REFP, and REFN)
The MAX1436B provides an internal 1.24V bandgap
reference or can be driven with an external reference
voltage. The full-scale analog differential input range is
±FSR. FSR (full-scale range) is given by the following
equation:
FSR =
(0.700 × VREFIO )
1.24V
where VREFIO is the voltage at REFIO, generated internally or externally. For a VREFIO = 1.24V, the full-scale
input range is ±700mV (1.4VP-P).
14
Internal Reference Mode
Connect REFADJ to GND to use the internal bandgap
reference directly. The internal bandgap reference generates VREFIO to be 1.24V with a 120ppm/°C temperature coefficient in internal reference mode. Connect an
external ≥ 0.1µF bypass capacitor from REFIO to GND
for stability. REFIO sources up to 200µA and sinks up
to 200µA for external circuits, and REFIO has a
75mV/mA load regulation. Putting the MAX1436B into
standby mode turns off all circuitry except the reference circuit, allowing the converter to power-up faster
when the ADC exits standby with a high-to-low transitional signal on STBY. The internal circuits of the
MAX1436B require 200µs to power up and settle when
the converter exits standby mode.
To compensate for gain errors or to decrease or
increase the ADC’s FSR, add an external resistor
between REFADJ and GND or REFADJ and REFIO.
This adjusts the internal reference value of the
MAX1436B by up to ±5% of its nominal value. See the
Full-Scale Range Adjustments Using the Internal
Reference section.
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
External Reference Mode
The external reference mode allows for more control
over the MAX1436B reference voltage and allows multiple converters to use a common reference. Connect
REFADJ to AVDD to disable the internal reference.
Apply a stable 1.18V to 1.30V source at REFIO. Bypass
REFIO to GND with a ≥ 0.1µF capacitor. The REFIO
input impedance is > 1MΩ.
Clock Input (CLK)
The MAX1436B accepts a CMOS-compatible clock signal with a wide 20% to 80% input clock duty cycle.
Drive CLK with an external single-ended clock signal.
Figure 2 shows the simplified clock input diagram.
Low clock jitter is required for the specified SNR performance of the MAX1436B. Analog input sampling
occurs on the rising edge of CLK, requiring this edge to
provide the lowest possible jitter. Jitter limits the maximum SNR performance of any ADC according to the
following relationship:
⎛
⎞
1
SNR = 20 × log ⎜
⎟
⎝ 2 × π × fIN × t J ⎠
where fIN represents the analog input frequency and tJ
is the total system clock jitter.
PLL Inputs (PLL1, PLL2, PLL3)
The MAX1436B features a PLL that generates an output
clock signal with 6 times the frequency of the input
clock. The output clock signal is used to clock data out
of the MAX1436B (see the System Timing Requirements
section). Set the PLL1, PLL2, and PLL3 bits according
to the input clock range provided in Table 1.
AVDD
MAX1436B
CVDD
DUTY-CYCLE
EQUALIZER
CLK
GND
MAX1436B
Connect ≥ 1µF (10µF typ) capacitors to GND from
REFP and REFN and a ≥ 1µF (10µF typ) capacitor
between REFP and REFN as close to the device as
possible on the same side of the PC board.
Table 1. PLL1, PLL2, and PLL3
Configuration Table
PLL1
PLL2
PLL3
INPUT CLOCK RANGE
(MHz)
MIN
MAX
0
0
0
0
0
1
32.5
Unused
40.0
0
1
0
22.5
32.5
0
1
1
16.3
22.5
1
0
0
11.3
16.3
1
0
1
8.1
11.3
1
1
0
5.6
8.1
1
1
1
4.0
5.6
System Timing Requirements
Figure 3 shows the relationship between the analog
inputs, input clock, frame-alignment output, serial-clock
output, and serial-data output. The differential analog
input (IN_P and IN_N) is sampled on the rising edge of
the CLK signal and the resulting data appears at the
digital outputs 6.5 clock cycles later. Figure 4 provides
a detailed, two-conversion timing diagram of the relationship between the inputs and the outputs.
Clock Output (CLKOUTP, CLKOUTN)
The MAX1436B provides a differential clock output that
consists of CLKOUTP and CLKOUTN. As shown in Figure
4, the serial output data is clocked out of the MAX1436B
on both edges of the clock output. The frequency of the
output clock is 6 times the frequency of CLK.
