AD ADP3051

500 mA PWM Step-Down DC-DC with
Synchronous Rectifier
ADP3051
FEATURES
GENERAL DESCRIPTION
Current mode control for simple loop compensation
Input voltage range: 2.7 V to 5.5 V
Output voltage range: 0.8 V to 5.5 V
Tri-Mode™ operation for high efficiency
550 kHz PWM operating frequency
High accuracy over line, load, and temperature
Micropower shutdown mode
Space-saving MSOP-8 package
The ADP3051 is a low noise, current mode, pulse width modulator (PWM) step-down converter capable of supplying over
500 mA to output voltages as low as 0.8 V. This device integrates
a low resistance power switch and synchronous rectifier, providing excellent efficiency over the entire output voltage range and
eliminating the need for a large and costly external Schottky
rectifier. Its 550 kHz switching frequency permits the use of
small external components.
APPLICATIONS
Current mode control and external compensation allow the
regulator to be easily optimized for a wide range of operating
conditions. The ADP3051 operates at a constant 550 kHz
frequency at medium to heavy loads; it smoothly transitions
into Tri-Mode operation to save power at light loads. A pincontrolled micropower shutdown mode is also included.
Li-ion powered handhelds
MP3 players
PDAs and palmtops
Consumer electronics
The ADP3051’s 2.7 V to 5.5 V input operating range makes it
ideal for both battery-powered applications as well as those with
3.3 V or 5 V supply buses. It is available in a space-saving, 8-lead
MSOP package.
TYPICAL APPLICATION CIRCUIT
ADP3051
VIN 3.3V
10µF
IN
7
SHDN
6
COMP
12.5kΩ
FB
10kΩ
10µF
5
10kΩ
27pF
PGND
GND
2
8
04768-0-001
270pF
VOUT 1.8V
10µH
SW 3
4
Figure 1.
Rev. 0
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infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
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registered trademarks are the property of their respective owners.
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Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703
© 2004 Analog Devices, Inc. All rights reserved.
ADP3051
TABLE OF CONTENTS
Specifications..................................................................................... 3
Undervoltage Lockout (UVLO) ............................................... 10
Absolute Maximum Ratings............................................................ 4
Short-Circuit Protection and Recovery................................... 10
ESD Caution.................................................................................. 4
Applications..................................................................................... 11
Pin Configuration and Function Descriptions............................. 5
Recommended Components .................................................... 11
Typical Performance Characteristics ............................................. 6
Design Procedure ....................................................................... 11
Theory of Operation ........................................................................ 9
Output Capacitor Selection....................................................... 12
PWM Control Mode .................................................................... 9
Circuit Board Layout Considerations...................................... 13
Tri-Mode Operation..................................................................... 9
Outline Dimensions ....................................................................... 15
100% Duty Cycle Operation ..................................................... 10
Ordering Guide .......................................................................... 15
Shutdown..................................................................................... 10
REVISION HISTORY
6/04—Revision 0: Initial Version
Rev. 0 | Page 2 of 16
ADP3051
SPECIFICATIONS1
VIN = 3.6 V @ TA = –40°C to +85°C, unless otherwise noted.
Table 1.
Parameter
SUPPLY
Input Voltage Range
Quiescent Supply Current
Shutdown Supply Current
PWM COMPARATOR
Minimum Duty Ratio
Maximum Duty Ratio
OSCILLATOR
Oscillator Frequency
Foldback Frequency
OUTPUT STAGE
On Resistance, N Channel
Switch Leakage Current, N Channel
On Resistance, P Channel
Switch Leakage Current, P Channel
Current Limit Threshold
ERROR AMPLIFIER
Feedback Regulation Voltage
Feedback Input Bias Current
Current Sense Gain
Transconductance
Maximum Sink Current
Maximum Source Current
UNDERVOLTAGE LOCKOUT
Undervoltage Lockout Threshold
Undervoltage Lockout Hysteresis
SHDN INPUT THRESHOLD VOLTAGES
Input High Threshold Voltage
Input Low Threshold Voltage
1
Conditions
Min
Typ
Max
Unit
180
10
5.5
300
25
V
µA
µA
2.7
VFB = 1.0 V
SHDN = 0 V
0
100
VCOMP ≥ 1.5 V, VOUT = 0.7 V
VOUT < 0.3 V
410
ISW = 150 mA
VIN = 5.0 V, VSW = 0 V
FB = GND
VSW = 5.0 V
680
TA = 25°C
783
770
550
200
150
1
190
1
1000
800
%
%
690
1320
1.9
mV
mV
nA
Ω
mS
µA
µA
2.6
V
mV
−0.5
V
V
55
Referenced to IN
0.4
All limits at temperature extremes are guaranteed via correlation using standard statistical quality control (SQC).
Rev. 0 | Page 3 of 16
mΩ
µA
mΩ
µA
mA
821
830
5
2.9
0.32
33
33
VIN rising
kHz
kHz
ADP3051
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
IN, SHDN, COMP, SW, FB to GND
SW to IN
PGND to GND
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
θJA, 2-Layer (SEMI standard board)
θJA, 4-Layer (JEDEC standard board)
Lead Temperature Range
Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
Rating
–0.3 V to +6 V
–6 V to +0.3 V
–0.3 V to +0.3 V
–40°C to +85°C
–40°C to +125°C
–65°C to +150°C
159°C/W
116°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any
other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability. Absolute maximum ratings apply individually
only, not in combination. Unless otherwise specified, all other
voltages are referenced to GND.
300°C
215°C
220°C
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or
loss of functionality.
Rev. 0 | Page 4 of 16
ADP3051
NC 1
PGND 2
ADP3051
8
GND
7
SHDN
TOP VIEW 6 COMP
(Not to Scale)
5 FB
IN 4
SW 3
04768-0-021
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 2. 8-Lead MSOP Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1
2
Mnemonic
NC
PGND
3
SW
4
IN
5
FB
6
COMP
7
SHDN
8
GND
Description
No Connect. Not internally connected.
Power Ground. Connect PGND to GND at a single point. Use separate power ground and quiet ground planes for
the power and sensitive analog circuitry, respectively. See the Circuit Board Layout Considerations section.
Switching Output. SW connects to the drain of the internal power switch and synchronous rectifier. Connect the
output inductor between SW and the load.
Power Source Input. IN is the source of the high side P-channel MOSFET switch, and supplies the internal power to
the ADP3051. Bypass IN to GND with a 0.1 µF or greater ceramic capacitor, placed as close as possible to IN.
Feedback Voltage Sense Input. FB senses the output voltage. To set the output voltage, connect a resistive voltage divider from the output voltage to FB. The feedback threshold is 0.8 V. See the Setting the Output Voltage
section.
Feedback Loop Compensation Node. COMP is the output of the internal transconductance error amplifier. Place a
series RC network from COMP to GND to compensate the regulator. See the Compensation Design section.
Shutdown Input. Drive SHDN low to turn off the ADP3051; drive SHDN to within 0.5 V of VIN to turn on the
ADP3051. See the Shutdown section.
Ground.
Rev. 0 | Page 5 of 16
ADP3051
TYPICAL PERFORMANCE CHARACTERISTICS
VIN = 3.6V, VOUT = 3.3V, circuit of Figure 20, component values of Table 4, TA = 25°C, unless otherwise specified.