Frame-Alignment Output (FRAMEP, FRAMEN)
The MAX1436B provides a differential frame-alignment
signal that consists of FRAMEP and FRAMEN. As
shown in Figure 4, the rising edge of the frame-alignment signal corresponds to the first bit (D0) of the 12bit serial data stream. The frequency of the framealignment signal is identical to the frequency of the
input clock.
Serial Output Data (OUT_P, OUT_N)
The MAX1436B provides its conversion results through
individual differential outputs consisting of OUT_P and
OUT_N. The results are valid 6.5 input clock cycles
after the sample is taken. As shown in Figure 3, the output data is clocked out on both edges of the output
clock, LSB (D0) first. Figure 5 provides the detailed serial-output timing diagram.
Figure 2. Clock Input Circuitry
______________________________________________________________________________________
15
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
N+2
N+6
N+3
N
(VIN_P VIN_N)
N+8
N+5
N+1
N+9
N+7
N+4
tSAMPLE
CLK
6.5 CLOCK-CYCLE DATA LATENCY
(VFRAMEP VFRAMEN)*
(VCLKOUTP VCLKOUTN)
(VOUT_P VOUT_N)
OUTPUT
DATA FOR
SAMPLE
N-6
OUTPUT
DATA FOR
SAMPLE N
*DUTY CYCLE VARIES DEPENDING ON INPUT CLOCK FREQUENCY.
Figure 3. Global Timing Diagram
N+2
N
(VIN_P - VIN_N)
N+1
tSF
tSAMPLE
CLK
(VFRAMEP VFRAMEN)*
tCF
(VCLKOUTP VCLKOUTN)
(VOUT_P VOUT_N)
D5N-7 D6N-7 D7N-7 D8N-7 D9N-7 D10N-7 D11N-7 D0N-6 D1N-6 D2N-6 D3N-6 D4N-6 D5N-6 D6N-6 D7N-6 D8N-6 D9N-6 D10N-6 D11N-6 D0N-5 D1N-5 D2N-5 D3N-5 D4N-5 D5N-5 D6N-5
*DUTY CYCLE DEPENDS ON INPUT CLOCK FREQUENCY.
Figure 4. Detailed Two-Conversion Timing Diagram
tCH
tCL
(VCLKOUTP VCLKOUTN)
(VOUT_P VOUT_N)
tOD
D0
D1
tOD
D2
D3
Figure 5. Serialized-Output Detailed Timing Diagram
16
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
TWO’S-COMPLEMENT DIGITAL OUTPUT CODE
(T/B = 0)
OFFSET BINARY DIGITAL OUTPUT CODE
(T/B = 1)
VIN_P - VIN_N (mV)
(VREFIO = 1.24V)
BINARY
D11 → D0
HEXADECIMAL
EQUIVALENT
OF D11 → D0
DECIMAL
EQUIVALENT
OF D11 → D0
BINARY
D11 → D0
HEXADECIMAL
EQUIVALENT
OF D11 → D0
DECIMAL
EQUIVALENT
OF D11 → D0
0111 1111 1111
0x7FF
+2047
1111 1111 1111
0xFFF
+4095
+699.66
0111 1111 1110
0x7FE
+2046
1111 1111 1110
0xFFE
+4094
+699.32
0000 0000 0001
0x001
+1
1000 0000 0001
0x801
+2049
+0.34
0000 0000 0000
0x000
0
1000 0000 0000
0x800
+2048
0
1111 1111 1111
0xFFF
-1
0111 1111 1111
0x7FF
+2047
-0.34
1000 0000 0001
0x801
-2047
0000 0000 0001
0x001
+1
-699.66
1000 0000 0000
0x800
-2048
0000 0000 0000
0x000
0
-700.00
1 LSB = 2 x FSR
4096
FSR = 700mV x VREFIO
1.24V
FSR
0x7FF
0x7FE
0x7FD
0x001
0x000
0xFFF
0x803
0x802
0x801
0x800
-2047 -2045
-1 0 +1
+2045 +2047
DIFFERENTIAL INPUT VOLTAGE (LSB)
FSR = 700mV x VREFIO
1.24V
FSR
OFFSET BINARY OUTPUT CODE (LSB)
TWO'S-COMPLEMENT OUTPUT CODE (LSB)
FSR
1 LSB = 2 x FSR
4096
FSR
0xFFF
0xFFE
0xFFD
0x801
0x800
0x7FF
0x003
0x002
0x800
0x000
-2047 -2045
-1 0 +1
+2045 +2047
DIFFERENTIAL INPUT VOLTAGE (LSB)
Figure 6. Two’s-Complement Transfer Function (T/B = 0)
Figure 7. Binary Transfer Function (T/B = 1)
Output Data Format (T/B) Transfer Functions
The MAX1436B output data format is either offset binary or two’s complement, depending on the logic-input
T/B. With T/B low, the output data format is two’s complement. With T/B high, the output data format is offset
binary. The following equations, Table 2, and Figures 6
and 7 define the relationship between the digital output
and the analog input. For two’s complement (T/B = 0):
and for offset binary (T/B = 1):
VIN _ P − VIN _ N = FSR × 2 ×
CODE10
4096
VIN _ P − VIN _ N = FSR × 2 ×
CODE10 − 2048
4096
where CODE10 is the decimal equivalent of the digital
output code as shown in Table 2.