100
0.5
0.4
VIN = 3.6V
0.3
OUTPUT ACCURACY (%)
90
EFFICIENCY (%)
VIN = 5.5V
80
VOUT = 3.3V
L = 22µH
70
60
VOUT = 2.5V
VIN = 3.6V
0.2
0.1
0
–0.1
–0.2
–0.3
50
1
10
100
1000
ILOAD (mA)
–0.5
04768-0-002
40
0
200
300
400
500
ILOAD (mA)
Figure 6. Output Voltage Error vs. Load Current
Figure 3. Output Efficiency vs. Load Current, VOUT = 3.3 V
100
600
VIN = 2.7V
580
FREQUENCY (kHz)
90
80
VIN = 3.6V
70
VOUT = 2.5V
L = 22µH
COUT = 22µF
60
VIN = 2.7V
560
VIN = 5.5V
VIN = 3.6V
540
520
VIN = 5.5V
VOUT = 1.2V
ILOAD = 500mA
50
500
1
10
100
1000
ILOAD (mA)
480
–40
04768-0-003
40
–15
10
35
60
85
TEMPERATURE (°C)
Figure 4. Output Efficiency vs. Load Current, VOUT = 2.5 V
04768-0-006
EFFICIENCY (%)
100
04768-0-005
–0.4
Figure 7. Oscillator Frequency vs. Temperature
100
600
550
VIN = 5.5V
70
VOUT = 1.2V
L = 10µH
COUT = 22µF
60
50
450
400
350
300
250
200
150
100
1
10
100
1000
ILOAD (mA)
Figure 5. Output Efficiency vs. Load Current, VOUT = 1.2 V
0
0
100
200
300
400
500
ILOAD (mA)
Figure 8. Oscillator Frequency vs. Load Current, VIN = 3.6 V, VOUT = 1.2 V
Rev. 0 | Page 6 of 16
04768-0-007
50
40
04768-0-004
EFFICIENCY (%)
VIN = 2.5V
80
500
OSCILLATOR FREQUENCY (kHz)
VIN = 3.6V
90
Figure 12. Load Transient Response
04768-0-009
Figure 9. Start-Up Behavior
CH2 = IL (100mA/DIV), CH4 = SW
VIN = 3.6V, VOUT = 2.5V, L = 22µH, IOUT = 50mA
04768-0-011
CH1 = COMP, CH3 = VOUT, CH4 = ILOAD (50mA TO 490mA)
VIN = 3.6V, VOUT = 2.5V, COUT = 22µF, CC = 150pF, RC = 100kΩ
04768-0-012
CH1 = VIN, CH2 = SW, CH3 = VOUT, CH4 = IL (1A/DIV)
VIN = 3.6V, VOUT = 1.2V, ILOAD = 500mA
04768-0-008
ADP3051
CH1 = VIN, CH2 = VOUT
VIN = 3V TO 4V, VOUT = 2.5V, ILOAD = 500mA
Figure 13. Line Transient Response
Figure 10. Light Load Switching Waveforms
210
200
190
PMOS
RDSON (mΩ)
180
170
VOUT = 2.5V
IOUT = 500mA
160
150
NMOS
140
130
110
2.7
3.1
3.5
3.9
4.3
4.7
5.1
SUPPLY VOLTAGE (V)
Figure 14. Switch On Resistance vs. Input Voltage
Figure 11. Heavy Load Switching Waveforms
Rev. 0 | Page 7 of 16
5.5
04768-0-013
CH2 = IL (500mA/DIV), CH4 = SW
VIN = 3.6V, VOUT = 2.5V, L = 22µH, IOUT = 500mA
04768-0-010
120
ADP3051
240
1200
TA = +85°C
220
1150
160
CURRENT LIMIT (A)
TA = +25°C
180
TA = –40°C
140
120
VOUT = 1.2V
ILOAD = 0mA
100
1050
VIN = 3.6V
1000
950
VIN = 2.7V
900
850
VOUT = 1.2V
800
80
3.1
3.5
3.9
4.3
4.7
5.1
SUPPLY VOLTAGE (V)
5.5
700
–40
–15
10
35
60
TEMPERATURE (°C)
Figure 16. Current Limit vs. Input Voltage, VOUT = 1.2 V
Figure 15. Quiescent Current vs. Input Voltage
Rev. 0 | Page 8 of 16
85
04768-0-015
750
04768-0-014
SUPPLY CURRENT (µA)
200
60
2.7
VIN = 5.5V
1100
ADP3051
THEORY OF OPERATION
The ADP3051 is a monolithic current mode buck converter
with an integrated high-side switch and low-side synchronous
rectifier. It operates with input voltages between 2.7 V and 5.5 V,
regulates an output voltage down to 0.8 V, and supplies more
than 500 mA of load current. The ADP3051 features patented
Tri-Mode technology to operate in fixed frequency PWM mode
at medium to heavy loads. This improves light-load efficiency
by smoothly transitioning into a variable frequency PWM
mode, and into a single-pulse, current-limited variable
frequency mode at very light loads.