Keep the capacitive load on the MAX1436B digital outputs as low as possible.
______________________________________________________________________________________
17
MAX1436B
Table 2. Output Code Table (VREFIO = 1.24V)
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
LVDS and SLVS Signals (SLVS/LVDS)
Drive SLVS/LVDS low for LVDS or drive SLVS/LVDS high
for SLVS levels at the MAX1436B outputs (OUT_P,
OUT_N, CLKOUTP, CLKOUTN, FRAMEP, and FRAMEN).
For SLVS levels, enable double-termination by driving DT
high. See the Electrical Characteristics table for LVDS
and SLVS output voltage levels.
DT
OUT_P/
CLKOUTP/
FRAMEP
Z0 = 50Ω
LVDS Test Pattern (LVDSTEST)
Drive LVDSTEST high to enable the output test pattern
on all LVDS or SLVS output channels. The output test
pattern is 0000 1011 1101. Drive LVDSTEST low for
normal operation (test pattern disabled).
100Ω
100Ω
Common-Mode Output (CMOUT)
CMOUT provides a common-mode reference for DCcoupled analog inputs. If the input is DC-coupled,
match the output common-mode voltage of the circuit
driving the MAX1436B to the output voltage at VCMOUT
to within ±50mV. It is recommended that the output
common-mode voltage of the driving circuit be derived
from CMOUT.
MAX1436B
OUT_N/
CLKOUTN/
FRAMEN
Z0 = 50Ω
SWITCHES ARE CLOSED WHEN DT IS HIGH.
SWITCHES ARE OPEN WHEN DT IS LOW.
Figure 8. Double-Termination
Double-Termination (DT)
The MAX1436B offers an optional, internal 100Ω termination between the differential output pairs (OUT_P and
OUT_N, CLKOUTP and CLKOUTN, FRAMEP and FRAMEN). In addition to the termination at the end of the line, a
second termination directly at the outputs helps eliminate
unwanted reflections down the line. This feature is useful
in applications where trace lengths are long (> 5in) or with
mismatched impedance. Drive DT high to select doubletermination, or drive DT low to disconnect the internal termination resistor (single-termination). Selecting
double-termination increases the OVDD supply current
(see Figure 8).
Standby Mode
The MAX1436B offers a standby mode to efficiently use
power by transitioning to a low-power state when conversions are not required. STBY controls the standby
mode of all channels and the internal reference circuitry.
The reference does not power down in standby mode.
Drive STBY high to enable standby. In standby mode,
the output impedance of all of the LVDS/SLVS outputs is
approximately 342Ω, if DT is low. The output impedance
of the differential LVDS/SLVS outputs is 100Ω when DT
is high. See the Electrical Characteristics table for typical supply currents during standby. The following list
shows the state of the analog inputs and digital outputs
in standby mode:
• IN_P, IN_N analog inputs are disconnected from
the internal input amplifier
•
18
Reference circuit remains active
•
OUT_P, OUT_N, CLKOUTP, CLKOUTN, FRAMEP,
and FRAMEN have approximately 342Ω between the
output pairs when DT is low. When DT is high, the differential output pairs have 100Ω between each pair.
When operating in internal reference mode, the
MAX1436B requires 200µs to power up and settle when
the converter exits standby mode. To exit standby mode,
STBY, the applied control signal must transition from
high to low. When using an external reference, the wakeup time is dependent on the external reference drivers.