COMP, which sets inductor peak current. The error amplifier,
and thus the output voltage, controls the inductor peak current
to regulate the output voltage. An internally generated slope
compensation circuit ensures that the inner current control
loop maintains stable operation over the entire input and output
voltage range.
TRI-MODE OPERATION
The ADP3051 features patented Tri-Mode technology which
allows fixed-frequency, current mode, PWM operation at
medium and heavy loads; smoothly transitions to variable
frequency PWM operation to improve light-load efficiency; and
operates in a single-pulse, current-limited variable frequency
mode at very light loads. These three modes work together to
provide high efficiency over a wide range of load current conditions without the frequency jitter, increased output voltage
ripple, and audible noise generation exhibited by other lightload control schemes.
PWM CONTROL MODE
At moderate to high output currents, the ADP3051 operates
in a fixed frequency, peak current control mode to regulate the
output voltage. At the beginning of each cycle, the P-channel
output switch turns on and remains on until the inductor current exceeds the threshold set by the voltage at COMP. When
the P-channel switch turns off, the N-channel synchronous
rectifier turns on for the remainder of the cycle, after which the
cycle repeats.
The ADP3051’s internal oscillator is a key component of its
Tri-Mode operation. Under medium-heavy load conditions, the
oscillator operates at a constant 550 kHz. Under light-load
conditions, the oscillator frequency is decreased to minimize
switching losses, thus improving light-load efficiency. At very
light loads, the oscillator is disabled and the ADP3051 switches
only as required to supply the load current for good light-load
efficiency.
In current mode, two cascaded control loops combine to regulate the output voltage. The outer voltage control loop senses the
voltage at FB and compares it to the internal 0.8 V reference.
The internal transconductance amplifier forces a current at
COMP proportional to the voltage difference between the reference and FB. By selecting the components between COMP and
GND, the frequency characteristics of the control system give a
stable regulation system.
In addition to Tri-Mode operation, the ADP3051 operates in the
200 kHz frequency foldback mode when the voltage at FB is
below 0.3 V for enhanced control of the inductor current under
short-circuit and startup conditions. See the Short-Circuit Protection and Recovery section.
The inner peak-current control loop monitors the current flowing through the P-channel MOSFET and converts that to a
voltage. This voltage is internally compared to the voltage at
4 IN
SHDN 7
0.4V
FREQUENCY
FOLDBACK
COMPARATOR
CONTROL
LOGIC
VOLTAGE
REFERENCE
UVLO
CURRENT
SENSE
OSCILLATOR
PWM
COMPARATOR
COMP 6
S
ERROR
AMPLIFIER
FB 5
Q
GATE
DRIVERS
3 SW
R
ADP3051
0.8V
1
NC
8
GND
Figure 17. Simplified Block Diagram
Rev. 0 | Page 9 of 16
2 PGND
04768-0-016
gm
ADP3051
100% DUTY CYCLE OPERATION
UNDERVOLTAGE LOCKOUT (UVLO)
The ADP3051 is capable of operating at 100% duty cycle, allowing it to regulate output voltages that are very close to the input
voltage. In 100% duty cycle operation, the P-channel switch
remains continuously on, and the dropout voltage is simply the
output current multiplied by the on resistance of the internal
switch and inductor, typically 200 mV at full loads (500 mA).
The ADP3051 includes an internal undervoltage lockout
(UVLO) circuit that turns off the converter if the input
voltage drops below the 2.2 V UVLO threshold. This prevents
uncontrolled behavior if the input voltage drops below the 2.7 V
minimum allowable voltage range. The UVLO circuit includes
55mV of hysteresis to prevent oscillation at the UVLO
threshold.
SHUTDOWN
The ADP3051 is enabled and disabled via its SHDN input.
SHDN easily interfaces to open-drain and three-state logic
GPIOs. To enable the ADP3051, drive SHDN to within 0.5 V of
the voltage at IN; to disable the ADP3051, drive SHDN below
0.4 V. The circuit of Figure 18 shows a simple means of driving
SHDN to the proper high and low input states in cases where no
open-drain or three-state GPIO is available.
SHORT-CIRCUIT PROTECTION AND RECOVERY
When starting up or when the output is short circuited, the low
voltage drop across the synchronous rectifier may allow the
inductor current to run away because it rises more during the
on time than it falls during the off time. To protect against this,
the ADP3051 automatically initiates a frequency foldback
operation when the voltage at FB drops below 0.3 V, allowing
the ADP3051 to maintain control of the inductor current under
these conditions.
IN
When operating at higher input voltages (for example, from a
5 V bus), the ADP3051 may exhibit output voltage overshoot
upon startup or after release of an overload condition (see
Figure 9). In such cases, the ADP3051’s limited COMP slew rate
can slow its recovery as the output approaches regulation,
allowing the output voltage to overshoot. If overshoot cannot be
tolerated in an application, the COMP voltage can be limited by
placing a Zener diode from COMP to GND, as shown in Figure 19.
100kΩ
SHDN
ADP3051
04768-0-017
SHDN
CONTROL
COMP 6
Figure 18. Shutdown Control Circuit
ADP3051
04768-0-023
CMPZ4683-ADC
Figure 19. COMP Zener Clamp to Prevent
Short-Circuit Recovery Output Voltage Overshoot
Rev. 0 | Page 10 of 16
ADP3051
APPLICATIONS
RECOMMENDED COMPONENTS
External component selection for the application circuit shown
in Figure 20 depends on the load current requirements. Certain
tradeoffs between different performance parameters can also be
made. Recommended external component values are given in
Table 4.
ADP3051
VIN
CIN
4
IN
7
SHDN
VOUT
RA
8
RB
COMP 6
GND
⎛V
⎞
RA = RB ⎜ OUT − 1⎟
V
FB
⎝
⎠
RC
PGND
VFB
RB
For a given RB, choose the value of RA to set the output voltage
by the equation
COUT
FB 5
I DIV =
Using higher divider current increases accuracy due to the 5 nA
FB input bias current. With RB = 100 kΩ, the accuracy is
degraded by 0.0625%.
L
SW 3
Where VOUT is the output voltage and VFB is the 0.8 V feedback
regulation threshold. RB controls the voltage divider current,
IDIV, which is calculated by
C2
2
C1
04768-0-018
VOUT
ADP3051
RA
5
FB
Figure 20. Typical Application Circuit
gm
DESIGN PROCEDURE
6
COMP
RB
REF
For applications where specific performance is required, component combinations other than those listed in Table 4 may be
more appropriate. A design procedure for selecting the components is provided in the following sections.