Applications Information
Full-Scale Range Adjustments
Using the Internal Reference
The MAX1436B supports a full-scale adjustment range
of 10% (±5%). To decrease the full-scale range, add a
25kΩ to 250kΩ external resistor or potentiometer (RADJ)
between REFADJ and GND. To increase the fullscale range, add a 25kΩ to 250kΩ resistor between
REFADJ and REFIO. Figure 9 shows the two possible
configurations.
The following equations provide the relationship between
RADJ and the change in the analog full-scale range:
⎛
1.25kΩ ⎞
FSR = 0.7V ⎜1 +
RADJ ⎟⎠
⎝
for RADJ connected between REFADJ and REFIO, and:
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
REFT
REFB
MAX1436B
10Ω
ADC FULL-SCALE = REFT - REFB
G
0.1μF
REFERENCESCALING
AMPLIFIER
39pF
T1
N.C.
REFERENCE
BUFFER
IN_P
6
1
VIN
2
5
MAX1436B
0.1μF
REFIO
1V
REFADJ
4
3
MINICIRCUITS
ADT1-1WT
0.1μF
25kΩ
250kΩ
10Ω
IN_N
39pF
CONTROL LINE TO
DISABLE REFERENCE
BUFFER
25kΩ
250kΩ
MAX1436B
AVDD
AVDD/2
Figure 9. Circuit Suggestions to Adjust the ADC’s Full-Scale
Range
⎛ 1.25kΩ ⎞
FSR = 0.7V ⎜1 −
RADJ ⎟⎠
⎝
for RADJ connected between REFADJ and GND.
Using Transformer Coupling
An RF transformer (Figure 10) provides an excellent
solution to convert a single-ended input source signal
to a fully differential signal. The MAX1436B input common-mode voltage is internally biased to 0.76V (typ)
with f CLK = 40MHz. Although a 1:1 transformer is
shown, a step-up transformer can be selected to
reduce the drive requirements. A reduced signal swing
from the input driver, such as an op amp, can also
improve the overall distortion.
Grounding, Bypassing, and Board Layout
The MAX1436B requires high-speed board layout
design techniques. Refer to the MAX1434/MAX1436/
MAX1436B/MAX1437/MAX1438 EV kit data sheet for a
board layout reference. Locate all bypass capacitors as
close to the device as possible, preferably on the same
side as the ADC, using surface-mount devices for minimum inductance. Bypass AVDD to GND with a 0.1µF
ceramic capacitor in parallel with a 0.1µF ceramic
capacitor. Bypass OVDD to GND with a 0.1µF ceramic
capacitor in parallel with a ≥ 2.2µF ceramic capacitor.
Bypass CVDD to GND with a 0.1µF ceramic capacitor
in parallel with a ≥ 2.2µF ceramic capacitor.
Figure 10. Transformer-Coupled Input Drive
Multilayer boards with ample ground and power planes
produce the highest level of signal integrity. Connect
MAX1436B ground pins and the exposed pad to the
same ground plane. The MAX1436B relies on the
exposed-backside-pad connection for a low-inductance ground connection. Isolate the ground plane from
any noisy digital system ground planes.
Route high-speed digital signal traces away from the
sensitive analog traces. Keep all signal lines short and
free of 90° turns.
Ensure that the differential analog input network layout is
symmetric and that all parasitics are balanced equally.
Refer to the MAX1434/MAX1436/MAX1436B/MAX1437/
MAX1438 EV kit data sheet for an example of symmetric
input layout.
Parameter Definitions
Integral Nonlinearity (INL)
Integral nonlinearity is the deviation of the values on an
actual transfer function from a straight line. For the
MAX1436B, this straight line is between the end points
of the transfer function, once offset and gain errors
have been nullified. INL deviations are measured at
every step and the worst-case deviation is reported in
the Electrical Characteristics table.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between an
actual step width and the ideal value of 1 LSB. A DNL
error specification of less than 1 LSB guarantees no
missing codes and a monotonic transfer function. For
the MAX1436B, DNL deviations are measured at every
step and the worst-case deviation is reported in the
Electrical Characteristics table.
______________________________________________________________________________________
19
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
Offset Error
Offset error is a figure of merit that indicates how well
the actual transfer function matches the ideal transfer
function at a single point. For the MAX1436B, the ideal
midscale digital output transition occurs when there is
-1/2 LSBs across the analog inputs (Figures 6 and 7).