RC
ERROR
AMPLIFIER
C2
04768-0-019
C1
Setting the Output Voltage
The regulated output voltage of the ADP3051 is set by selecting
the resistive voltage divider formed by RA and RB (see
Figure 21). The voltage divider drops the output voltage to the
voltage at FB by the equation
Figure 21. Typical Compensation Network
⎛ R ⎞
VOUT = VFB ⎜1 + A ⎟
RB ⎠
⎝
Table 4. Recommended External Components for Popular Input/Output Voltage Conditions
(Based on ILOAD = 500 mA Max and a 60 kHz Crossover Frequency)
VIN
2.5
3.6
5.0
VOUT
1.0
1.8
1.0
1.8
2.5
1.0
1.8
2.5
3.3
L (µH)
6.8
6.8
6.8
8.2
8.2
8.2
10
10
12
COUT (µF)
10
10
10
10
10
10
10
10
10
CIN (µF)
10
10
10
10
10
10
10
10
10
RA (kΩ)
2.5
12.5
2.5
12.5
21.3
2.5
12.5
21.3
31.3
Rev. 0 | Page 11 of 16
RB (kΩ)
10
10
10
10
10
10
10
10
10
RC (kΩ)
4.7
10
4.7
10
15
5.7
10
15
18
C1 (pF)
470
270
470
270
180
470
270
180
150
C2 (pF)
47
27
47
27
18
47
27
18
15
ADP3051
Inductor Selection
The ADP3051’s high switching frequency allows the use of a
physically small inductor. The inductor ripple current is determined by
∆I L =
VOUT × (VIN − VOUT )
VIN × f SW × L
Where ∆IL is the peak-to-peak inductor ripple current and fSW is
the switching frequency. As a guideline, the inductor peak-topeak current ripple is typically set to be one-third the maximum
dc load current. Using this guideline and solving for L,
3 × VOUT × (VIN − VOUT )
L=
VIN × f SW × I LOAD ( MAX )
Simplifying for the known constants
L = 5 μH ×
VOUT × (VIN − VOUT )
VIN × I LOAD( MAX )
⎛ ∆I ⎞
I LPK = I LOAD ( MAX ) + ⎜ L ⎟
⎝ 2 ⎠
VOUT
320 mA / μs
The output capacitor should be chosen to meet output voltage
ripple requirements for the application. Output voltage ripple is
a function of the inductor ripple current and the impedance of
the output capacitor at the switching frequency. The magnitude
of the capacitive impedance is
1
2π × COUT × f SW
∆I L
8 f SW ∆VOUT
Multilayer ceramic (MLC), tantalum, OS-CON, or similar low
ESR capacitors are recommended. Table 5 lists some vendors
that make suitable capacitors.
Manufacturer
AVX
Murata
Sanyo
Taiyo-Yuden
Capacitor Type
Tantalum
MLCC
OS-CON
MLCC
Contact Info
www.avxcorp.com
www.murata.com
www.sanyovideo.com
www.t-yuden.com
The input capacitor reduces input voltage ripple caused by
switch currents. Select an input capacitor capable of withstanding the rms input current
I CIN ( RMS ) ≥ I LOAD( MAX )
VOUT (VIN − VOUT )
VIN
Compensation Design
The ADP3051’s external compensation network allows designers to easily optimize the part’s performance for a particular
application with just a series RC network (RC and C1 of
Figure 21) from COMP to GND typically required to
compensate the regulator.
The dc loop gain is given by the equation
For capacitors with relatively large capacitance or high
equivalent series resistance (ESR), e.g., tantalum or electrolytic
capacitors, the ESR dominates the impedance at the switching
frequency; therefore, the output ripple voltage is mainly a function of ESR. In this case, the output capacitor should be chosen
based on the ESR by the equation
VRIPPLE
∆I L
C OUT ≥
Where ICIN(RMS) is the rms ripple rating of the input capacitor. As
with the output capacitor, a low ESR capacitor is recommended
to help to minimize input voltage ripple.
OUTPUT CAPACITOR SELECTION
ESRCOUT ≤
(2π × f SW )2 × L × VRIPPLE
Input Capacitor Selection
Finally, the ADP3051’s internal slope compensation is designed
to ensure stability of the inner current mode control loop when
the inductor is chosen so that the down-slope of the inductor
current is less than 320 mA/µs
X COUT =
VIN
COUT ≥
Table 5. Capacitor Suppliers
It is important to ensure that the inductor is capable of handling
the maximum peak inductor current, ILPK, determined by
L≥
Where VRIPPLE is the peak-to-peak output ripple voltage and
ESRCOUT is the output capacitor ESR. For capacitors with relatively small capacitance and/or resistance, the capacitance
dominates the output voltage ripple. In this case, choose the
output capacitor by the capacitance using the equation
AVDC =
VFB × G EA × ROEA × RLOAD
VOUT × RCS
where:
VFB is the feedback voltage regulation threshold, 0.8 V.
GEA is the error amplifier transconductance, 320 µs.
ROEA is the error amplifier output impedance (10 MΩ).
RCS is the 2.9 Ω current sense gain.
RLOAD is the equivalent output resistance, equal to the output
voltage divided by the load current.
Rev. 0 | Page 12 of 16
ADP3051
The system has three poles and a zero that dominate its frequency response. The first compensation pole is given by
f PC1 =
CIRCUIT BOARD LAYOUT CONSIDERATIONS
A good circuit board layout aids in extracting the most
performance from the ADP3051. Poor circuit layout degrades
the output ripple and the electromagnetic interference (EMI) or
electromagnetic compatibility (EMC) performance.
1
2π × ROEA × C1
The output pole is given by
f POUT =
The evaluation board layout of Figure 24 is optimized for the
ADP3051. Use this layout for best performance. If this layout
needs changing, use the following guidelines:
1
2π × RLOAD × COUT
If used, the optional second compensation pole is given by
f PC 2 =
1.
Use separate analog and power ground planes. Connect the
sensitive analog circuitry (such as compensation and voltage divider components) to analog ground; connect the
power components (such as input and output bypass
capacitors) to power ground. Connect the two ground
planes together near the load to reduce the effects of
voltage dropped on circuit board traces.
2.
Locate CIN as close to the IN pin as possible, and use separate input bypass capacitors for the analog and power
grounds indicated in Guideline 1.
3.
Route the high current path from CIN, through L, to the SW
and PGND pins as short as possible.
4.
Route the high current path from CIN through L and COUT
as short as possible.
5.
Keep high current traces as short and as wide as possible.
6.
Place the feedback resistors as close as possible to the FB
pin to prevent noise pickup.
7.
Place the compensation components as close as possible to
the COMP pin.
8.
Avoid routing high impedance traces, such as FB and
COMP, near the high current traces and components or
near the switch node (SW).
9.
If high impedance traces are routed near high current
and/or the SW node, place a ground plane shield between
the traces.
1
2π × RC × C 2
Finally, the zero can be calculated as
f ZC =
1
2π × RC × C1
Note that the dc loop gain is the inverse of the output load
current, while the output pole, fPOUT, is proportional to the load
current. Thus, the crossover frequency, which is proportional to
the product of the dc loop gain and the output pole frequency,
remains the same.
To choose the compensation components, first choose the
regulator loop crossover frequency (the frequency where the
loop gain drops to 1 V/V or 0 dB). To determine the desired
crossover frequency, chose it for about one-tenth of the switching frequency or 60 kHz. The required compensation resistor,
RC, can be determined from the equation
RC =
2π × f C × VOUT × RCS × COUT
VREF × G EA
Where fC is the crossover frequency. To make sure the phase
margin is suitable, choose the first compensation capacitor to
set the zero frequency to one-fourth the crossover frequency, or
C1 =
4
2π × f C × RC
An optional second compensation capacitor reduces the high
frequency gain to reduce the high frequency noise. If used,
choose the second compensation capacitor to set the second
compensation pole to the switching frequency, or
C2 =
1
2π × f SW × RC
Rev. 0 | Page 13 of 16
04768-0-024
04768-0-025
ADP3051
Figure 24. Sample Application Circuit Board Layout (Bottom Layer)
04768-0-026
Figure 22. Sample Application Circuit Board Layout (Silkscreen Layer)
Figure 23. Sample Application Circuit Board Layout (Top Layer)
Rev. 0 | Page 14 of 16
ADP3051
OUTLINE DIMENSIONS
3.00
BSC
8
5
4.90
BSC
3.00
BSC
4
PIN 1
0.65 BSC
1.10 MAX
0.15
0.00
0.38
0.22
COPLANARITY
0.10
0.23
0.08
8°
0°
0.80
0.60
0.40
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 25. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
ADP3051ARMZ-REEL71
1
Temperature Range
–40°C to +85°C
Package Description
8-Lead Mini Small Outline Package [MSOP]
Z = Pb-free part.
Rev. 0 | Page 15 of 16
Package Outline
RM-8
Branding
P3A
ADP3051
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners.
D04768–0–6/04(0)
Rev. 0 | Page 16 of 16