Bipolar offset error is the amount of deviation between
the measured midscale transition point and the ideal
midscale transition point.
CLK
tAD
ANALOG
INPUT
tAJ
SAMPLED
DATA
Gain Error
Gain error is a figure of merit that indicates how well the
slope of the actual transfer function matches the slope
of the ideal transfer function. For the MAX1436B the
gain error is the difference of the measured full-scale
and zero-scale transition points minus the difference of
the ideal full-scale and zero-scale transition points.
For the bipolar devices (MAX1436B), the full-scale transition point is from 0x7FE to 0x7FF for two’s-complement output format (0xFFE to 0xFFF for offset binary)
and the zero-scale transition point is from 0x800 to
0x801 for two’s complement (0x000 to 0x001 for offset
binary).
Crosstalk
Crosstalk indicates how well each analog input is isolated
from the others. For the MAX1436B, a 5.3MHz, -0.5dBFS
analog signal is applied to one channel while a 19.3MHz,
-0.5dBFS analog signal is applied to another channel. An
FFT is taken on the channel with the 5.3MHz analog signal. From this FFT, the crosstalk is measured as the difference in the 5.3MHz and 19.3MHz amplitudes.
Aperture Delay
Aperture delay (tAD) is the time defined between the
rising edge of the sampling clock and the instant when
an actual sample is taken. See Figure 11.
Aperture Jitter
Aperture jitter (tAJ) is the sample-to-sample variation in
the aperture delay. See Figure 11.
Signal-to-Noise Ratio (SNR)
For a waveform perfectly reconstructed from digital
samples, the theoretical maximum SNR is the ratio of
the full-scale analog input (RMS value) to the RMS
quantization error (residual error). The ideal, theoretical
minimum analog-to-digital noise is caused by quantization error only and results directly from the ADC’s resolution (N bits):
SNRdB[max] = 6.02dB x N x 1.76dB
In reality, there are other noise sources besides quantization noise: thermal noise, reference noise, clock jitter, etc.
20
T/H
HOLD
TRACK
HOLD
Figure 11. Aperture Jitter/Delay Specifications
For the MAX1436B, SNR is computed by taking the
ratio of the RMS signal to the RMS noise. RMS noise
includes all spectral components to the Nyquist frequency excluding the fundamental, the first six harmonics (HD2–HD7), and the DC offset.
Signal-to-Noise Plus Distortion (SINAD)
SINAD is computed by taking the ratio of the RMS signal
to the RMS noise plus distortion. RMS noise plus distortion includes all spectral components to the Nyquist frequency, excluding the fundamental and the DC offset.
Effective Number of Bits (ENOB)
ENOB specifies the dynamic performance of an ADC at
a specific input frequency and sampling rate. An ideal
ADC’s error consists of quantization noise only. ENOB for
a full-scale sinusoidal input waveform is computed from:
⎛ SINAD − 1.76 ⎞
ENOB = ⎜
⎟
⎝
⎠
6.02
Total Harmonic Distortion (THD)
THD is the ratio of the RMS sum of the first six harmonics of the input signal to the fundamental itself. This is
expressed as:
⎛
V22 + V32 + V4 2 + V52 + V62 + V72
THD = 20 × log ⎜
⎜
V1
⎝
⎞
⎟
⎟
⎠
Spurious-Free Dynamic Range (SFDR)
SFDR is the ratio expressed in decibels of the RMS
amplitude of the fundamental (maximum signal component) to the RMS value of the next-largest spurious
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
Intermodulation Distortion (IMD)
IMD is the total power of the IM2 to IM5 intermodulation
products to the Nyquist frequency relative to the total
input power of the two input tones f1 and f2. The individual input tone levels are at -6.5dBFS. The intermodulation products are as follows:
• 2nd-order intermodulation products (IM2): f1 + f2,
f2 - f1
•
3rd-order intermodulation products (IM3): 2 x f1 - f2,
2 x f2 - f1, 2 x f1 + f2, 2 x f2 + f1
•
4th-order intermodulation products (IM4): 3 x f1 - f2,
3 x f2 - f1, 3 x f1 + f2, 3 x f2 + f1
•
5th-order intermodulation products (IM5): 3 x f1 - 2
x f2, 3 x f2 - 2 x f1, 3 x f1 + 2 x f2, 3 x f2 + 2 x f1
Third-Order Intermodulation (IM3)
IM3 is the total power of the 3rd-order intermodulation
product to the Nyquist frequency relative to the total
input power of the two input tones f1 and f2. The individual input tone levels are at -6.5dBFS. The 3rd-order
intermodulation products are 2 x f1 - f2, 2 x f2 - f1, 2 x f1
+ f2, 2 x f2 + f1.
Full-Power Bandwidth
A large -0.5dBFS analog input signal is applied to an
ADC, and the input frequency is swept up to the point
where the amplitude of the digitized conversion result
has decreased by -3dB. This point is defined as fullpower input bandwidth frequency.
Gain Matching
Gain matching is a figure of merit that indicates how
well the gain of all eight ADC channels is matched to
each other. For the MAX1436B, gain matching is measured by applying the same 5.3MHz, -0.5dBFS analog
signal to all analog input channels. These analog inputs
are sampled at 40Msps and the maximum deviation in
amplitude is reported in dB as gain matching in the
Electrical Characteristics table.
Phase Matching
Phase matching is a figure of merit that indicates how
well the phases of all eight ADC channels are matched
to each other. For the MAX1436B, phase matching is
measured by applying the same 5.3MHz, -0.5dBFS
analog signal to all analog input channels. These analog inputs are sampled at 40Msps and the maximum
deviation in phase is reported in degrees as phase
matching in the Electrical Characteristics table.
Small-Signal Bandwidth
A small -20.5dBFS analog input signal is applied to an
ADC so that the signal’s slew rate does not limit the
ADC’s performance. The input frequency is then swept
up to the point where the amplitude of the digitized
conversion result has decreased by -3dB.
______________________________________________________________________________________
21
MAX1436B
component, excluding DC offset. SFDR is specified in
decibels relative to the carrier (dBc).
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
PLL3
STBY
LVDSTEST
OUT0P
OUT0N
OVDD
T/B
PLL1
PLL2
GND
AVDD
AVDD
AVDD
REFADJ
REFIO
GND
REFP
REFN
99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76
N.C.
GND
IN0N
IN0P
GND
CMOUT
GND
TOP VIEW
100
MAX1436B
Pin Configuration
+
N.C.
OVDD
OUT1P
OUT1N
OVDD
GND
IN1P
IN1N
GND
IN2P
IN2N
1
75
2
74
3
73
4
72
5
71
6
70
GND
IN3P
7
69
8
68
N.C.
OUT2P
OUT2N
IN3N
9
67
OVDD
GND
10
66
AVDD
AVDD
AVDD
11
65
12
64
OUT3P
OUT3N
OVDD
OVDD
N.C.
AVDD
14
15
61
GND
IN4P
16
60
17
59
IN4N
GND
IN5P
IN5N
18
58
19
57
20
56
21
55
GND
IN6P
IN6N
22
54
23
53
GND
25
13
63
MAX1436B
62
24
*EP
52
51
CLKOUTP
CLKOUTN
OVDD
FRAMEP
FRAMEN
OVDD
OUT4P
OUT4N
OVDD
OUT5P
OUT5N
N.C.
*CONNECT EP TO GND
0VDD
N.C.
OUT6P
OVDD
OUT7N
OUT7P
OVDD
OUT6N
AVDD
AVDD
CVDD
CLK
GND
AVDD
AVDD
AVDD
AVDD
SLVS/LVDS
IN7N
GND
N.C.
DT
GND
IN7P
GND
26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50
TQFP
14mm x 14mm x 1mm
Chip Information
PROCESS: BiCMOS
22
______________________________________________________________________________________
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
PACKAGE TYPE
PACKAGE CODE
OUTLINE NO.
LAND PATTERN NO.
100 TQFP-EP
C100E+2
21-0116
90-0153
______________________________________________________________________________________
23
MAX1436B
Package Information
For the latest package outline information and land patterns (footprints), go to www.maxim-ic.com/packages. Note that a "+", "#", or
"-" in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
MAX1436B
Octal, 12-Bit, 40Msps, 1.8V ADC
with Serial LVDS Outputs
Revision History
REVISION
NUMBER
REVISION
DATE
0
3/06
Initial release
2/11
Updated Ordering Information, added new Package Thermal Characteristics section,
and fixed errors in Electrical Characteristics table
1
DESCRIPTION
PAGES
CHANGED
—
1–5
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implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
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© 2011 Maxim Integrated Products
Springer
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